JPS5834734U - 半導体製造装置 - Google Patents

半導体製造装置

Info

Publication number
JPS5834734U
JPS5834734U JP1981129869U JP12986981U JPS5834734U JP S5834734 U JPS5834734 U JP S5834734U JP 1981129869 U JP1981129869 U JP 1981129869U JP 12986981 U JP12986981 U JP 12986981U JP S5834734 U JPS5834734 U JP S5834734U
Authority
JP
Japan
Prior art keywords
lead wire
semiconductor manufacturing
bonding
wire
manufacturing equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981129869U
Other languages
English (en)
Inventor
武 大原
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1981129869U priority Critical patent/JPS5834734U/ja
Publication of JPS5834734U publication Critical patent/JPS5834734U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図及び第２図は半導体装置の一例を示す一部省略平
面図及びＩ−Ｉ線断面図、第３図及び第４図は従来のワ
イヤボンディング動作を説明するための要部平面図及び
■−■線断面図、第５図及び第６図は第４図におけるボ
ンディングツールによるワイヤボンディング動作を説明
するための動作時及び動作完了後の要部拡大側面図、第
７図及び第８図は本考案の実施例を示す要部平面図及び
■−■線断面図、第９図乃至第１１図は第７図における
ボンディング位置での被ボンディング物位置決め動作を
説明するための各動作時での一部平面図である。 ３・・・基板、５・・・リード線、７・・・半導体ペレ
ット、８・・・ワイヤ、１３・・・ボンディングツール
、２５・・・位置決め爪。

Claims (1)

    【実用新案登録請求の範囲】
  1. リード線を絶縁封止して突設し、半導体ペレットをマウ
    ントした基板の前記リード線と半導体ペレットにワイヤ
    をボンディングする装置であって、先端にリード線を収
    容するＶ字状の位置決め溝を有し、ボンディング位置の
    基板上に突出して、リード線の側面を一方から押圧し位
    置決めする位置決め爪を具備し、リード線側ワイヤボン
    ディング時に位置決め爪でリード線を位置決めしたこと
    を特徴とする半導体製造装置。
JP1981129869U 1981-08-31 1981-08-31 半導体製造装置 Pending JPS5834734U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981129869U JPS5834734U (ja) 1981-08-31 1981-08-31 半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981129869U JPS5834734U (ja) 1981-08-31 1981-08-31 半導体製造装置

Publications (1)

Publication Number Publication Date
JPS5834734U true JPS5834734U (ja) 1983-03-07

Family

ID=29923529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981129869U Pending JPS5834734U (ja) 1981-08-31 1981-08-31 半導体製造装置

Country Status (1)

Country Link
JP (1) JPS5834734U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6298626A (ja) * 1985-10-24 1987-05-08 Shinkawa Ltd ボンデイング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6298626A (ja) * 1985-10-24 1987-05-08 Shinkawa Ltd ボンデイング装置

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