JPS60137050A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60137050A
JPS60137050A JP58251390A JP25139083A JPS60137050A JP S60137050 A JPS60137050 A JP S60137050A JP 58251390 A JP58251390 A JP 58251390A JP 25139083 A JP25139083 A JP 25139083A JP S60137050 A JPS60137050 A JP S60137050A
Authority
JP
Japan
Prior art keywords
impurity region
bonding pad
capacitance
semiconductor substrate
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58251390A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0447974B2 (2
Inventor
Toshio Yuyama
湯山　俊夫
Mitsuru Katayose
片寄　充
Nariyuki Sakura
成之 佐倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58251390A priority Critical patent/JPS60137050A/ja
Publication of JPS60137050A publication Critical patent/JPS60137050A/ja
Publication of JPH0447974B2 publication Critical patent/JPH0447974B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/482—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes for individual devices provided for in groups H10D8/00 - H10D48/00, e.g. for power transistors
    • H10W20/484—Interconnections having extended contours, e.g. pads having mesh shape or interconnections comprising connected parallel stripes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view

Landscapes

  • Wire Bonding (AREA)
JP58251390A 1983-12-26 1983-12-26 半導体装置 Granted JPS60137050A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58251390A JPS60137050A (ja) 1983-12-26 1983-12-26 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58251390A JPS60137050A (ja) 1983-12-26 1983-12-26 半導体装置

Publications (2)

Publication Number Publication Date
JPS60137050A true JPS60137050A (ja) 1985-07-20
JPH0447974B2 JPH0447974B2 (2) 1992-08-05

Family

ID=17222123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58251390A Granted JPS60137050A (ja) 1983-12-26 1983-12-26 半導体装置

Country Status (1)

Country Link
JP (1) JPS60137050A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998031047A1 (en) * 1997-01-13 1998-07-16 Matsushita Electric Industrial Co., Ltd. Semiconductor integrated circuit and system
WO2002082539A3 (en) * 2001-04-06 2003-07-31 Motorola Inc A radio frequency (rf) device and its method of manufacture
CN109817697A (zh) * 2017-11-22 2019-05-28 三菱电机株式会社 半导体装置及其制造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4968664A (2) * 1972-11-06 1974-07-03

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4968664A (2) * 1972-11-06 1974-07-03

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998031047A1 (en) * 1997-01-13 1998-07-16 Matsushita Electric Industrial Co., Ltd. Semiconductor integrated circuit and system
US6680543B2 (en) 1997-01-13 2004-01-20 Matsushita Electric Industrial Co., Ltd. Semiconductor integrated circuit and system
WO2002082539A3 (en) * 2001-04-06 2003-07-31 Motorola Inc A radio frequency (rf) device and its method of manufacture
CN109817697A (zh) * 2017-11-22 2019-05-28 三菱电机株式会社 半导体装置及其制造方法
CN109817697B (zh) * 2017-11-22 2022-05-10 三菱电机株式会社 半导体装置及其制造方法

Also Published As

Publication number Publication date
JPH0447974B2 (2) 1992-08-05

Similar Documents

Publication Publication Date Title
JPH0151065B2 (2)
GB1251454A (2)
JPS5854661A (ja) 多層セラミツク半導体パツケ−ジ
US3408542A (en) Semiconductor chopper amplifier with twin emitters
JPS60137050A (ja) 半導体装置
JP2674553B2 (ja) 半導体装置
JP2697547B2 (ja) 半導体集積回路装置
JPS629654A (ja) 集積回路装置実装パツケ−ジ
JPH09223758A (ja) 半導体装置
JPS6469034A (en) Semiconductor integrated circuit with decoupled d.c. wiring
JPH04183001A (ja) マイクロ波ｉｃ用パッケージ
JPH0576783B2 (2)
JPH0543478Y2 (2)
KR20040081173A (ko) 회로 칩의 단자를 외부 기준 전위에 도전 접속하는 장치
JPH01143230A (ja) 半導体装置
JPS6045044A (ja) Ｉｃパツケ−ジ
JPH0726841Y2 (ja) 半導体集積回路
JPH01257348A (ja) スタンダード・セル集積回路装置
JPS6489525A (en) Interconnecting structure of circuit board
JPS6081852A (ja) 半導体装置
JPH07106524A (ja) 半導体集積回路装置
JPH01289276A (ja) 半導体装置
JPS58178546A (ja) 半導体装置
JPS6467943A (en) Laminated semiconductor device
JPS62243370A (ja) 高周波電界効果トランジスタ

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term