SG152121A1 - Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers - Google Patents

Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers

Info

Publication number
SG152121A1
SG152121A1 SG200805890-1A SG2008058901A SG152121A1 SG 152121 A1 SG152121 A1 SG 152121A1 SG 2008058901 A SG2008058901 A SG 2008058901A SG 152121 A1 SG152121 A1 SG 152121A1
Authority
SG
Singapore
Prior art keywords
carrier
semiconductor wafers
coating
simultaneous double
side material
Prior art date
Application number
SG200805890-1A
Other languages
English (en)
Inventor
Georg Pietsch
Michael Kerstan
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG152121A1 publication Critical patent/SG152121A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
SG200805890-1A 2007-10-17 2008-08-08 Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers SG152121A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007049811.1A DE102007049811B4 (de) 2007-10-17 2007-10-17 Läuferscheibe, Verfahren zur Beschichtung einer Läuferscheibe sowie Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben

Publications (1)

Publication Number Publication Date
SG152121A1 true SG152121A1 (en) 2009-05-29

Family

ID=40458799

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200805890-1A SG152121A1 (en) 2007-10-17 2008-08-08 Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers

Country Status (7)

Country Link
US (1) US9539695B2 (ja)
JP (1) JP5207909B2 (ja)
KR (1) KR101275441B1 (ja)
CN (1) CN101412201B (ja)
DE (1) DE102007049811B4 (ja)
SG (1) SG152121A1 (ja)
TW (1) TWI411494B (ja)

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DE102010032501B4 (de) 2010-07-28 2019-03-28 Siltronic Ag Verfahren und Vorrichtung zum Abrichten der Arbeitsschichten einer Doppelseiten-Schleifvorrichtung
DE102010042040A1 (de) 2010-10-06 2012-04-12 Siltronic Ag Verfahren zum Schleifen einer Halbleiterscheibe
DE102011003008B4 (de) 2011-01-21 2018-07-12 Siltronic Ag Führungskäfig und Verfahren zur gleichzeitig beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben
DE102011080323A1 (de) 2011-08-03 2013-02-07 Siltronic Ag Verfahren zum Einebnen einer Halbleiterscheibe mit verbesserter Kantenschonung
DE102011082857B4 (de) 2011-09-16 2020-02-20 Siltronic Ag Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung wenigstens dreier Werkstücke
DE102011089570A1 (de) 2011-12-22 2013-06-27 Siltronic Ag Führungskäfig zum beidseitigen Schleifen von mindestens einem scheibenförmigen Werkstück zwischen zwei rotierenden Arbeitsscheiben einer Schleifvorrichtung, Verfahren zur Herstellung des Führungskäfigs und Verfahren zum gleichzeitigen beidseitigen Schleifen von scheibenförmigen Werkstücken unter Verwendung des Führungskäfigs
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DE102013200756A1 (de) * 2013-01-18 2014-08-07 Siltronic Ag Läuferscheibe für die beidseitige Politur von Scheiben aus Halbleitermaterial
CN103817572A (zh) * 2014-02-18 2014-05-28 河南机电高等专科学校 一种离合器摩擦钢片修复装置
JP6566112B2 (ja) * 2016-02-16 2019-08-28 信越半導体株式会社 両面研磨方法及び両面研磨装置
US10556317B2 (en) * 2016-03-03 2020-02-11 P.R. Hoffman Machine Products Inc. Polishing machine wafer holder
US20170252893A1 (en) * 2016-03-03 2017-09-07 P.R. Hoffman Machine Products Inc. Polishing machine work piece holder
DE102016222063A1 (de) * 2016-11-10 2018-05-17 Siltronic Ag Verfahren zum beidseitigen Polieren einer Halbleiterscheibe
JP6977657B2 (ja) * 2018-05-08 2021-12-08 信越半導体株式会社 両面研磨装置用キャリアの保管方法及びウェーハの両面研磨方法
US11621171B2 (en) 2018-09-25 2023-04-04 Nissan Chemical Corporation Method for polishing silicon wafer with reduced wear on carrier, and polishing liquid used therein
CN110153839B (zh) * 2019-06-06 2023-12-26 中国工程物理研究院激光聚变研究中心 全口径抛光浸没式元件加工装置、加工方法及抛光机
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Also Published As

Publication number Publication date
CN101412201A (zh) 2009-04-22
TW200918236A (en) 2009-05-01
KR20090039596A (ko) 2009-04-22
DE102007049811B4 (de) 2016-07-28
JP5207909B2 (ja) 2013-06-12
KR101275441B1 (ko) 2013-06-14
US9539695B2 (en) 2017-01-10
TWI411494B (zh) 2013-10-11
CN101412201B (zh) 2012-04-18
DE102007049811A1 (de) 2009-04-23
US20090104852A1 (en) 2009-04-23
JP2009099980A (ja) 2009-05-07

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