JPS6237950A - 電子部品塔載用パツケ−ジ - Google Patents

電子部品塔載用パツケ−ジ

Info

Publication number
JPS6237950A
JPS6237950A JP60177165A JP17716585A JPS6237950A JP S6237950 A JPS6237950 A JP S6237950A JP 60177165 A JP60177165 A JP 60177165A JP 17716585 A JP17716585 A JP 17716585A JP S6237950 A JPS6237950 A JP S6237950A
Authority
JP
Japan
Prior art keywords
main body
lid
package
flange
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60177165A
Other languages
English (en)
Inventor
Koji Nose
幸之 野世
Hitoo Iwasa
仁雄 岩佐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP60177165A priority Critical patent/JPS6237950A/ja
Publication of JPS6237950A publication Critical patent/JPS6237950A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12—Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/124—Tongue and groove joints
    • B29C66/1246—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove
    • B29C66/12461—Tongue and groove joints characterised by the female part, i.e. the part comprising the groove being rounded, i.e. U-shaped or C-shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/13—Single flanged joints; Fin-type joints; Single hem joints; Edge joints; Interpenetrating fingered joints; Other specific particular designs of joint cross-sections not provided for in groups B29C66/11 - B29C66/12
    • B29C66/131—Single flanged joints, i.e. one of the parts to be joined being rigid and flanged in the joint area
    • B29C66/1312—Single flange to flange joints, the parts to be joined being rigid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/24—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight
    • B29C66/242—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours
    • B29C66/2424—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain
    • B29C66/24243—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral
    • B29C66/24244—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being closed, i.e. forming closed contours being a closed polygonal chain forming a quadrilateral forming a rectangle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/302—Particular design of joint configurations the area to be joined comprising melt initiators
    • B29C66/3022—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined
    • B29C66/30223—Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined said melt initiators being rib-like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
    • B29C66/542—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles joining hollow covers or hollow bottoms to open ends of container bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B29C66/712—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined the composition of one of the parts to be joined being different from the composition of the other part
