JPS6331494B2 - - Google Patents

Info

Publication number: JPS6331494B2
Authority: JP; Japan
Prior art keywords: formula; component; general formula; carbon atoms; epoxy resin
Prior art date: 1984-10-05
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP60504529A

Other languages

English (en)

Japanese (ja)

Other versions

JPS61501712A (ja

Inventor

Kurisuchiinu Shii Baakufueruto

Jodeii Aaru Baaman

Deeru Jei Arudoritsuchi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Dow Chemical Co

Original Assignee

Dow Chemical Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1984-10-05

Filing date

1985-09-30

Publication date

1988-06-24

1985-09-30 Application filed by Dow Chemical Co filed Critical Dow Chemical Co

1986-08-14 Publication of JPS61501712A publication Critical patent/JPS61501712A/ja

1988-06-24 Publication of JPS6331494B2 publication Critical patent/JPS6331494B2/ja

Status Granted legal-status Critical Current

Links

239000000203 mixture Substances 0.000 description 35
239000003822 epoxy resin Substances 0.000 description 27
229920000647 polyepoxide Polymers 0.000 description 27
125000004432 carbon atom Chemical group C* 0.000 description 26
125000001183 hydrocarbyl group Chemical group 0.000 description 21
ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 18
229910052739 hydrogen Inorganic materials 0.000 description 15
239000001257 hydrogen Substances 0.000 description 15
RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 14
125000000524 functional group Chemical group 0.000 description 14
229920005989 resin Polymers 0.000 description 13
239000011347 resin Substances 0.000 description 13
229920003986 novolac Polymers 0.000 description 11
239000004593 Epoxy Substances 0.000 description 10
VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 9
QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
150000002118 epoxides Chemical group 0.000 description 9
229910052736 halogen Inorganic materials 0.000 description 9
150000002367 halogens Chemical class 0.000 description 9
239000003381 stabilizer Substances 0.000 description 9
239000003054 catalyst Substances 0.000 description 8
239000000243 solution Substances 0.000 description 8
239000000758 substrate Substances 0.000 description 8
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 7
229910052794 bromium Inorganic materials 0.000 description 7
150000002431 hydrogen Chemical group 0.000 description 7
ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
229910052802 copper Inorganic materials 0.000 description 6
239000010949 copper Substances 0.000 description 6
239000011521 glass Substances 0.000 description 6
ZRYCRPNCXLQHPN-UHFFFAOYSA-N 3-hydroxy-2-methylbenzaldehyde Chemical compound CC1=C(O)C=CC=C1C=O ZRYCRPNCXLQHPN-UHFFFAOYSA-N 0.000 description 5
CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
239000004744 fabric Substances 0.000 description 5
SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 5
238000009472 formulation Methods 0.000 description 5
125000004435 hydrogen atom Chemical group [H]* 0.000 description 5
235000013824 polyphenols Nutrition 0.000 description 5
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
125000001246 bromo group Chemical group Br* 0.000 description 4
238000006243 chemical reaction Methods 0.000 description 4
150000001875 compounds Chemical class 0.000 description 4
239000000463 material Substances 0.000 description 4
VUQUOGPMUUJORT-UHFFFAOYSA-N methyl 4-methylbenzenesulfonate Chemical compound COS(=O)(=O)C1=CC=C(C)C=C1 VUQUOGPMUUJORT-UHFFFAOYSA-N 0.000 description 4
229920001568 phenolic resin Polymers 0.000 description 4
