JPS6176969U - - Google Patents

Info

Publication number
JPS6176969U
JPS6176969U JP1984161512U JP16151284U JPS6176969U JP S6176969 U JPS6176969 U JP S6176969U JP 1984161512 U JP1984161512 U JP 1984161512U JP 16151284 U JP16151284 U JP 16151284U JP S6176969 U JPS6176969 U JP S6176969U
Authority
JP
Japan
Prior art keywords
semiconductor element
mounting section
lead frame
lead
internal lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984161512U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984161512U priority Critical patent/JPS6176969U/ja
Publication of JPS6176969U publication Critical patent/JPS6176969U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図イ〜ロは本考案によるリードフレームを
示し、第１図イは要部断面図、第１図ロは要部平
面図である。第２図イ〜ロは従来のリードフレー
ムを示し、第２図イは要部断面図、第２図ロは要
部平面図である。 主な図番の説明、１は半導体素子、３は内部リ
ード、５は山型部である。

Claims (1)

    【実用新案登録請求の範囲】
  1. 載置部に半導体素子を固着した後、合成樹脂に
    より封脂成形する半導体装置のリードフレームに
    おいて、前記載置部にその先端を近接する如く延
    在して設けられた内部リードを山型に折り曲げ、
    且つ山の高さを前記半導体素子と前記内部リード
    とを電気的に接続する金属細線のループより高く
    形成したことを特徴とするリードフレーム。
JP1984161512U 1984-10-25 1984-10-25 Pending JPS6176969U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984161512U JPS6176969U (ja) 1984-10-25 1984-10-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984161512U JPS6176969U (ja) 1984-10-25 1984-10-25

Publications (1)

Publication Number Publication Date
JPS6176969U true JPS6176969U (ja) 1986-05-23

Family

ID=30719418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984161512U Pending JPS6176969U (ja) 1984-10-25 1984-10-25

Country Status (1)

Country Link
JP (1) JPS6176969U (ja)

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