NL7204573A - - Google Patents

Info

Publication number
NL7204573A
NL7204573A NL7204573A NL7204573A NL7204573A NL 7204573 A NL7204573 A NL 7204573A NL 7204573 A NL7204573 A NL 7204573A NL 7204573 A NL7204573 A NL 7204573A NL 7204573 A NL7204573 A NL 7204573A
Authority
NL
Netherlands
Prior art keywords
chisels
tongs
conductor
arms
conductors
Prior art date
Application number
NL7204573A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL7204573A priority Critical patent/NL7204573A/xx
Priority to DE19732314195 priority patent/DE2314195A1/de
Priority to GB1590373A priority patent/GB1417885A/en
Priority to IT67952/73A priority patent/IT980750B/it
Priority to JP48037952A priority patent/JPS4917968A/ja
Priority to FR7312122A priority patent/FR2179102B1/fr
Publication of NL7204573A publication Critical patent/NL7204573A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
NL7204573A 1972-04-06 1972-04-06 NL7204573A (2)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL7204573A NL7204573A (2) 1972-04-06 1972-04-06
DE19732314195 DE2314195A1 (de) 1972-04-06 1973-03-22 Verfahren und vorrichtung zur herstellung von halbleiteranordnungen
GB1590373A GB1417885A (en) 1972-04-06 1973-04-03 Method and apparatus for manufacturing a semiconductor device
IT67952/73A IT980750B (it) 1972-04-06 1973-04-03 Procedimento e dispositivo per la fabbricazione di dispositivi semi conduttori
JP48037952A JPS4917968A (2) 1972-04-06 1973-04-04
FR7312122A FR2179102B1 (2) 1972-04-06 1973-04-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7204573A NL7204573A (2) 1972-04-06 1972-04-06

Publications (1)

Publication Number Publication Date
NL7204573A true NL7204573A (2) 1973-10-09

Family

ID=19815785

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7204573A NL7204573A (2) 1972-04-06 1972-04-06

Country Status (6)

Country Link
JP (1) JPS4917968A (2)
DE (1) DE2314195A1 (2)
FR (1) FR2179102B1 (2)
GB (1) GB1417885A (2)
IT (1) IT980750B (2)
NL (1) NL7204573A (2)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2923440A1 (de) * 1979-06-09 1980-12-11 Itt Ind Gmbh Deutsche Verfahren zum befestigen und/oder elektrischen verbinden von halbleiterkoerpern und/oder von deren elektrisch leitenden metallteilen
JP3719630B2 (ja) 1998-05-22 2005-11-24 日立粉末冶金株式会社 耐摩耗性焼結合金およびその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL142018B (nl) * 1964-11-26 1974-04-16 Philips Nv Werkwijze tot het vervaardigen van een halfgeleidende inrichting en inrichting vervaardigd volgens de werkwijze.

Also Published As

Publication number Publication date
GB1417885A (en) 1975-12-17
JPS4917968A (2) 1974-02-16
DE2314195A1 (de) 1973-10-18
FR2179102A1 (2) 1973-11-16
FR2179102B1 (2) 1978-02-10
IT980750B (it) 1974-10-10

Similar Documents

Publication Publication Date Title
US2977672A (en) Method of making bonded wire circuit
US3431092A (en) Lead frame members for semiconductor devices
US3613001A (en) Probe assembly
US3685137A (en) Method for manufacturing wire bonded integrated circuit devices
CN111293567A (zh) 一种电子元器件自动化压接机
FR2179102B1 (2)
US4006519A (en) Apparatus for making tap connections to multi-conductor cable
ES332615A1 (es) Un dispositivo conectador para efectuar una conexion electrica a un cable de cinta.
JPH02284455A (ja) 半導体装置のリード成型方法
US3186446A (en) Apparatus for attaching filamentary material
GB1191098A (en) Apparatus for Trimming Wires and Electrically Connecting the Trimmed Ends of the Wires
JPH04247631A (ja) ワイヤボンディング装置
US6037789A (en) Wiping contacts
JPH0228262B2 (2)
JPH0342382Y2 (2)
JPH04180643A (ja) モールドｉｃのコネクター内蔵リード成形型
GB903476A (en) Electrical semiconductor device
JPH0432243A (ja) 半導体装置及びその製造方法
JPH03175366A (ja) 試験用配線端子接続工具
JPS61211977A (ja) ソケツト
JPH0316007Y2 (2)
JP2530126Y2 (ja) Ｉｃソケット用コンタクトピン
JPS5827332A (ja) リードフレームを用いた半導体装置の製造方法
JPH07167913A (ja) ハンドラ
CN101180716A (zh) Ic标签的安装结构及安装用ic芯片