JPS61164243A - ハ−メチツクパツケ−ジの構造 - Google Patents

ハ−メチツクパツケ−ジの構造

Info

Publication number
JPS61164243A
JPS61164243A JP60005354A JP535485A JPS61164243A JP S61164243 A JPS61164243 A JP S61164243A JP 60005354 A JP60005354 A JP 60005354A JP 535485 A JP535485 A JP 535485A JP S61164243 A JPS61164243 A JP S61164243A
Authority
JP
Japan
Prior art keywords
glass
case
metal
welding
stem
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60005354A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0337861B2 (2
Inventor
Kazunari Ichise
和成 市瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Matsushima Kogyo KK
Original Assignee
Matsushima Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushima Kogyo KK filed Critical Matsushima Kogyo KK
Priority to JP60005354A priority Critical patent/JPS61164243A/ja
Publication of JPS61164243A publication Critical patent/JPS61164243A/ja
Publication of JPH0337861B2 publication Critical patent/JPH0337861B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
JP60005354A 1985-01-16 1985-01-16 ハ−メチツクパツケ−ジの構造 Granted JPS61164243A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60005354A JPS61164243A (ja) 1985-01-16 1985-01-16 ハ−メチツクパツケ−ジの構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60005354A JPS61164243A (ja) 1985-01-16 1985-01-16 ハ−メチツクパツケ−ジの構造

Publications (2)

Publication Number Publication Date
JPS61164243A true JPS61164243A (ja) 1986-07-24
JPH0337861B2 JPH0337861B2 (2) 1991-06-06

Family

ID=11608849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60005354A Granted JPS61164243A (ja) 1985-01-16 1985-01-16 ハ−メチツクパツケ−ジの構造

Country Status (1)

Country Link
JP (1) JPS61164243A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110364487A (zh) * 2019-07-23 2019-10-22 西安伟京电子制造有限公司 一种混合集成电路管壳及防止玻璃绝缘子断裂的方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110364487A (zh) * 2019-07-23 2019-10-22 西安伟京电子制造有限公司 一种混合集成电路管壳及防止玻璃绝缘子断裂的方法

Also Published As

Publication number Publication date
JPH0337861B2 (2) 1991-06-06

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term