JPS6352775B2 - - Google Patents

Info

Publication number
JPS6352775B2
JPS6352775B2 JP56052232A JP5223281A JPS6352775B2 JP S6352775 B2 JPS6352775 B2 JP S6352775B2 JP 56052232 A JP56052232 A JP 56052232A JP 5223281 A JP5223281 A JP 5223281A JP S6352775 B2 JPS6352775 B2 JP S6352775B2
Authority
JP
Japan
Prior art keywords
lead frame
pellet
wire
wire bonding
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56052232A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57166041A (en
Inventor
Shige Yamada
Yasuo Sakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56052232A priority Critical patent/JPS57166041A/ja
Publication of JPS57166041A publication Critical patent/JPS57166041A/ja
Publication of JPS6352775B2 publication Critical patent/JPS6352775B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP56052232A 1981-04-07 1981-04-07 Wire bonding method Granted JPS57166041A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56052232A JPS57166041A (en) 1981-04-07 1981-04-07 Wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56052232A JPS57166041A (en) 1981-04-07 1981-04-07 Wire bonding method

Publications (2)

Publication Number Publication Date
JPS57166041A JPS57166041A (en) 1982-10-13
JPS6352775B2 true JPS6352775B2 (2) 1988-10-20

Family

ID=12908977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56052232A Granted JPS57166041A (en) 1981-04-07 1981-04-07 Wire bonding method

Country Status (1)

Country Link
JP (1) JPS57166041A (2)

Also Published As

Publication number Publication date
JPS57166041A (en) 1982-10-13

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