JPS5811247U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5811247U
JPS5811247U JP1981104512U JP10451281U JPS5811247U JP S5811247 U JPS5811247 U JP S5811247U JP 1981104512 U JP1981104512 U JP 1981104512U JP 10451281 U JP10451281 U JP 10451281U JP S5811247 U JPS5811247 U JP S5811247U
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor chip
active region
utility
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981104512U
Other languages
English (en)
Inventor
坂根　英生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1981104512U priority Critical patent/JPS5811247U/ja
Publication of JPS5811247U publication Critical patent/JPS5811247U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の樹脂封止形半導体装置の一例の構造を示
す断面図、第２図はこの考案の一実施例の構造を示す断
面図である。 図において、１ａはリードフレーム、３ａは半導体チッ
プ、５は封止樹脂、６はバンプ、７は保護部（リードフ
レームの一部）である。なお、図中同一符号は同一また
は相当部分を示す。

Claims (2)

    【実用新案登録請求の範囲】
  1. （１）半導体チップをフェースダウンの状態で上記半導
    体チップの電極部に形成されたバンプを介してリードフ
    レームの外部引出しリード部に直接ボンディングすると
    ともに、上記リードフレームの一部からなる保護部が上
    記半導体チップの能動領域が存在する側の表面を所定距
    離へだてて覆うようにしたのち、所要の樹脂封止を施し
    てなることを特徴とする半導体装置。
  2. （２）　　リードフレームの一部からなる保護部と半導
    体チップの能動領域が存在する表面との間に液状体を介
    挿させ空間α粒子の影響を軽減するようにしたことを特
    徴とする実用新案登録請求の範囲第１項記載の半導体装
    置。
JP1981104512U 1981-07-13 1981-07-13 半導体装置 Pending JPS5811247U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981104512U JPS5811247U (ja) 1981-07-13 1981-07-13 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981104512U JPS5811247U (ja) 1981-07-13 1981-07-13 半導体装置

Publications (1)

Publication Number Publication Date
JPS5811247U true JPS5811247U (ja) 1983-01-25

Family

ID=29899098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981104512U Pending JPS5811247U (ja) 1981-07-13 1981-07-13 半導体装置

Country Status (1)

Country Link
JP (1) JPS5811247U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60171733A (ja) * 1984-02-17 1985-09-05 Hitachi Micro Comput Eng Ltd 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60171733A (ja) * 1984-02-17 1985-09-05 Hitachi Micro Comput Eng Ltd 半導体装置

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