JPS6440586A - Adhesive composition - Google Patents

Adhesive composition

Info

Publication number: JPS6440586A
Authority: JP; Japan
Prior art keywords: filler; polyimide precursor; powder; aluminum powder; nitride powder
Prior art date: 1987-08-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP19866387A

Other languages

English (en)

Inventor

Nobuo Ichimura

Iwao Maekawa

Mitsuo Yamazaki

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Resonac Corp

Original Assignee

Hitachi Chemical Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-08-07

Filing date

1987-08-07

Publication date

1989-02-10

1987-08-07 Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd

1987-08-07 Priority to JP19866387A priority Critical patent/JPS6440586A/ja

1989-02-10 Publication of JPS6440586A publication Critical patent/JPS6440586A/ja

Status Pending legal-status Critical Current

Links

239000000203 mixture Substances 0.000 title abstract 3
239000000853 adhesive Substances 0.000 title 1
230000001070 adhesive effect Effects 0.000 title 1
239000004642 Polyimide Substances 0.000 abstract 5
239000000945 filler Substances 0.000 abstract 5
229920001721 polyimide Polymers 0.000 abstract 5
239000002243 precursor Substances 0.000 abstract 5
239000000843 powder Substances 0.000 abstract 3
SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical group CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 abstract 2
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 2
239000004065 semiconductor Substances 0.000 abstract 2
229910052582 BN Inorganic materials 0.000 abstract 1
PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 abstract 1
229910052581 Si3N4 Inorganic materials 0.000 abstract 1
150000004984 aromatic diamines Chemical class 0.000 abstract 1
230000015572 biosynthetic process Effects 0.000 abstract 1
WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 abstract 1
238000013329 compounding Methods 0.000 abstract 1
229910003460 diamond Inorganic materials 0.000 abstract 1
239000010432 diamond Substances 0.000 abstract 1
239000002245 particle Substances 0.000 abstract 1
238000007789 sealing Methods 0.000 abstract 1
HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 abstract 1
229910010271 silicon carbide Inorganic materials 0.000 abstract 1
HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract 1
239000002904 solvent Substances 0.000 abstract 1
239000000758 substrate Substances 0.000 abstract 1
238000003786 synthesis reaction Methods 0.000 abstract 1

Landscapes

Compositions Of Macromolecular Compounds (AREA)
Adhesives Or Adhesive Processes (AREA)
Die Bonding (AREA)

JP19866387A 1987-08-07 1987-08-07 Adhesive composition Pending JPS6440586A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP19866387A JPS6440586A (en)	1987-08-07	1987-08-07	Adhesive composition

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP19866387A JPS6440586A (en)	1987-08-07	1987-08-07	Adhesive composition

Publications (1)

Publication Number	Publication Date
JPS6440586A true JPS6440586A (en)	1989-02-10

Family

ID=16394972

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP19866387A Pending JPS6440586A (en)	1987-08-07	1987-08-07	Adhesive composition

Country Status (1)

Country	Link
JP (1)	JPS6440586A (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6385753U (ja) *	1986-11-25	1988-06-04
JPH0377276A (ja) *	1989-08-17	1991-04-02	Tokai Carbon Co Ltd	燃料電池用炭素質複合部材の製造方法
JPH059455A (ja) *	1991-07-02	1993-01-19	Sumitomo Bakelite Co Ltd	気密封止用接着剤
JPH05117598A (ja) *	1991-10-29	1993-05-14	Sumitomo Bakelite Co Ltd	熱圧着可能な高熱伝導性フイルム状接着剤
JPH05117597A (ja) *	1991-10-29	1993-05-14	Sumitomo Bakelite Co Ltd	熱圧着可能な高熱伝導性フイルム状接着剤
JPH05117599A (ja) *	1991-10-29	1993-05-14	Sumitomo Bakelite Co Ltd	熱圧着可能な高熱伝導性フイルム状接着剤
JPH05335354A (ja) *	1992-06-02	1993-12-17	Sumitomo Bakelite Co Ltd	接着剤付半導体素子
JP2004161830A (ja) *	2002-11-11	2004-06-10	Murata Mfg Co Ltd	ポリイミド前駆体ペーストの製造方法、およびポリイミド前駆体ペースト並びにこれを用いたポリイミド膜
US7252795B2 (en)	2003-08-26	2007-08-07	Matsushita Electric Industrial Co., Ltd.	High thermal conductivite element, method for manufacturing same, and heat radiating system

