JPS5926253U - 混成集積回路 - Google Patents

混成集積回路

Info

Publication number
JPS5926253U
JPS5926253U JP12043282U JP12043282U JPS5926253U JP S5926253 U JPS5926253 U JP S5926253U JP 12043282 U JP12043282 U JP 12043282U JP 12043282 U JP12043282 U JP 12043282U JP S5926253 U JPS5926253 U JP S5926253U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
power transistor
heat sink
frame body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12043282U
Other languages
English (en)
Other versions
JPS6233330Y2 (ja
Inventor
清水　永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP12043282U priority Critical patent/JPS5926253U/ja
Publication of JPS5926253U publication Critical patent/JPS5926253U/ja
Application granted granted Critical
Publication of JPS6233330Y2 publication Critical patent/JPS6233330Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来例を説明する断面図、第２図は本考案を説
明する上面図、第３図は本考案を説明する断面図である
。 主な図番の説明、１１は基板、１３はヒートシンク、１
４はパワートランジスタ、１５は枠体、１６は樹脂層、
１８は蓋体、２０は間隔片である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁基板上にヒートシンクを介して固着したパワートラ
    ンジスタを具備する混成集積回路に於いて、前記ヒート
    シンクを取り囲み且つ内側ｉこ突出した間隔片により前
    記ヒートタンクより離間して配置した枠体と、該枠体内
    に充填され前記パワートランジスタを完全に被覆する封
    止樹脂層とを有することを特徴とする混成集積回路。
JP12043282U 1982-08-06 1982-08-06 混成集積回路 Granted JPS5926253U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12043282U JPS5926253U (ja) 1982-08-06 1982-08-06 混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12043282U JPS5926253U (ja) 1982-08-06 1982-08-06 混成集積回路

Publications (2)

Publication Number Publication Date
JPS5926253U true JPS5926253U (ja) 1984-02-18
JPS6233330Y2 JPS6233330Y2 (ja) 1987-08-26

Family

ID=30276021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12043282U Granted JPS5926253U (ja) 1982-08-06 1982-08-06 混成集積回路

Country Status (1)

Country Link
JP (1) JPS5926253U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04184378A (ja) * 1990-11-19 1992-07-01 Mita Ind Co Ltd ベルト転写・搬送装置
JPH04190135A (ja) * 1990-11-24 1992-07-08 Horiba Ltd ベンチュリ交換装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56119658U (ja) * 1980-02-15 1981-09-11
JPS56129738U (ja) * 1980-02-29 1981-10-02

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56119658U (ja) * 1980-02-15 1981-09-11
JPS56129738U (ja) * 1980-02-29 1981-10-02

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04184378A (ja) * 1990-11-19 1992-07-01 Mita Ind Co Ltd ベルト転写・搬送装置
JPH04190135A (ja) * 1990-11-24 1992-07-08 Horiba Ltd ベンチュリ交換装置

Also Published As

Publication number Publication date
JPS6233330Y2 (ja) 1987-08-26

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