150000002989 phenols Chemical class 0.000 description 4
-1 tetramethyl ammonium hydroxy tetrabutylammonium hydroxide Chemical compound 0.000 description 4
VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 3
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
238000002360 preparation method Methods 0.000 description 3
239000002904 solvent Substances 0.000 description 3
GFZMLBWMGBLIDI-UHFFFAOYSA-M tetrabutylphosphanium;acetate Chemical compound CC([O-])=O.CCCC[P+](CCCC)(CCCC)CCCC GFZMLBWMGBLIDI-UHFFFAOYSA-M 0.000 description 3
239000002966 varnish Substances 0.000 description 3
LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
229930185605 Bisphenol Natural products 0.000 description 2
239000002970 Calcium lactobionate Substances 0.000 description 2
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
239000007983 Tris buffer Substances 0.000 description 2
XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
125000000217 alkyl group Chemical group 0.000 description 2
229910052782 aluminium Inorganic materials 0.000 description 2
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
BEVHTMLFDWFAQF-UHFFFAOYSA-N butyl(triphenyl)phosphanium Chemical compound C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCCC)C1=CC=CC=C1 BEVHTMLFDWFAQF-UHFFFAOYSA-N 0.000 description 2
230000003197 catalytic effect Effects 0.000 description 2
238000000576 coating method Methods 0.000 description 2
239000004020 conductor Substances 0.000 description 2
238000000354 decomposition reaction Methods 0.000 description 2
HZZUMXSLPJFMCB-UHFFFAOYSA-M ethyl(triphenyl)phosphanium;acetate Chemical compound CC([O-])=O.C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 HZZUMXSLPJFMCB-UHFFFAOYSA-M 0.000 description 2
XJPISZINQYKKLE-UHFFFAOYSA-L ethyl(triphenyl)phosphanium;diacetate Chemical compound CC([O-])=O.CC([O-])=O.C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1.C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 XJPISZINQYKKLE-UHFFFAOYSA-L 0.000 description 2
LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
229940015043 glyoxal Drugs 0.000 description 2
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
229910052751 metal Inorganic materials 0.000 description 2
239000002184 metal Substances 0.000 description 2
150000002739 metals Chemical class 0.000 description 2
239000006082 mold release agent Substances 0.000 description 2
238000000465 moulding Methods 0.000 description 2
GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 description 1
QDVRLSZFHDYWNH-UHFFFAOYSA-N 2,3-dimethylbenzaldehyde;2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C.CC1=CC=CC(C=O)=C1C QDVRLSZFHDYWNH-UHFFFAOYSA-N 0.000 description 1
JHJUYGMZIWDHMO-UHFFFAOYSA-N 2,6-dibromo-4-(3,5-dibromo-4-hydroxyphenyl)sulfonylphenol Chemical compound C1=C(Br)C(O)=C(Br)C=C1S(=O)(=O)C1=CC(Br)=C(O)C(Br)=C1 JHJUYGMZIWDHMO-UHFFFAOYSA-N 0.000 description 1
DGXAGETVRDOQFP-UHFFFAOYSA-N 2,6-dihydroxybenzaldehyde Chemical compound OC1=CC=CC(O)=C1C=O DGXAGETVRDOQFP-UHFFFAOYSA-N 0.000 description 1
LJBWJFWNFUKAGS-UHFFFAOYSA-N 2-[bis(2-hydroxyphenyl)methyl]phenol Chemical compound OC1=CC=CC=C1C(C=1C(=CC=CC=1)O)C1=CC=CC=C1O LJBWJFWNFUKAGS-UHFFFAOYSA-N 0.000 description 1
DTMJOBZCHQINTP-UHFFFAOYSA-N 2-chloro-3-methylbenzenesulfonic acid Chemical compound CC1=CC=CC(S(O)(=O)=O)=C1Cl DTMJOBZCHQINTP-UHFFFAOYSA-N 0.000 description 1
CDFCBRMXZKAKKI-UHFFFAOYSA-N 2-hydroxybenzaldehyde;phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1C=O CDFCBRMXZKAKKI-UHFFFAOYSA-N 0.000 description 1
