JPS6361127U - - Google Patents

Info

Publication number
JPS6361127U
JPS6361127U JP1986155686U JP15568686U JPS6361127U JP S6361127 U JPS6361127 U JP S6361127U JP 1986155686 U JP1986155686 U JP 1986155686U JP 15568686 U JP15568686 U JP 15568686U JP S6361127 U JPS6361127 U JP S6361127U
Authority
JP
Japan
Prior art keywords
counterbore
metallized layer
insulating substrate
conductive adhesive
smaller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986155686U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986155686U priority Critical patent/JPS6361127U/ja
Publication of JPS6361127U publication Critical patent/JPS6361127U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Die Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】
第１図ａ，ｂはそれぞれこの考案による半導体
装置の平面図および縦断正面図、第２図ａ，ｂは
それぞれ従来の半導体装置の正常時の縦断正面図
および異常時の縦断正面図である。 １……絶縁性基板、２……ザグリ部、３……半
導体素子、５……導電性接着剤、１０……ダイス
パツドメタライズ層、１１……溝。

Claims (1)

    【実用新案登録請求の範囲】
  1. ザグリ部を形成された絶縁性基板と、ザグリ部
    の底面に形成され該底面より面積が小さなメタラ
    イズ層と、このメタライズ層上に導電性接着剤を
    介して接着された半導体素子を備えたことを特徴
    とする半導体装置。
JP1986155686U 1986-10-13 1986-10-13 Pending JPS6361127U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986155686U JPS6361127U (ja) 1986-10-13 1986-10-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986155686U JPS6361127U (ja) 1986-10-13 1986-10-13

Publications (1)

Publication Number Publication Date
JPS6361127U true JPS6361127U (ja) 1988-04-22

Family

ID=31076608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986155686U Pending JPS6361127U (ja) 1986-10-13 1986-10-13

Country Status (1)

Country Link
JP (1) JPS6361127U (ja)

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