SG96200A1 - Semiconductor integrated circuit device and method of manufacturing the same - Google Patents

Semiconductor integrated circuit device and method of manufacturing the same

Info

Publication number
SG96200A1
SG96200A1 SG200100859A SG200100859A SG96200A1 SG 96200 A1 SG96200 A1 SG 96200A1 SG 200100859 A SG200100859 A SG 200100859A SG 200100859 A SG200100859 A SG 200100859A SG 96200 A1 SG96200 A1 SG 96200A1
Authority
SG
Singapore
Prior art keywords
integrated circuit
semiconductor integrated
circuit device
connecting member
manufacturing
Prior art date
Application number
SG200100859A
Other languages
English (en)
Inventor
Miyaki Yoshinori
Suzuki Hiromichi
Kaneda Tsuyoshi
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of SG96200A1 publication Critical patent/SG96200A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
SG200100859A 2000-02-18 2001-02-16 Semiconductor integrated circuit device and method of manufacturing the same SG96200A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000046724A JP2001230360A (ja) 2000-02-18 2000-02-18 半導体集積回路装置およびその製造方法

Publications (1)

Publication Number Publication Date
SG96200A1 true SG96200A1 (en) 2003-05-23

Family

ID=18569088

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200100859A SG96200A1 (en) 2000-02-18 2001-02-16 Semiconductor integrated circuit device and method of manufacturing the same

Country Status (8)

Country Link
US (6) US6891253B2 (fr)
EP (2) EP2028684A3 (fr)
JP (1) JP2001230360A (fr)
KR (2) KR100780207B1 (fr)
CN (5) CN100380650C (fr)
MY (1) MY124877A (fr)
SG (1) SG96200A1 (fr)
TW (1) TW504827B (fr)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6357112B1 (en) * 1997-11-25 2002-03-19 Tessera, Inc. Method of making connection component
JP2001230360A (ja) * 2000-02-18 2001-08-24 Hitachi Ltd 半導体集積回路装置およびその製造方法
JP4549491B2 (ja) * 2000-03-13 2010-09-22 大日本印刷株式会社 樹脂封止型半導体装置
JP2002299540A (ja) 2001-04-04 2002-10-11 Hitachi Ltd 半導体装置およびその製造方法
TWI267959B (en) * 2002-11-27 2006-12-01 Siliconware Precision Industries Co Ltd Semiconductor package with chip-supporting member
JP4417150B2 (ja) * 2004-03-23 2010-02-17 株式会社ルネサステクノロジ 半導体装置
KR20070015164A (ko) * 2004-05-25 2007-02-01 신꼬오덴기 고교 가부시키가이샤 반도체 부품의 외장 팔라듐 도금 구조 및 반도체 장치의제조 방법
US7215014B2 (en) * 2004-07-29 2007-05-08 Freescale Semiconductor, Inc. Solderable metal finish for integrated circuit package leads and method for forming
