JPS6322056B2 - - Google Patents

Info

Publication number
JPS6322056B2
JPS6322056B2 JP54156789A JP15678979A JPS6322056B2 JP S6322056 B2 JPS6322056 B2 JP S6322056B2 JP 54156789 A JP54156789 A JP 54156789A JP 15678979 A JP15678979 A JP 15678979A JP S6322056 B2 JPS6322056 B2 JP S6322056B2
Authority
JP
Japan
Prior art keywords
film
semiconductor film
single crystal
amorphous
grain boundaries
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54156789A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5680126A (en
Inventor
Seiichi Iwamatsu
Mitsuru Ogawa
Kenichi Asanami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHO ERU ESU AI GIJUTSU KENKYU KUMIAI
Original Assignee
CHO ERU ESU AI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHO ERU ESU AI GIJUTSU KENKYU KUMIAI filed Critical CHO ERU ESU AI GIJUTSU KENKYU KUMIAI
Priority to JP15678979A priority Critical patent/JPS5680126A/ja
Publication of JPS5680126A publication Critical patent/JPS5680126A/ja
Publication of JPS6322056B2 publication Critical patent/JPS6322056B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/38Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
    • H10P14/3802Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/38Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
    • H10P14/3802Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H10P14/3808Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2902Materials being Group IVA materials
    • H10P14/2905Silicon, silicon germanium or germanium
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2921Materials being crystalline insulating materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202Materials thereof
    • H10P14/3238Materials thereof being insulating materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411Silicon, silicon germanium or germanium
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3451Structure
    • H10P14/3452Microstructure
    • H10P14/3458Monocrystalline
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3466Crystal orientation

Landscapes

  • Recrystallisation Techniques (AREA)
JP15678979A 1979-12-05 1979-12-05 Formation of monocrystalline semiconductor Granted JPS5680126A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15678979A JPS5680126A (en) 1979-12-05 1979-12-05 Formation of monocrystalline semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15678979A JPS5680126A (en) 1979-12-05 1979-12-05 Formation of monocrystalline semiconductor

Publications (2)

Publication Number Publication Date
JPS5680126A JPS5680126A (en) 1981-07-01
JPS6322056B2 true JPS6322056B2 (mo) 1988-05-10

Family

ID=15635334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15678979A Granted JPS5680126A (en) 1979-12-05 1979-12-05 Formation of monocrystalline semiconductor

Country Status (1)

Country Link
JP (1) JPS5680126A (mo)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0423046U (mo) * 1990-06-15 1992-02-25

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5837913A (ja) * 1981-08-28 1983-03-05 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS58175827A (ja) * 1982-04-07 1983-10-15 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPH0817157B2 (ja) * 1984-11-30 1996-02-21 ソニー株式会社 薄膜トランジスタの製造方法
JPH0824103B2 (ja) * 1984-11-26 1996-03-06 ソニー株式会社 薄膜トランジスタの製造方法
JPH0397224A (ja) * 1989-09-11 1991-04-23 Toshiba Corp 半導体装置の製造方法
KR0124626B1 (ko) * 1994-02-01 1997-12-11 문정환 박막 트랜지스터 제조방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0423046U (mo) * 1990-06-15 1992-02-25

Also Published As

Publication number Publication date
JPS5680126A (en) 1981-07-01

Similar Documents

Publication Publication Date Title
US4177084A (en) Method for producing a low defect layer of silicon-on-sapphire wafer
Lam et al. Single Crystal Silicon‐on‐Oxide by a Scanning CW Laser Induced Lateral Seeding Process
US4588447A (en) Method of eliminating p-type electrical activity and increasing channel mobility of Si-implanted and recrystallized SOS films
JPH0582442A (ja) 多結晶半導体薄膜の製造方法
US4693758A (en) Method of making devices in silicon, on insulator regrown by laser beam
JPS6322056B2 (mo)
JPS58156591A (ja) 半導体単結晶薄膜の形成法
JPS59155121A (ja) 半導体薄膜の製造方法
JPH05299345A (ja) 電子素子用基板及びその製造方法
JPH0454964B2 (mo)
JPH0582466A (ja) 半導体層のアニール処理方法
JPH023539B2 (mo)
JP2981777B2 (ja) 半導体基板の製造方法
JP2850319B2 (ja) シリコン薄膜の形成方法
JP2518378B2 (ja) 半導体装置の製造方法
JPH0533527B2 (mo)
JPS58175844A (ja) 半導体装置の製造方法
JPH0620056B2 (ja) CaF▲下2▼膜成長方法
JP2695462B2 (ja) 結晶性半導体膜及びその形成方法
JPH09246129A (ja) 貼り合わせシリコンウエーハの製造方法
JPS5860530A (ja) 半導体膜の製造方法
JPH077829B2 (ja) 半導体装置およびその製法
JPS61116821A (ja) 単結晶薄膜の形成方法
JPH0793259B2 (ja) 半導体薄膜結晶層の製造方法
JPH0799742B2 (ja) 半導体装置の製造方法