JPS6184040A - 樹脂封止形半導体メモリ装置 - Google Patents

樹脂封止形半導体メモリ装置

Info

Publication number
JPS6184040A
JPS6184040A JP59205024A JP20502484A JPS6184040A JP S6184040 A JPS6184040 A JP S6184040A JP 59205024 A JP59205024 A JP 59205024A JP 20502484 A JP20502484 A JP 20502484A JP S6184040 A JPS6184040 A JP S6184040A
Authority
JP
Japan
Prior art keywords
resin
memory array
array forming
forming part
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59205024A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0321090B2 (de
Inventor
Osamu Ueda
修 上田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59205024A priority Critical patent/JPS6184040A/ja
Publication of JPS6184040A publication Critical patent/JPS6184040A/ja
Publication of JPH0321090B2 publication Critical patent/JPH0321090B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP59205024A 1984-09-29 1984-09-29 樹脂封止形半導体メモリ装置 Granted JPS6184040A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59205024A JPS6184040A (ja) 1984-09-29 1984-09-29 樹脂封止形半導体メモリ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59205024A JPS6184040A (ja) 1984-09-29 1984-09-29 樹脂封止形半導体メモリ装置

Publications (2)

Publication Number Publication Date
JPS6184040A true JPS6184040A (ja) 1986-04-28
JPH0321090B2 JPH0321090B2 (de) 1991-03-20

Family

ID=16500178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59205024A Granted JPS6184040A (ja) 1984-09-29 1984-09-29 樹脂封止形半導体メモリ装置

Country Status (1)

Country Link
JP (1) JPS6184040A (de)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5988850A (ja) * 1982-11-12 1984-05-22 Toshiba Corp 集積回路装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5988850A (ja) * 1982-11-12 1984-05-22 Toshiba Corp 集積回路装置

Also Published As

Publication number Publication date
JPH0321090B2 (de) 1991-03-20

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