JPS63137947U - - Google Patents

Info

Publication number
JPS63137947U
JPS63137947U JP3135187U JP3135187U JPS63137947U JP S63137947 U JPS63137947 U JP S63137947U JP 3135187 U JP3135187 U JP 3135187U JP 3135187 U JP3135187 U JP 3135187U JP S63137947 U JPS63137947 U JP S63137947U
Authority
JP
Japan
Prior art keywords
pattern
container
semiconductor device
fused
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3135187U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3135187U priority Critical patent/JPS63137947U/ja
Publication of JPS63137947U publication Critical patent/JPS63137947U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第1図は本考案の実施例の半導体装置用容器を
示す平面図、第2図は第1図の容器のA―A′線
に沿つて切断して見た断面図、第3図は従来の半
導体装置用容器の平面図、第4図は第3図の容器
のB―B′線に沿つて切断して見た断面図である
。 1……セラミツク基板、2,10……メタライ
ズパターン、3,11……外部リード接続用メタ
ライズパターン、4,9……セラミツク枠基板、
5,13……放熱板、6,14……外部接続用リ
ード、7……半導体チツプ、8……アルミニウム
ワイヤ、12……セラミツク枠基板。

Claims (1)

    【実用新案登録請求の範囲】
  1. メタライズ化された入出力接続用パターンを有
    するセラミツク基板に、半導体チツプの固着部を
    融着させた半導体装置用容器に於いて、前記パタ
    ーンを、容器本体の中心部に向つてしだいに細く
    すると共に、前記パターンの幅に略反比例するよ
    うに、このパターンの厚さをしだいに厚くするこ
    とを特徴とする半導体装置用容器。
JP3135187U 1987-03-03 1987-03-03 Pending JPS63137947U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3135187U JPS63137947U (ja) 1987-03-03 1987-03-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3135187U JPS63137947U (ja) 1987-03-03 1987-03-03

Publications (1)

Publication Number Publication Date
JPS63137947U true JPS63137947U (ja) 1988-09-12

Family

ID=30837003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3135187U Pending JPS63137947U (ja) 1987-03-03 1987-03-03

Country Status (1)

Country Link
JP (1) JPS63137947U (ja)

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