JPS5840842U - 半導体装置製造装置 - Google Patents

半導体装置製造装置

Info

Publication number
JPS5840842U
JPS5840842U JP1981136994U JP13699481U JPS5840842U JP S5840842 U JPS5840842 U JP S5840842U JP 1981136994 U JP1981136994 U JP 1981136994U JP 13699481 U JP13699481 U JP 13699481U JP S5840842 U JPS5840842 U JP S5840842U
Authority
JP
Japan
Prior art keywords
semiconductor device
device manufacturing
manufacturing equipment
leads
collet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981136994U
Other languages
English (en)
Other versions
JPS638129Y2 (ja
Inventor
細見　裕
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1981136994U priority Critical patent/JPS5840842U/ja
Publication of JPS5840842U publication Critical patent/JPS5840842U/ja
Application granted granted Critical
Publication of JPS638129Y2 publication Critical patent/JPS638129Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図はリードフレームの一例を示す平面図、第２図は
ペレットマウント装置の一例を示す概略断面図、第３図
は第２図のＡ−Ａに沿う拡大断面図、第４図は第３図の
ペレットマウント動作時の断面図、第５図はワイヤボン
ディング後のリードフレーム断面図、第６図及び第７図
は本考案の第１実施例を示す各動作時の要部断面図、第
８図は第６図のコレットの斜視図、第９図及び第１０図
は本考案の第２実施例を示す各動作時での要部断面図、
第１１曲は第９図のコレットの斜視図である。 ２・・・リード、３・・・被ペレットマウント基板（放
熱板）、１２・・・半導体ペレット、１９・・・コレッ
ト、　　・２０・・・保護板、２２・・・コレット、２
３・・・保護板。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金メッキを施したリードを近傍に有する被ペレットマウ
    ント基板上に半導体ペレットをコレットで吸着してマウ
    ントする装置であって、ペレットマウント時にリードと
    被ペレットマウン！・基板の間に介在してリード上面を
    保護する保護板をコレット側に取付けたことを特徴とす
    る半導体装置製造装置。
JP1981136994U 1981-09-14 1981-09-14 半導体装置製造装置 Granted JPS5840842U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981136994U JPS5840842U (ja) 1981-09-14 1981-09-14 半導体装置製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981136994U JPS5840842U (ja) 1981-09-14 1981-09-14 半導体装置製造装置

Publications (2)

Publication Number Publication Date
JPS5840842U true JPS5840842U (ja) 1983-03-17
JPS638129Y2 JPS638129Y2 (ja) 1988-03-10

Family

ID=29930294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981136994U Granted JPS5840842U (ja) 1981-09-14 1981-09-14 半導体装置製造装置

Country Status (1)

Country Link
JP (1) JPS5840842U (ja)

Also Published As

Publication number Publication date
JPS638129Y2 (ja) 1988-03-10

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