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7394—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset
    • B29C66/73941—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoset characterised by the materials of both parts being thermosets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、半導体装置を搭載するプラスチック型パッケ
ージの構造に関する。
従来の技術 情報消去可能型半導体記憶素子を搭載するだめのプラス
チック型パンケージでは、通常、本体側に半導体記憶素
子が搭載しうる大きさの空洞を設けて、空洞部の底面に
は半導体記憶素子を接合するダイパッド部と、パッケー
ジ外部と半導体記憶素子との間での電気信号の伝達を行
うだめのリード線接続用インナーリード先端部とを露出
させている。このダイパッド部とインナーリード先端部
の表面は、金や銀の薄いメッキ層または、アルミニウム
のクラッド層が施されており、ダイパッド部に銀ペース
トや錫−鉛ハンダで半導体記憶素子が搭載され、半導体
記憶素子の入出力信号端子とインナーリードのメッキ部
は金またはアルミニウムからなる細線で接続されている
。この状態で、空洞部の蓋に用いる石英ガラスもしくは
グラスチ３　・−、 ツクと熱膨張率が近いアルミナガラスが空洞部に嵌め適
寸れ、空洞部側壁プラスチック面とガラス側壁面とが接
着剤で接着される。そして接着剤が、加熱丑たは、光照
射によって硬化され、従来の中空型プラスチックパッケ
ージが達成される。
発明が解決しようとする問題点 従来技術においては、空洞部の蓋に、石英やアルミナ等
の高価なガラス材料を必要とし、またそれらの接着には
パノケージプラスチノクやガラスと異る接着剤を用いて
おり、その接着部での熱膨張係数の差から耐熱ザイクル
性や耐湿性の信頼性に問題があった。
問題点を解決するだめの手段 本発明では、前述の問題を解決すべく、パッケージの本
体と蓋をプラスチックで構成し、プラスチックには、熱
可塑性プラスチックを用い、蓋側にはポリカーボネート
やアクリルを含む耐熱性透明プラスチックを用いる。さ
らに、パッケージの本体と蓋の接続にはフランジ型形状
の接合部をそなえ、同接合部の超音波溶融接着法を用い
る。これにより上記問題は解決できる。
作　　用 パンケージを構成する本体及び蓋に熱可塑性プラスチッ
クを用いることで、機械的振動に」：る接合部の溶融化
接着が可能となる。さらに接続のだめのプラスチック発
熱は部分的で、パッケージ内部に搭載した半導体素子に
殆んど熱を伝えることなく、本構造が達成できる。
実施例 以下に本発明の実施例を撮像半導体素子用中空、型プラ
スチックパッケージの構造を例にとって第１図と第２図
を参照しながら説明する。
中空型パッケージは、半導体素子１を封入する容器とし
て、本体２と蓋３とから構成されており、本体２は、ポ
リフェニルサルファーからなる熱可塑性プラスチック（
以下ＰＰＳ樹脂と記す）で、蓋３ば、アクリル（以下Ａ
Ｌ樹脂と記す）やポリカーボネイト（以下ＰＣ樹脂と記
す）からなる熱可塑性プラスチックを用いる。中空ノく
ツケージの本体２は半導体素子１が搭載でき、さらに本
体２５ベー／ 中に埋め適寸れた、リードフレーム４のインｆ　−リー
ド５と半導体素子１との間を金属細線６で接続する作業
が出来る程度の大きさの矩形の窪み穴７を設ける。この
窪み穴７の底面は、半導体素子搭載部８とインナーリー
ド５の先端部表面が、ＰＰＳ樹脂面とほぼ同一平面に露
出している。ここで使用するリードフレーム４の材質は
、鉄−ニッケル合金（４２アロイ）やコバールや銅合金
を用いる。
そして、リードフレーム４が窪み穴７の底面に露出する
部分の表面は、０．５〜３７ｚｍ程度の厚みの金や銀メ
ッキもしくはアルミニウム箔をクラ、ｙドした表面加工
層９を形成する０ 半導体素子１の入出力信号端子部である主としてアルミ
ニウムからなるポンプイングツくラド１゜と表面加工層
９との電気的接続は、アルミニウム。
金もしくはパラジウムからなる金属細線６を用いて、超
音波法や熱圧着法により行う。さらに、中空型パッケー
ジの窪み穴７の全周囲の側壁部には適当な幅と厚みのフ
ランジ１１を設け、そのクラ６　ベー／ ンジ接合面の全周にはｖ形、Ｕ形あるいは角形の溝１２
を５０〜２００μｍの深さに形成する。
つぎに、蓋３は、先に述べたＡＬ樹脂やＰＣ樹脂のよう
な可視光透過性の透明樹脂で、本体２と同一寸法に射出
や押し出し法で成形する。蓋３は本体２と同様に凹形の
窪み穴７とフランジ１１を設ける。そしてフランジ１１
の下面全周にはｖ形やＵ形あるいは角形のフランジ凸形
壁１３を１ｏ○〜３００μｍの高さに形成する。このフ
ランジ凸形壁１３は、本体２側のフランジ接合面の溝１
２と同一位置に形成し、本体２と蓋３のフランジ１１０
面を対向させ、フランジ凸形壁１３はフランジ溝１２に
は捷り込むようにする。
この状態で、本体２を固定して蓋３側から超音波振動や
高周波誘導を加えてやると、フランジ凸形壁１３は溶融
して本体２フランジ溝１２と溶着でき、透明窓を有する
中空型プラスチックパッケージの気密封止が達成できる
。
発明の効果 本発明によると、次のような効果がある０７へ− （１）ハノケージ構成部品が安価である。
（２）ハラケージが軽量である。
（３）本体と蓋の接続が溶着法であるだめ、気密性が高
い。
（４）半導体ＥＰＲＯＭや撮像素子など広い用途で適用
しうる。
（樽　部分加熱を用いるため、半導体素子への熱的影響
が少々い。
【図面の簡単な説明】
１・・・・半導体素子、２・・・・・・本体、３・・・
・蓋、４・・・・・・リードフレーム、５・・・・イン
ナーリード、６・・・・・金属細線、７・・・窪み穴、
８・・・・・・半導体素子搭載部、９・・・・・表面加
工層、１ｏ・・・・・ボンデインクハソド、１１・・・
・・・フランジ、１２・・・・・・フランジ溝、１３・
・・・・・フランジ凸形壁○代理人の氏名　弁理士　中
　尾　敏　男　ほか１名第１図 ２−一一本ブト 第２図

