JPS60137043A - 樹脂封止形半導体装置の製造方法 - Google Patents

樹脂封止形半導体装置の製造方法

Info

Publication number
JPS60137043A
JPS60137043A JP58250537A JP25053783A JPS60137043A JP S60137043 A JPS60137043 A JP S60137043A JP 58250537 A JP58250537 A JP 58250537A JP 25053783 A JP25053783 A JP 25053783A JP S60137043 A JPS60137043 A JP S60137043A
Authority
JP
Japan
Prior art keywords
resin
coupling agent
semiconductor device
sealed
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58250537A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0434825B2 (fr
Inventor
Hiroyuki Fujii
博之 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp, Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electronics Corp
Priority to JP58250537A priority Critical patent/JPS60137043A/ja
Publication of JPS60137043A publication Critical patent/JPS60137043A/ja
Publication of JPH0434825B2 publication Critical patent/JPH0434825B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP58250537A 1983-12-26 1983-12-26 樹脂封止形半導体装置の製造方法 Granted JPS60137043A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58250537A JPS60137043A (ja) 1983-12-26 1983-12-26 樹脂封止形半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58250537A JPS60137043A (ja) 1983-12-26 1983-12-26 樹脂封止形半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS60137043A true JPS60137043A (ja) 1985-07-20
JPH0434825B2 JPH0434825B2 (fr) 1992-06-09

Family

ID=17209373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58250537A Granted JPS60137043A (ja) 1983-12-26 1983-12-26 樹脂封止形半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS60137043A (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55156343A (en) * 1979-05-25 1980-12-05 Hitachi Ltd Manufacture of semiconductor device
JPS6134253U (ja) * 1984-07-31 1986-03-01 敏和 岸本 磁気治療器を埋め込んだ眼鏡

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55156343A (en) * 1979-05-25 1980-12-05 Hitachi Ltd Manufacture of semiconductor device
JPS6134253U (ja) * 1984-07-31 1986-03-01 敏和 岸本 磁気治療器を埋め込んだ眼鏡

Also Published As

Publication number Publication date
JPH0434825B2 (fr) 1992-06-09

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