DUVKXNKIYKAUPK-UHFFFAOYSA-N acetic acid;triphenylphosphane Chemical compound CC(O)=O.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 DUVKXNKIYKAUPK-UHFFFAOYSA-N 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
150000001298 alcohols Chemical class 0.000 description 1
150000001299 aldehydes Chemical class 0.000 description 1
150000001408 amides Chemical class 0.000 description 1
150000003868 ammonium compounds Chemical class 0.000 description 1
RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical class [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
YOUGRGFIHBUKRS-UHFFFAOYSA-N benzyl(trimethyl)azanium Chemical compound C[N+](C)(C)CC1=CC=CC=C1 YOUGRGFIHBUKRS-UHFFFAOYSA-N 0.000 description 1
KXHPPCXNWTUNSB-UHFFFAOYSA-M benzyl(trimethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1=CC=CC=C1 KXHPPCXNWTUNSB-UHFFFAOYSA-M 0.000 description 1
NDKBVBUGCNGSJJ-UHFFFAOYSA-M benzyltrimethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)CC1=CC=CC=C1 NDKBVBUGCNGSJJ-UHFFFAOYSA-M 0.000 description 1
INUWWXIBGXPQNP-UHFFFAOYSA-M butyl(triphenyl)phosphanium;hydrogen carbonate Chemical compound OC([O-])=O.C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCCC)C1=CC=CC=C1 INUWWXIBGXPQNP-UHFFFAOYSA-M 0.000 description 1
239000002775 capsule Substances 0.000 description 1
229910052799 carbon Inorganic materials 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
230000000052 comparative effect Effects 0.000 description 1
239000002131 composite material Substances 0.000 description 1
238000001816 cooling Methods 0.000 description 1
239000011889 copper foil Substances 0.000 description 1
230000032798 delamination Effects 0.000 description 1
238000000113 differential scanning calorimetry Methods 0.000 description 1
GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
239000003085 diluting agent Substances 0.000 description 1
XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
239000000975 dye Substances 0.000 description 1
230000000694 effects Effects 0.000 description 1
229920001971 elastomer Polymers 0.000 description 1
VRZVPALEJCLXPR-UHFFFAOYSA-N ethyl 4-methylbenzenesulfonate Chemical compound CCOS(=O)(=O)C1=CC=C(C)C=C1 VRZVPALEJCLXPR-UHFFFAOYSA-N 0.000 description 1
GELSOTNVVKOYAW-UHFFFAOYSA-N ethyl(triphenyl)phosphanium Chemical compound C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 GELSOTNVVKOYAW-UHFFFAOYSA-N 0.000 description 1
JHYNXXDQQHTCHJ-UHFFFAOYSA-M ethyl(triphenyl)phosphanium;bromide Chemical compound [Br-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 JHYNXXDQQHTCHJ-UHFFFAOYSA-M 0.000 description 1
NJXBVBPTDHBAID-UHFFFAOYSA-M ethyl(triphenyl)phosphanium;chloride Chemical compound [Cl-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 NJXBVBPTDHBAID-UHFFFAOYSA-M 0.000 description 1
SLAFUPJSGFVWPP-UHFFFAOYSA-M ethyl(triphenyl)phosphanium;iodide Chemical compound [I-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 SLAFUPJSGFVWPP-UHFFFAOYSA-M 0.000 description 1
LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
239000000835 fiber Substances 0.000 description 1
239000000945 filler Substances 0.000 description 1
239000003063 flame retardant Substances 0.000 description 1
238000001879 gelation Methods 0.000 description 1
230000009477 glass transition Effects 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
239000004615 ingredient Substances 0.000 description 1
150000002576 ketones Chemical class 0.000 description 1
238000005259 measurement Methods 0.000 description 1
238000002844 melting Methods 0.000 description 1
230000008018 melting Effects 0.000 description 1
238000000034 method Methods 0.000 description 1
238000002156 mixing Methods 0.000 description 1
