JPS57159035A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS57159035A
JPS57159035A JP56044556A JP4455681A JPS57159035A JP S57159035 A JPS57159035 A JP S57159035A JP 56044556 A JP56044556 A JP 56044556A JP 4455681 A JP4455681 A JP 4455681A JP S57159035 A JPS57159035 A JP S57159035A
Authority
JP
Japan
Prior art keywords
electrode
film
bonding
substrate
silicon film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56044556A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6227734B2 (2
Inventor
Akira Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Yamagata Ltd
Original Assignee
NEC Yamagata Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Yamagata Ltd filed Critical NEC Yamagata Ltd
Priority to JP56044556A priority Critical patent/JPS57159035A/ja
Publication of JPS57159035A publication Critical patent/JPS57159035A/ja
Publication of JPS6227734B2 publication Critical patent/JPS6227734B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

  • Wire Bonding (AREA)
JP56044556A 1981-03-26 1981-03-26 Manufacture of semiconductor device Granted JPS57159035A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56044556A JPS57159035A (en) 1981-03-26 1981-03-26 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56044556A JPS57159035A (en) 1981-03-26 1981-03-26 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS57159035A true JPS57159035A (en) 1982-10-01
JPS6227734B2 JPS6227734B2 (2) 1987-06-16

Family

ID=12694768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56044556A Granted JPS57159035A (en) 1981-03-26 1981-03-26 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57159035A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5886733A (ja) * 1981-11-18 1983-05-24 Nec Corp 半導体装置
JPS6237934U (2) * 1985-08-27 1987-03-06
JPH01220850A (ja) * 1988-02-29 1989-09-04 Sharp Corp 半導体装置の電極構造

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5239378A (en) * 1975-09-23 1977-03-26 Seiko Epson Corp Silicon-gated mos type semiconductor device
JPS54107260A (en) * 1978-02-10 1979-08-22 Nec Corp Semiconductor device
JPS56105670A (en) * 1980-01-28 1981-08-22 Mitsubishi Electric Corp Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5239378A (en) * 1975-09-23 1977-03-26 Seiko Epson Corp Silicon-gated mos type semiconductor device
JPS54107260A (en) * 1978-02-10 1979-08-22 Nec Corp Semiconductor device
JPS56105670A (en) * 1980-01-28 1981-08-22 Mitsubishi Electric Corp Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5886733A (ja) * 1981-11-18 1983-05-24 Nec Corp 半導体装置
JPS6237934U (2) * 1985-08-27 1987-03-06
JPH01220850A (ja) * 1988-02-29 1989-09-04 Sharp Corp 半導体装置の電極構造

Also Published As

Publication number Publication date
JPS6227734B2 (2) 1987-06-16

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