JPS6014461A - 相補型絶縁ゲート電界効果トランジスタの製造方法 - Google Patents
相補型絶縁ゲート電界効果トランジスタの製造方法Info
- Publication number
- JPS6014461A JPS6014461A JP58121185A JP12118583A JPS6014461A JP S6014461 A JPS6014461 A JP S6014461A JP 58121185 A JP58121185 A JP 58121185A JP 12118583 A JP12118583 A JP 12118583A JP S6014461 A JPS6014461 A JP S6014461A
- Authority
- JP
- Japan
- Prior art keywords
- drain
- impurity concentration
- source
- transistor
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/027—Manufacture or treatment of FETs having insulated gates [IGFET] of lateral single-gate IGFETs
- H10D30/0275—Manufacture or treatment of FETs having insulated gates [IGFET] of lateral single-gate IGFETs forming single crystalline semiconductor source or drain regions resulting in recessed gates, e.g. forming raised source or drain regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/258—Source or drain electrodes for field-effect devices characterised by the relative positions of the source or drain electrodes with respect to the gate electrode
- H10D64/259—Source or drain electrodes being self-aligned with the gate electrode and having bottom surfaces higher than the interface between the channel and the gate dielectric
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
- H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
- H10D84/85—Complementary IGFETs, e.g. CMOS
- H10D84/858—Complementary IGFETs, e.g. CMOS comprising a P-type well but not an N-type well
Landscapes
- Electrodes Of Semiconductors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58121185A JPS6014461A (ja) | 1983-07-04 | 1983-07-04 | 相補型絶縁ゲート電界効果トランジスタの製造方法 |
| KR1019840001637A KR910006249B1 (ko) | 1983-04-01 | 1984-03-29 | 반도체 장치 |
| EP84103566A EP0123936B1 (fr) | 1983-04-01 | 1984-03-30 | Dispositif semi-conducteur |
| DE8484103566T DE3476144D1 (en) | 1983-04-01 | 1984-03-30 | Semiconductor device |
| US07/063,785 US4769686A (en) | 1983-04-01 | 1987-06-19 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58121185A JPS6014461A (ja) | 1983-07-04 | 1983-07-04 | 相補型絶縁ゲート電界効果トランジスタの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6014461A true JPS6014461A (ja) | 1985-01-25 |
| JPH0527266B2 JPH0527266B2 (fr) | 1993-04-20 |
Family
ID=14804956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58121185A Granted JPS6014461A (ja) | 1983-04-01 | 1983-07-04 | 相補型絶縁ゲート電界効果トランジスタの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6014461A (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63115376A (ja) * | 1985-10-30 | 1988-05-19 | ハリス コーポレイション | Mos電界効果トランジスタとその製造法 |
| US5571735A (en) * | 1994-06-21 | 1996-11-05 | Nec Corporation | Method of manufacturing a semiconducter device capable of easily forming metal silicide films on source and drain regions |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5488779A (en) * | 1977-12-26 | 1979-07-14 | Cho Lsi Gijutsu Kenkyu Kumiai | Method of fabricating complementary mos transistor |
| JPS5568675A (en) * | 1978-11-17 | 1980-05-23 | Toshiba Corp | Fabrication of complementary mos transistor |
| JPS58138053A (ja) * | 1982-02-12 | 1983-08-16 | Nec Corp | 半導体装置およびその製造方法 |
-
1983
- 1983-07-04 JP JP58121185A patent/JPS6014461A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5488779A (en) * | 1977-12-26 | 1979-07-14 | Cho Lsi Gijutsu Kenkyu Kumiai | Method of fabricating complementary mos transistor |
| JPS5568675A (en) * | 1978-11-17 | 1980-05-23 | Toshiba Corp | Fabrication of complementary mos transistor |
| JPS58138053A (ja) * | 1982-02-12 | 1983-08-16 | Nec Corp | 半導体装置およびその製造方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63115376A (ja) * | 1985-10-30 | 1988-05-19 | ハリス コーポレイション | Mos電界効果トランジスタとその製造法 |
| US5571735A (en) * | 1994-06-21 | 1996-11-05 | Nec Corporation | Method of manufacturing a semiconducter device capable of easily forming metal silicide films on source and drain regions |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0527266B2 (fr) | 1993-04-20 |
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