239000003607 modifier Substances 0.000 description 1
ZEOQPNRYUCROGZ-UHFFFAOYSA-N n,n-dibutylbutan-1-amine;hydrobromide Chemical compound [Br-].CCCC[NH+](CCCC)CCCC ZEOQPNRYUCROGZ-UHFFFAOYSA-N 0.000 description 1
XEWVCDMEDQYCHX-UHFFFAOYSA-N n,n-diethylethanamine;hydron;iodide Chemical compound [I-].CC[NH+](CC)CC XEWVCDMEDQYCHX-UHFFFAOYSA-N 0.000 description 1
229910052757 nitrogen Inorganic materials 0.000 description 1
239000012299 nitrogen atmosphere Substances 0.000 description 1
150000007523 nucleic acids Chemical class 0.000 description 1
102000039446 nucleic acids Human genes 0.000 description 1
108020004707 nucleic acids Proteins 0.000 description 1
230000000737 periodic effect Effects 0.000 description 1
XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 description 1
230000000704 physical effect Effects 0.000 description 1
239000000049 pigment Substances 0.000 description 1
239000004033 plastic Substances 0.000 description 1
229920003023 plastic Polymers 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
150000008442 polyphenolic compounds Chemical class 0.000 description 1
239000010453 quartz Substances 0.000 description 1
150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
125000001453 quaternary ammonium group Chemical group 0.000 description 1
150000004023 quaternary phosphonium compounds Chemical class 0.000 description 1
239000000376 reactant Substances 0.000 description 1
239000012744 reinforcing agent Substances 0.000 description 1
239000005060 rubber Substances 0.000 description 1
VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
230000000087 stabilizing effect Effects 0.000 description 1
239000000126 substance Substances 0.000 description 1
239000004094 surface-active agent Substances 0.000 description 1
239000012209 synthetic fiber Substances 0.000 description 1
229920002994 synthetic fiber Polymers 0.000 description 1
150000003512 tertiary amines Chemical class 0.000 description 1
DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 description 1
BJQWBACJIAKDTJ-UHFFFAOYSA-N tetrabutylphosphanium Chemical compound CCCC[P+](CCCC)(CCCC)CCCC BJQWBACJIAKDTJ-UHFFFAOYSA-N 0.000 description 1
VCENTMAPZCSHBO-UHFFFAOYSA-L tetrabutylphosphanium diacetate Chemical compound CC([O-])=O.CC([O-])=O.CCCC[P+](CCCC)(CCCC)CCCC.CCCC[P+](CCCC)(CCCC)CCCC VCENTMAPZCSHBO-UHFFFAOYSA-L 0.000 description 1
IBWGNZVCJVLSHB-UHFFFAOYSA-M tetrabutylphosphanium;chloride Chemical compound [Cl-].CCCC[P+](CCCC)(CCCC)CCCC IBWGNZVCJVLSHB-UHFFFAOYSA-M 0.000 description 1
IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
IMFACGCPASFAPR-UHFFFAOYSA-O tributylazanium Chemical compound CCCC[NH+](CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-O 0.000 description 1
KLBOFRLEHJAXIU-UHFFFAOYSA-N tributylazanium;chloride Chemical compound Cl.CCCCN(CCCC)CCCC KLBOFRLEHJAXIU-UHFFFAOYSA-N 0.000 description 1
FRLRKOBIHDUBMS-UHFFFAOYSA-N tributylazanium;iodide Chemical compound [I-].CCCC[NH+](CCCC)CCCC FRLRKOBIHDUBMS-UHFFFAOYSA-N 0.000 description 1
ZMANZCXQSJIPKH-UHFFFAOYSA-O triethylammonium ion Chemical compound CC[NH+](CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-O 0.000 description 1
NRTLTGGGUQIRRT-UHFFFAOYSA-N triethylazanium;bromide Chemical compound [Br-].CC[NH+](CC)CC NRTLTGGGUQIRRT-UHFFFAOYSA-N 0.000 description 1
ILWRPSCZWQJDMK-UHFFFAOYSA-N triethylazanium;chloride Chemical compound Cl.CCN(CC)CC ILWRPSCZWQJDMK-UHFFFAOYSA-N 0.000 description 1
YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
229910052727 yttrium Inorganic materials 0.000 description 1
239000011787 zinc oxide Substances 0.000 description 1