Claims (4)

    【特許請求の範囲】
  1. （１）本体および蓋からなる電子部品用樹脂型パッケー
    ジであって、本体および蓋の互いの接合部分をフランジ
    型構造結合になしたことを特徴とする電子部品搭載用パ
    ッケージ。
  2. （２）パッケージの本体及び蓋のフランジ型形状接合部
    が、Ｖ形、Ｕ形もしくは直角を含む多角形の凹凸嵌合面
    で密接されたことを特徴とする特許請求の範囲第１項記
    載の電子部品搭載用パッケージ。
  3. （３）パッケージの本体または蓋のどちらか一方または
    両者に、予め金属製リードを挿入することを特徴とする
    特許請求の範囲第１項または第２項記載の電子部品搭載
    用パッケージ。
  4. （４）本体と蓋が熱可塑性または熱硬化性樹脂からなる
    ことを特徴とする特許請求の範囲第１項、第２項または
    第３項記載の電子部品搭載用パッケージ。
JP60177165A 1985-08-12 1985-08-12 電子部品塔載用パツケ−ジ Pending JPS6237950A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60177165A JPS6237950A (ja) 1985-08-12 1985-08-12 電子部品塔載用パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60177165A JPS6237950A (ja) 1985-08-12 1985-08-12 電子部品塔載用パツケ−ジ

Publications (1)

Publication Number Publication Date
JPS6237950A true JPS6237950A (ja) 1987-02-18

Family

ID=16026317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60177165A Pending JPS6237950A (ja) 1985-08-12 1985-08-12 電子部品塔載用パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS6237950A (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5151773A (en) * 1990-03-30 1992-09-29 Hitachi, Ltd. Electronic circuit apparatus comprising a structure for sealing an electronic circuit
FR2711462A1 (fr) * 1993-08-11 1995-04-28 Siemens Matsushita Components Composant électrique réalisé à la manière d'une microplaquette.
US5436492A (en) * 1992-06-23 1995-07-25 Sony Corporation Charge-coupled device image sensor
JPH09237901A (ja) * 1996-02-28 1997-09-09 S I I R D Center:Kk 半導体装置
US5889323A (en) * 1996-08-19 1999-03-30 Nec Corporation Semiconductor package and method of manufacturing the same
US5927505A (en) * 1995-07-24 1999-07-27 Lsi Logic Corporation Overmolded package body on a substrate
US5977622A (en) * 1997-04-25 1999-11-02 Lsi Logic Corporation Stiffener with slots for clip-on heat sink attachment
US6011304A (en) * 1997-05-05 2000-01-04 Lsi Logic Corporation Stiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lid
WO2002001630A3 (de) * 2000-06-28 2002-11-21 Eads Deutschland Gmbh Hermetisches hochfrequenzmodul und verfahren zur herstellung
EP1096563A3 (en) * 1999-10-27 2006-05-24 Nihon Dempa Kogyo Co., Ltd. Semiconductor package with premolded parts
EP1576652A4 (en) * 2002-06-19 2008-08-20 Foster Miller Inc CHIPKAPSELUNGS-SEALING PROCEDURE

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5151773A (en) * 1990-03-30 1992-09-29 Hitachi, Ltd. Electronic circuit apparatus comprising a structure for sealing an electronic circuit
US5436492A (en) * 1992-06-23 1995-07-25 Sony Corporation Charge-coupled device image sensor
FR2711462A1 (fr) * 1993-08-11 1995-04-28 Siemens Matsushita Components Composant électrique réalisé à la manière d'une microplaquette.
US5927505A (en) * 1995-07-24 1999-07-27 Lsi Logic Corporation Overmolded package body on a substrate
JPH09237901A (ja) * 1996-02-28 1997-09-09 S I I R D Center:Kk 半導体装置
US5889323A (en) * 1996-08-19 1999-03-30 Nec Corporation Semiconductor package and method of manufacturing the same
US5977622A (en) * 1997-04-25 1999-11-02 Lsi Logic Corporation Stiffener with slots for clip-on heat sink attachment
US6011304A (en) * 1997-05-05 2000-01-04 Lsi Logic Corporation Stiffener ring attachment with holes and removable snap-in heat sink or heat spreader/lid
EP1096563A3 (en) * 1999-10-27 2006-05-24 Nihon Dempa Kogyo Co., Ltd. Semiconductor package with premolded parts
WO2002001630A3 (de) * 2000-06-28 2002-11-21 Eads Deutschland Gmbh Hermetisches hochfrequenzmodul und verfahren zur herstellung
US6958669B2 (en) 2000-06-28 2005-10-25 Eads Deutschland Gmbh Hermetic high frequency module and method for producing the same
EP1576652A4 (en) * 2002-06-19 2008-08-20 Foster Miller Inc CHIPKAPSELUNGS-SEALING PROCEDURE
US7476566B2 (en) 2002-06-19 2009-01-13 Foster-Miller, Inc. Electronic and optoelectronic component packaging technique
US7972901B2 (en) 2002-06-19 2011-07-05 Foster-Miller, Inc. Chip package sealing method

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