JPS5974639A - 薄板状集積回路基板の製法 - Google Patents

薄板状集積回路基板の製法

Info

Publication number
JPS5974639A
JPS5974639A JP57184566A JP18456682A JPS5974639A JP S5974639 A JPS5974639 A JP S5974639A JP 57184566 A JP57184566 A JP 57184566A JP 18456682 A JP18456682 A JP 18456682A JP S5974639 A JPS5974639 A JP S5974639A
Authority
JP
Japan
Prior art keywords
chip
integrated circuit
substrate
card
circuit chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57184566A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0557119B2 (2
Inventor
Kenzo Masuda
増田　健三
Kenichi Ishibashi
謙一 石橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57184566A priority Critical patent/JPS5974639A/ja
Publication of JPS5974639A publication Critical patent/JPS5974639A/ja
Publication of JPH0557119B2 publication Critical patent/JPH0557119B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Credit Cards Or The Like (AREA)
  • Die Bonding (AREA)
JP57184566A 1982-10-22 1982-10-22 薄板状集積回路基板の製法 Granted JPS5974639A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57184566A JPS5974639A (ja) 1982-10-22 1982-10-22 薄板状集積回路基板の製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57184566A JPS5974639A (ja) 1982-10-22 1982-10-22 薄板状集積回路基板の製法

Publications (2)

Publication Number Publication Date
JPS5974639A true JPS5974639A (ja) 1984-04-27
JPH0557119B2 JPH0557119B2 (2) 1993-08-23

Family

ID=16155445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57184566A Granted JPS5974639A (ja) 1982-10-22 1982-10-22 薄板状集積回路基板の製法

Country Status (1)

Country Link
JP (1) JPS5974639A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62185072U (2) * 1986-05-15 1987-11-25
JPH0199892A (ja) * 1987-10-13 1989-04-18 Dainippon Printing Co Ltd Ｉｃカードおよびｉｃカード用ｉｃモジュール
JPH0789281A (ja) * 1993-11-29 1995-04-04 Ryoden Kasei Co Ltd Ｉｃカード

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5329260A (en) * 1976-08-31 1978-03-18 Ishikawajima Harima Heavy Ind Device for penetrating plate of tension bridle
JPS5552698U (2) * 1978-10-02 1980-04-08
JPS5752977A (en) * 1980-08-07 1982-03-29 Gao Ges Automation Org Identifying card and method of producing same
JPS58125892A (ja) * 1981-12-24 1983-07-27 ゲ−ア−オ−・ゲゼルシヤフト・フユ−ル・アウトマチオン・ウント・オルガニザチオン・エム・ベ−・ハ− 集積回路モジユ−ルを有する識別カ−ドおよびキヤリヤ要素

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5329260A (en) * 1976-08-31 1978-03-18 Ishikawajima Harima Heavy Ind Device for penetrating plate of tension bridle
JPS5552698U (2) * 1978-10-02 1980-04-08
JPS5752977A (en) * 1980-08-07 1982-03-29 Gao Ges Automation Org Identifying card and method of producing same
JPS58125892A (ja) * 1981-12-24 1983-07-27 ゲ−ア−オ−・ゲゼルシヤフト・フユ−ル・アウトマチオン・ウント・オルガニザチオン・エム・ベ−・ハ− 集積回路モジユ−ルを有する識別カ−ドおよびキヤリヤ要素

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62185072U (2) * 1986-05-15 1987-11-25
JPH0199892A (ja) * 1987-10-13 1989-04-18 Dainippon Printing Co Ltd Ｉｃカードおよびｉｃカード用ｉｃモジュール
JPH0789281A (ja) * 1993-11-29 1995-04-04 Ryoden Kasei Co Ltd Ｉｃカード

Also Published As

Publication number Publication date
JPH0557119B2 (2) 1993-08-23

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