JPS62244639A - 積層板の連続製造方法 - Google Patents

積層板の連続製造方法

Info

Publication number
JPS62244639A
JPS62244639A JP61088681A JP8868186A JPS62244639A JP S62244639 A JPS62244639 A JP S62244639A JP 61088681 A JP61088681 A JP 61088681A JP 8868186 A JP8868186 A JP 8868186A JP S62244639 A JPS62244639 A JP S62244639A
Authority
JP
Japan
Prior art keywords
resin liquid
laminate
base material
impregnated
continuously
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61088681A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0556258B2 (2
Inventor
魚住　粧二
桜野　光則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP61088681A priority Critical patent/JPS62244639A/ja
Publication of JPS62244639A publication Critical patent/JPS62244639A/ja
Publication of JPH0556258B2 publication Critical patent/JPH0556258B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
JP61088681A 1986-04-16 1986-04-16 積層板の連続製造方法 Granted JPS62244639A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61088681A JPS62244639A (ja) 1986-04-16 1986-04-16 積層板の連続製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61088681A JPS62244639A (ja) 1986-04-16 1986-04-16 積層板の連続製造方法

Publications (2)

Publication Number Publication Date
JPS62244639A true JPS62244639A (ja) 1987-10-26
JPH0556258B2 JPH0556258B2 (2) 1993-08-19

Family

ID=13949571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61088681A Granted JPS62244639A (ja) 1986-04-16 1986-04-16 積層板の連続製造方法

Country Status (1)

Country Link
JP (1) JPS62244639A (2)

Also Published As

Publication number Publication date
JPH0556258B2 (2) 1993-08-19

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