JPS6237934U - - Google Patents

Info

Publication number
JPS6237934U
JPS6237934U JP1985130654U JP13065485U JPS6237934U JP S6237934 U JPS6237934 U JP S6237934U JP 1985130654 U JP1985130654 U JP 1985130654U JP 13065485 U JP13065485 U JP 13065485U JP S6237934 U JPS6237934 U JP S6237934U
Authority
JP
Japan
Prior art keywords
insulating film
semiconductor substrate
lead member
electrode
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985130654U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985130654U priority Critical patent/JPS6237934U/ja
Publication of JPS6237934U publication Critical patent/JPS6237934U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例に係わるマルチエミツ
タ型のパワートランジスタを示す断面図、第２図
は従来のマルチエミツタ型のパワートランジスタ
を示す断面図、第３図は第１図及び第２図のパワ
ートランジスタのエミツタ電極とベース電極との
一部を示す平面図、第４図は第２図のトランジス
タにおける層割れを説明するための断面図である
。 １…シリコン基板、４…ベース領域、５…エミ
ツタ領域、６…絶縁膜、６ａ…ＳｉＯ２膜、６ｂ
…Ｓｉ３Ｎ４膜、７…エミツタ電極、７ａ…配線
部分、７ｂ…パツド部分、１１…半田。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) ｐｎ接合を有する半導体基板と、 前記半導体基板の主面上に選択的に設けられて
    いる絶縁膜と、 前記半導体基板上及び前記絶縁膜上に設けられ
    ている電極と、 前記電極に固着されているリード部材と、 を有し、且つ前記電極における前記リード部材の
    固着部分の一部又は全部が前記絶縁膜上に設けら
    れている半導体装置において、 前記絶縁膜の前記ｐｎ接合を覆う部分はシリコ
    ン酸化膜とシリコン窒化膜との二層構成とし、 前記絶縁膜における前記固着部分の一部又は全
    部に対応する部分はＳｉＯ２膜のみの一層構成と
    したことを特徴とする半導体装置。 (2) 前記半導体基板は、トランジスタを構成す
    る基板であり、前記リード部材は前記トランジス
    タのエミツタリード線である実用新案登録請求の
    範囲第１項記載の半導体装置。 (3) 前記リード部材は半田によつて前記電極に
    固着されているものである実用新案登録請求の範
    囲第１項又は第２項記載の半導体装置。
JP1985130654U 1985-08-27 1985-08-27 Pending JPS6237934U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985130654U JPS6237934U (ja) 1985-08-27 1985-08-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985130654U JPS6237934U (ja) 1985-08-27 1985-08-27

Publications (1)

Publication Number Publication Date
JPS6237934U true JPS6237934U (ja) 1987-03-06

Family

ID=31028359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985130654U Pending JPS6237934U (ja) 1985-08-27 1985-08-27

Country Status (1)

Country Link
JP (1) JPS6237934U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04272419A (ja) * 1991-02-26 1992-09-29 Toyota Motor Corp 内燃機関のフィルタ再生制御装置
JPH0791227A (ja) * 1992-09-09 1995-04-04 J Eberspaecher 粒子フィルタの負荷状態の判別方法及び装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5315759A (en) * 1976-07-28 1978-02-14 Hitachi Ltd Electronic parts
JPS57159035A (en) * 1981-03-26 1982-10-01 Yamagata Nippon Denki Kk Manufacture of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5315759A (en) * 1976-07-28 1978-02-14 Hitachi Ltd Electronic parts
JPS57159035A (en) * 1981-03-26 1982-10-01 Yamagata Nippon Denki Kk Manufacture of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04272419A (ja) * 1991-02-26 1992-09-29 Toyota Motor Corp 内燃機関のフィルタ再生制御装置
JPH0791227A (ja) * 1992-09-09 1995-04-04 J Eberspaecher 粒子フィルタの負荷状態の判別方法及び装置

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