US7268415B2 (en) * 2004-11-09 2007-09-11 Texas Instruments Incorporated Semiconductor device having post-mold nickel/palladium/gold plated leads
US7615851B2 (en) * 2005-04-23 2009-11-10 Stats Chippac Ltd. Integrated circuit package system
JP2007081235A (ja) * 2005-09-15 2007-03-29 Renesas Technology Corp 半導体装置の製造方法
JP4820616B2 (ja) 2005-10-20 2011-11-24 パナソニック株式会社 リードフレーム
DE102006015222B4 (de) * 2006-03-30 2018-01-04 Robert Bosch Gmbh QFN-Gehäuse mit optimierter Anschlussflächengeometrie
US20080001264A1 (en) * 2006-07-03 2008-01-03 Texas Instruments Incorporated Exposed top side copper leadframe manufacturing
JP2008098478A (ja) * 2006-10-13 2008-04-24 Renesas Technology Corp 半導体装置及びその製造方法
JP5341679B2 (ja) * 2009-08-31 2013-11-13 株式会社日立製作所 半導体装置
CN102484083A (zh) 2009-09-11 2012-05-30 罗姆股份有限公司 半导体装置及其制造方法
JP2011216518A (ja) * 2010-03-31 2011-10-27 Rohm Co Ltd ワイヤボンディング構造、半導体装置、ボンディングツールおよびワイヤボンディング方法
JP5634149B2 (ja) 2010-07-16 2014-12-03 ルネサスエレクトロニクス株式会社 半導体装置
TWI436710B (zh) * 2011-02-09 2014-05-01 村田製作所股份有限公司 Connection structure
CN102354688A (zh) * 2011-10-11 2012-02-15 深圳市威怡电气有限公司 一种功率模块
CN102779763A (zh) * 2012-06-05 2012-11-14 华天科技（西安）有限公司 一种基于腐蚀的aaqfn产品的二次塑封制作工艺
JP6121692B2 (ja) * 2012-11-05 2017-04-26 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP6238121B2 (ja) * 2013-10-01 2017-11-29 ローム株式会社 半導体装置
JP6414669B2 (ja) * 2014-07-22 2018-10-31 大口マテリアル株式会社 リードフレーム及びその製造方法
US9070392B1 (en) 2014-12-16 2015-06-30 Hutchinson Technology Incorporated Piezoelectric disk drive suspension motors having plated stiffeners
CN107735834B (zh) 2015-06-30 2019-11-19 哈钦森技术股份有限公司 具有改进的可靠性的盘驱动器头部悬架结构
CN110544633A (zh) * 2018-05-28 2019-12-06 浙江清华柔性电子技术研究院 芯片集成方法及芯片集成结构
US10658278B2 (en) * 2018-08-16 2020-05-19 Texas Instruments Incorporated Electrical device terminal finishing
JP7293142B2 (ja) * 2020-01-07 2023-06-19 東芝デバイス＆ストレージ株式会社 半導体装置
KR102405129B1 (ko) * 2021-05-21 2022-06-07 제엠제코(주) 히트싱크 노출형 반도체 패키지 및 이의 제조방법
CN118431186A (zh) * 2024-07-04 2024-08-02 长沙瑶华半导体科技有限公司 半导体结构、电路及其封装方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05144821A (ja) * 1991-04-30 1993-06-11 Toshiba Corp 半導体装置
US5929511A (en) * 1996-07-15 1999-07-27 Matsushita Electronics Corporation Lead frame for resin sealed semiconductor device

