JPS59180450U - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPS59180450U
JPS59180450U JP1983075839U JP7583983U JPS59180450U JP S59180450 U JPS59180450 U JP S59180450U JP 1983075839 U JP1983075839 U JP 1983075839U JP 7583983 U JP7583983 U JP 7583983U JP S59180450 U JPS59180450 U JP S59180450U
Authority
JP
Japan
Prior art keywords
lead
resin
semiconductor device
sealed
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983075839U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0419805Y2 (2
Inventor
進 林
岡村　富雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP1983075839U priority Critical patent/JPS59180450U/ja
Publication of JPS59180450U publication Critical patent/JPS59180450U/ja
Application granted granted Critical
Publication of JPH0419805Y2 publication Critical patent/JPH0419805Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1983075839U 1983-05-20 1983-05-20 樹脂封止型半導体装置 Granted JPS59180450U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983075839U JPS59180450U (ja) 1983-05-20 1983-05-20 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983075839U JPS59180450U (ja) 1983-05-20 1983-05-20 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS59180450U true JPS59180450U (ja) 1984-12-01
JPH0419805Y2 JPH0419805Y2 (2) 1992-05-06

Family

ID=30205898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983075839U Granted JPS59180450U (ja) 1983-05-20 1983-05-20 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS59180450U (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012074511A (ja) * 2010-09-28 2012-04-12 Shindengen Electric Mfg Co Ltd 樹脂封止型半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012074511A (ja) * 2010-09-28 2012-04-12 Shindengen Electric Mfg Co Ltd 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPH0419805Y2 (2) 1992-05-06

Similar Documents

Publication Publication Date Title
JPS59180450U (ja) 樹脂封止型半導体装置
JPS619840U (ja) 樹脂封止型半導体装置
JPS5977241U (ja) 樹脂封止型半導体装置
JPS60130649U (ja) 樹脂封止型半導体装置
JPS592155U (ja) 樹脂封止集積回路
JPS585347U (ja) 樹脂封止型半導体装置
JPS58118751U (ja) 半導体装置
JPS5878654U (ja) モ−ルド型半導体素子
JPS5856446U (ja) 樹脂封止半導体装置
JPS6033452U (ja) 樹脂封止型半導体装置
JPS59164243U (ja) 樹脂封止半導体装置
JPS594644U (ja) 樹脂モ−ルド半導体装置
JPS6076045U (ja) 樹脂封止半導体装置
JPS5895062U (ja) 半導体装置
JPS5840843U (ja) 樹脂封止型半導体装置
JPS59189242U (ja) 樹脂封止半導体装置
JPS58177948U (ja) 樹脂封止半導体装置
JPS6073249U (ja) 樹脂封止半導体装置
JPS59182947U (ja) 半導体装置
JPH0176040U (2)
JPS59176151U (ja) 樹脂封止型半導体装置
JPS5945935U (ja) 樹脂封止半導体装置
JPS5895641U (ja) 樹脂封止半導体装置
JPS60111043U (ja) 半導体装置
JPS59195751U (ja) 樹脂封止型半導体装置