Landscapes

Laminated Bodies (AREA)
Compositions Of Macromolecular Compounds (AREA)
Epoxy Resins (AREA)
Reinforced Plastic Materials (AREA)

JP60504529A 1984-10-05 1985-09-30 ポリエポキシドとハロゲン化二価フエノールとを含有するキユア性組成物 Granted JPS61501712A (ja)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date
US65808384A	1984-10-05	1984-10-05
US658083		1984-10-05
US737591		1985-05-24

Publications (2)

Publication Number	Publication Date
JPS61501712A JPS61501712A (ja)	1986-08-14
JPS6331494B2 true JPS6331494B2 (da)	1988-06-24

Family

ID=24639827

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
JP60504529A Granted JPS61501712A (ja)	1984-10-05	1985-09-30	ポリエポキシドとハロゲン化二価フエノールとを含有するキユア性組成物
JP62280256A Granted JPS63153133A (ja)	1984-10-05	1987-11-05	ポリエポキシドとハロゲン化二価フェノールとを含有するキュア性組成物から作られたラミネート

Family Applications After (1)

Application Number	Title	Priority Date	Filing Date
JP62280256A Granted JPS63153133A (ja)	1984-10-05	1987-11-05	ポリエポキシドとハロゲン化二価フェノールとを含有するキュア性組成物から作られたラミネート

Country Status (1)

Country	Link
JP (2)	JPS61501712A (da)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5186985A (en) *	1991-04-04	1993-02-16	E. I. Du Pont De Nemours And Company	Liquid crystal displays of high tilt bias angles

1985
- 1985-09-30 JP JP60504529A patent/JPS61501712A/ja active Granted
1987
- 1987-11-05 JP JP62280256A patent/JPS63153133A/ja active Granted

Also Published As

Publication number	Publication date
JPS61501712A (ja)	1986-08-14
JPH0531470B2 (da)	1993-05-12
JPS63153133A (ja)	1988-06-25

Legal Events

Date	Code	Title	Description
2003-06-24	LAPS	Cancellation because of no payment of annual fees

Publication	Publication Date	Title
EP0205455B1 (en)	1991-03-13	Curable compositions containing a polyepoxide and a halogenated dihydric phenol and impregnated substrates and laminates prepared therefrom
US4594291A (en)	1986-06-10	Curable, partially advanced epoxy resins
US4868059A (en)	1989-09-19	Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
EP0187855B1 (en)	1993-02-10	Partially advanced epoxy resin compositions and products resulting from reacting and curing said compositions
BRPI0621083A2 (pt)	2011-11-29	composição de resina epóxi curável contendo halogênio, artigo compósito reforçado com fibra, componente de circuito elétrico, processo para produzir um artigo revestido, pré- impregnado, laminado, placa de circuito impresso (pcb), processo para preparar um artigo revestido com resina, e artigo revestido com resina
BRPI0621068A2 (pt)	2011-11-29	composição de resina epóxi contendo halogênio curável, artigo compósito reforçado com fibra, componente de circuito elétrico, processo para produzir um artigo revestido, pré-impregnado, laminado, placa de circuito impresso (pcb), processo para preparar um artigo revestido com resina, e artigo revestido com resina
CN108440901A (zh)	2018-08-24	一种高频树脂组合物及使用其制备的半固化片、层间绝缘膜及层压板
US5066735A (en)	1991-11-19	Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
EP0260571B1 (en)	1993-06-30	Halogenated epoxy resins and advanced resins prepared therefrom
EP0239784B1 (en)	1992-05-06	Curable compositions containing a polyepoxide and a halogenated bisphenol
KR900008962B1 (ko)	1990-12-15	트리글리시딜 에테르 및 2가 페놀로부터 제조된 개선된 에폭시 수지
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JPS6331494B2 (da)	1988-06-24
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