JPS6334268Y2 - - Google Patents

Info

Publication number
JPS6334268Y2
JPS6334268Y2 JP1981179740U JP17974081U JPS6334268Y2 JP S6334268 Y2 JPS6334268 Y2 JP S6334268Y2 JP 1981179740 U JP1981179740 U JP 1981179740U JP 17974081 U JP17974081 U JP 17974081U JP S6334268 Y2 JPS6334268 Y2 JP S6334268Y2
Authority
JP
Japan
Prior art keywords
pellet
electrode
markings
marking
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981179740U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5883149U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981179740U priority Critical patent/JPS5883149U/ja
Publication of JPS5883149U publication Critical patent/JPS5883149U/ja
Application granted granted Critical
Publication of JPS6334268Y2 publication Critical patent/JPS6334268Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07552—Controlling the environment, e.g. atmosphere composition or temperature changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/527—Multiple bond wires having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Die Bonding (AREA)
JP1981179740U 1981-11-30 1981-11-30 半導体装置 Granted JPS5883149U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981179740U JPS5883149U (ja) 1981-11-30 1981-11-30 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981179740U JPS5883149U (ja) 1981-11-30 1981-11-30 半導体装置

Publications (2)

Publication Number Publication Date
JPS5883149U JPS5883149U (ja) 1983-06-06
JPS6334268Y2 true JPS6334268Y2 (2) 1988-09-12

Family

ID=29975706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981179740U Granted JPS5883149U (ja) 1981-11-30 1981-11-30 半導体装置

Country Status (1)

Country Link
JP (1) JPS5883149U (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010074499A (ja) * 2008-09-18 2010-04-02 Panasonic Electric Works Co Ltd リレー装置

Also Published As

Publication number Publication date
JPS5883149U (ja) 1983-06-06

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