JPS6076045U - 樹脂封止半導体装置 - Google Patents

樹脂封止半導体装置

Info

Publication number
JPS6076045U
JPS6076045U JP1983166942U JP16694283U JPS6076045U JP S6076045 U JPS6076045 U JP S6076045U JP 1983166942 U JP1983166942 U JP 1983166942U JP 16694283 U JP16694283 U JP 16694283U JP S6076045 U JPS6076045 U JP S6076045U
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
encapsulated semiconductor
pellet
mounting substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983166942U
Other languages
English (en)
Inventor
宮沢　寿昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1983166942U priority Critical patent/JPS6076045U/ja
Publication of JPS6076045U publication Critical patent/JPS6076045U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａは従来の樹脂封止半導体装置の封止樹脂を透視
して示す平面図、同図すは同図ａのＡ−Ａ断面図、第２
図ａは本考案の一実施例の封止樹脂を透視して示す平面
図、同図すは断面図、第３　　“図は第２図に示す半導
体ペレット搭載基板と搭載ペレットを示す部分斜視図、
第４図は本考案の実施例に係る半導体素子搭載基板と搭
載ペレットを示す斜視図である。 １．１１．２１・・・・・・半導体素子搭載基板、２゜
３・・・・・・リード端子、４・・・・・・半導体ペレ
ット、５・・・・・・接続ワイヤ、６・・・・・・封止
樹脂、１２，２２・・・・・・ペレット搭載基板の曲げ
縁辺部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体ペレット搭載基板の上に半導体ペレットを搭載し
    、前記搭載基板の回路基板への取付面を外部に露出した
    まま樹脂封止した半導体装置において、前記搭載基板の
    縁辺部を前記ペレットの搭載面側に曲げ前記封止樹脂中
    に封じ込んだことを特徴とする樹脂封止半導体装置。
JP1983166942U 1983-10-28 1983-10-28 樹脂封止半導体装置 Pending JPS6076045U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983166942U JPS6076045U (ja) 1983-10-28 1983-10-28 樹脂封止半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983166942U JPS6076045U (ja) 1983-10-28 1983-10-28 樹脂封止半導体装置

Publications (1)

Publication Number Publication Date
JPS6076045U true JPS6076045U (ja) 1985-05-28

Family

ID=30365357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983166942U Pending JPS6076045U (ja) 1983-10-28 1983-10-28 樹脂封止半導体装置

Country Status (1)

Country Link
JP (1) JPS6076045U (ja)

Similar Documents

Publication Publication Date Title
JPS619840U (ja) 樹脂封止型半導体装置
JPS59117162U (ja) 樹脂封止型半導体装置
JPS5840843U (ja) 樹脂封止型半導体装置
JPS5856446U (ja) 樹脂封止半導体装置
JPS5887355U (ja) 半導体装置
JPS6033452U (ja) 樹脂封止型半導体装置
JPS6073249U (ja) 樹脂封止半導体装置
JPS6061729U (ja) 半導体装置
JPS59189242U (ja) 樹脂封止半導体装置
JPS585347U (ja) 樹脂封止型半導体装置
JPS60167345U (ja) 樹脂封止半導体装置
JPS59117166U (ja) 樹脂封止型半導体装置
JPS58177948U (ja) 樹脂封止半導体装置
JPS6027444U (ja) 樹脂封止形半導体装置
JPS6068654U (ja) 半導体装置
JPS6018556U (ja) 半導体装置
JPS6068652U (ja) 半導体装置
JPS6045444U (ja) 半導体装置
JPS59119040U (ja) 樹脂封止形半導体装置
JPS5853158U (ja) 半導体集積回路
JPS5970347U (ja) 集積回路装置
JPS6133444U (ja) 樹脂封止ｉｃ
JPS5977264U (ja) 樹脂封止型半導体装置
JPS59180449U (ja) 半導体装置
JPS6081652U (ja) 樹脂封止型半導体装置