Citations (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS559642A (en) *	1978-07-07	1980-01-23	Asahi Chem Ind Co Ltd	Production of heat-resistant resin paste
JPS559643A (en) *	1978-07-07	1980-01-23	Asahi Chem Ind Co Ltd	Production of heat-resistant resin paste
JPS5860563A (ja) *	1981-10-06	1983-04-11	Mitsubishi Electric Corp	電子部品の保護膜
JPS5922974A (ja) *	1982-07-29	1984-02-06	Toshiba Corp	耐熱性接着剤
JPS6049031A (ja) *	1983-08-29	1985-03-18	Japan Synthetic Rubber Co Ltd	ポリアミツク酸溶液の製造方法
JPS60139755A (ja) *	1983-12-27	1985-07-24	Ube Ind Ltd	電気絶縁組成物
JPS60206884A (ja) *	1984-03-30	1985-10-18	Nitto Electric Ind Co Ltd	導電性ペ−スト組成物
JPS61145266A (ja) *	1984-12-19	1986-07-02	Sumitomo Electric Ind Ltd	接着剤

1987
- 1987-08-07 JP JP19866387A patent/JPS6440586A/ja active Pending

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS559642A (en) *	1978-07-07	1980-01-23	Asahi Chem Ind Co Ltd	Production of heat-resistant resin paste
JPS559643A (en) *	1978-07-07	1980-01-23	Asahi Chem Ind Co Ltd	Production of heat-resistant resin paste
JPS5860563A (ja) *	1981-10-06	1983-04-11	Mitsubishi Electric Corp	電子部品の保護膜
JPS5922974A (ja) *	1982-07-29	1984-02-06	Toshiba Corp	耐熱性接着剤
JPS6049031A (ja) *	1983-08-29	1985-03-18	Japan Synthetic Rubber Co Ltd	ポリアミツク酸溶液の製造方法
JPS60139755A (ja) *	1983-12-27	1985-07-24	Ube Ind Ltd	電気絶縁組成物
JPS60206884A (ja) *	1984-03-30	1985-10-18	Nitto Electric Ind Co Ltd	導電性ペ−スト組成物
JPS61145266A (ja) *	1984-12-19	1986-07-02	Sumitomo Electric Ind Ltd	接着剤

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6385753U (ja) *	1986-11-25	1988-06-04
JPH0377276A (ja) *	1989-08-17	1991-04-02	Tokai Carbon Co Ltd	燃料電池用炭素質複合部材の製造方法
JPH059455A (ja) *	1991-07-02	1993-01-19	Sumitomo Bakelite Co Ltd	気密封止用接着剤
JPH05117598A (ja) *	1991-10-29	1993-05-14	Sumitomo Bakelite Co Ltd	熱圧着可能な高熱伝導性フイルム状接着剤
JPH05117597A (ja) *	1991-10-29	1993-05-14	Sumitomo Bakelite Co Ltd	熱圧着可能な高熱伝導性フイルム状接着剤
JPH05117599A (ja) *	1991-10-29	1993-05-14	Sumitomo Bakelite Co Ltd	熱圧着可能な高熱伝導性フイルム状接着剤
JPH05335354A (ja) *	1992-06-02	1993-12-17	Sumitomo Bakelite Co Ltd	接着剤付半導体素子
JP2004161830A (ja) *	2002-11-11	2004-06-10	Murata Mfg Co Ltd	ポリイミド前駆体ペーストの製造方法、およびポリイミド前駆体ペースト並びにこれを用いたポリイミド膜
US7252795B2 (en)	2003-08-26	2007-08-07	Matsushita Electric Industrial Co., Ltd.	High thermal conductivite element, method for manufacturing same, and heat radiating system
US7402340B2 (en)	2003-08-26	2008-07-22	Matsushita Electric Industrial Co., Ltd.	High thermal conductive element, method for manufacturing same, and heat radiating system

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