JPS5772349A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS5772349A
JPS5772349A JP55148770A JP14877080A JPS5772349A JP S5772349 A JPS5772349 A JP S5772349A JP 55148770 A JP55148770 A JP 55148770A JP 14877080 A JP14877080 A JP 14877080A JP S5772349 A JPS5772349 A JP S5772349A
Authority
JP
Japan
Prior art keywords
wiring
wirings
width
integrated circuit
semiconductor integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55148770A
Other languages
English (en)
Inventor
Masahide Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55148770A priority Critical patent/JPS5772349A/ja
Priority to US06/311,805 priority patent/US4467345A/en
Priority to GB8131461A priority patent/GB2088629B/en
Publication of JPS5772349A publication Critical patent/JPS5772349A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/43—Layouts of interconnections

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
JP55148770A 1980-10-23 1980-10-23 Semiconductor integrated circuit device Pending JPS5772349A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP55148770A JPS5772349A (en) 1980-10-23 1980-10-23 Semiconductor integrated circuit device
US06/311,805 US4467345A (en) 1980-10-23 1981-10-15 Semiconductor integrated circuit device
GB8131461A GB2088629B (en) 1980-10-23 1981-10-19 Improvements in semiconductor integrated circuit devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55148770A JPS5772349A (en) 1980-10-23 1980-10-23 Semiconductor integrated circuit device

Publications (1)

Publication Number Publication Date
JPS5772349A true JPS5772349A (en) 1982-05-06

Family

ID=15460262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55148770A Pending JPS5772349A (en) 1980-10-23 1980-10-23 Semiconductor integrated circuit device

Country Status (3)

Country Link
US (1) US4467345A (ja)
JP (1) JPS5772349A (ja)
GB (1) GB2088629B (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63293855A (ja) * 1987-05-26 1988-11-30 Nec Ic Microcomput Syst Ltd 半導体装置
JPS6457732A (en) * 1987-08-28 1989-03-06 Matsushita Electronics Corp Semiconductor device
US4835591A (en) * 1987-12-29 1989-05-30 Mitsubishi Denki Kabushiki Kaisha Wiring arrangement for semiconductor devices
US5101261A (en) * 1988-09-09 1992-03-31 Texas Instruments Incorporated Electronic circuit device with electronomigration-resistant metal conductors

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594050A (ja) * 1982-06-30 1984-01-10 Fujitsu Ltd 半導体装置
JPS6010645A (ja) * 1983-06-30 1985-01-19 Toshiba Corp 樹脂封止型半導体装置
JPS61193454A (ja) * 1985-02-20 1986-08-27 Mitsubishi Electric Corp 半導体装置
US5182235A (en) * 1985-02-20 1993-01-26 Mitsubishi Denki Kabushiki Kaisha Manufacturing method for a semiconductor device having a bias sputtered insulating film
US4695868A (en) * 1985-12-13 1987-09-22 Rca Corporation Patterned metallization for integrated circuits
US5212503A (en) * 1988-07-26 1993-05-18 Canon Kabushiki Kaisha Liquid jet recording head having a substrate with minimized electrode overlap
US5570119A (en) * 1988-07-26 1996-10-29 Canon Kabushiki Kaisha Multilayer device having integral functional element for use with an ink jet recording apparatus, and recording apparatus
US5289036A (en) * 1991-01-22 1994-02-22 Nec Corporation Resin sealed semiconductor integrated circuit
EP0747930B1 (en) * 1995-05-19 2000-09-27 STMicroelectronics S.r.l. Electronic device with multiple bonding wires, method of fabrication and method of testing bonding wire integrity
JP3123450B2 (ja) * 1996-11-26 2001-01-09 日本電気株式会社 半導体装置およびその製造方法
US6555910B1 (en) * 2000-08-29 2003-04-29 Agere Systems Inc. Use of small openings in large topography features to improve dielectric thickness control and a method of manufacture thereof
KR100410990B1 (ko) * 2001-02-20 2003-12-18 삼성전자주식회사 다층배선을 갖는 반도체 장치 및 그의 제조방법
US7863746B2 (en) * 2001-02-20 2011-01-04 Mosaid Technologies Incorporated Semiconductor device having metal lines with slits
JP4626919B2 (ja) * 2001-03-27 2011-02-09 ルネサスエレクトロニクス株式会社 半導体装置
CN1267780C (zh) * 2002-11-11 2006-08-02 Lg.飞利浦Lcd有限公司 用于液晶显示器的阵列基板及其制造方法
US6818996B2 (en) * 2002-12-20 2004-11-16 Lsi Logic Corporation Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumps
WO2005048314A2 (en) * 2003-11-12 2005-05-26 Silicon Pipe, Inc. Tapered dielectric and conductor structures and applications thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54133090A (en) * 1978-04-07 1979-10-16 Cho Lsi Gijutsu Kenkyu Kumiai Semiconductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3632433A (en) * 1967-03-29 1972-01-04 Hitachi Ltd Method for producing a semiconductor device
US3620837A (en) * 1968-09-16 1971-11-16 Ibm Reliability of aluminum and aluminum alloy lands
NL163370C (nl) * 1972-04-28 1980-08-15 Philips Nv Werkwijze voor het vervaardigen van een halfgeleider- inrichting met een geleiderpatroon.
US4109275A (en) * 1976-12-22 1978-08-22 International Business Machines Corporation Interconnection of integrated circuit metallization
JPS5444881A (en) * 1977-09-16 1979-04-09 Nec Corp Electrode wiring structure of integrated circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54133090A (en) * 1978-04-07 1979-10-16 Cho Lsi Gijutsu Kenkyu Kumiai Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63293855A (ja) * 1987-05-26 1988-11-30 Nec Ic Microcomput Syst Ltd 半導体装置
JPS6457732A (en) * 1987-08-28 1989-03-06 Matsushita Electronics Corp Semiconductor device
US4835591A (en) * 1987-12-29 1989-05-30 Mitsubishi Denki Kabushiki Kaisha Wiring arrangement for semiconductor devices
US5101261A (en) * 1988-09-09 1992-03-31 Texas Instruments Incorporated Electronic circuit device with electronomigration-resistant metal conductors

Also Published As

Publication number Publication date
US4467345A (en) 1984-08-21
GB2088629B (en) 1984-09-26
GB2088629A (en) 1982-06-09

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