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5282183A (en) * 1975-12-29 1977-07-09 Nec Corp Connecting wires for semiconductor devices
JPS61140160A (ja) * 1984-12-12 1986-06-27 Hitachi Cable Ltd 半導体用リ−ドフレ−ム
JP3044872B2 (ja) 1991-09-25 2000-05-22 ソニー株式会社 半導体装置
JPH0590465A (ja) * 1991-09-27 1993-04-09 Mitsui High Tec Inc 半導体装置
JPH05211261A (ja) * 1991-10-14 1993-08-20 Fujitsu Ltd 半導体装置
EP0537982A2 (fr) * 1991-10-14 1993-04-21 Fujitsu Limited Dispositif semi-conducteur ayant des conducteurs améliorés
KR100552353B1 (ko) * 1992-03-27 2006-06-20 가부시키가이샤 히타치초엘에스아이시스템즈 리이드프레임및그것을사용한반도체집적회로장치와그제조방법
US5650661A (en) * 1993-12-27 1997-07-22 National Semiconductor Corporation Protective coating combination for lead frames
US5455195A (en) * 1994-05-06 1995-10-03 Texas Instruments Incorporated Method for obtaining metallurgical stability in integrated circuit conductive bonds
US5454929A (en) * 1994-06-16 1995-10-03 National Semiconductor Corporation Process for preparing solderable integrated circuit lead frames by plating with tin and palladium
JP3509274B2 (ja) * 1994-07-13 2004-03-22 セイコーエプソン株式会社 樹脂封止型半導体装置およびその製造方法
US5891745A (en) * 1994-10-28 1999-04-06 Honeywell Inc. Test and tear-away bond pad design
KR0163863B1 (ko) * 1995-02-28 1998-12-01 김광호 멀티칩 실장을 위한 반도체 패키지
JP3501316B2 (ja) 1995-06-16 2004-03-02 株式会社ルネサステクノロジ 半導体装置及びその製造方法
US5818699A (en) * 1995-07-05 1998-10-06 Kabushiki Kaisha Toshiba Multi-chip module and production method thereof
KR100266726B1 (ko) * 1995-09-29 2000-09-15 기타지마 요시토시 리드프레임과 이 리드프레임을 갖춘 반도체장치
JPH09232493A (ja) * 1995-12-20 1997-09-05 Seiichi Serizawa リードフレーム
US5902472A (en) * 1996-01-30 1999-05-11 Naganoken And Shinko Electric Industries Co., Ltd. Aqueous solution for forming metal complexes, tin-silver alloy plating bath, and process for producing plated object using the plating bath
JPH09312375A (ja) * 1996-03-18 1997-12-02 Hitachi Ltd リードフレーム、半導体装置及び半導体装置の製造方法
JPH09312374A (ja) 1996-05-24 1997-12-02 Sony Corp 半導体パッケージ及びその製造方法
DE19626087C2 (de) 1996-06-28 1998-06-10 Siemens Ag Integrierte Halbleiterschaltung mit Leiterrahmen und Gehäuse
JPH1018056A (ja) * 1996-07-02 1998-01-20 Daido Steel Co Ltd リードフレーム用板とその製造方法
CN1132244C (zh) * 1996-07-03 2003-12-24 精工爱普生株式会社 树脂封装型半导体装置及其制造方法
US5926694A (en) 1996-07-11 1999-07-20 Pfu Limited Semiconductor device and a manufacturing method thereof
TW335526B (en) * 1996-07-15 1998-07-01 Matsushita Electron Co Ltd A semiconductor and the manufacturing method
JP3160555B2 (ja) * 1996-07-15 2001-04-25 松下電子工業株式会社 半導体装置およびその製造方法
JPH1070230A (ja) * 1996-08-27 1998-03-10 Hitachi Cable Ltd Ｌｏｃ用リードフレーム
JPH10233408A (ja) * 1997-02-21 1998-09-02 Nec Corp 金属接合構造及び半導体装置
US6037653A (en) * 1997-03-25 2000-03-14 Samsung Aerospace Industries, Ltd. Semiconductor lead frame having multi-layered plating layer including copper-nickel plating layer
JPH10284666A (ja) * 1997-04-01 1998-10-23 Furukawa Electric Co Ltd:The 電子部品機器
US5994767A (en) * 1997-04-09 1999-11-30 Sitron Precision Co., Ltd. Leadframe for integrated circuit package and method of manufacturing the same
TW401634B (en) * 1997-04-09 2000-08-11 Sitron Prec Co Ltd Lead frame and its manufacture method
KR100215120B1 (ko) * 1997-04-21 1999-08-16 유무성 리이드 프레임 도금 장치 및 그에 의한 리이드 프레임 도금 방법
JP3003624B2 (ja) * 1997-05-27 2000-01-31 ソニー株式会社 半導体装置
JPH118341A (ja) * 1997-06-18 1999-01-12 Mitsui High Tec Inc 半導体装置用リードフレーム
JPH1167809A (ja) 1997-08-26 1999-03-09 Sanyo Electric Co Ltd 半導体装置
JPH11145369A (ja) * 1997-11-07 1999-05-28 Hitachi Ltd リードフレームおよびそれを用いた半導体装置ならびにその製造方法
JPH11168169A (ja) * 1997-12-04 1999-06-22 Hitachi Ltd リードフレームおよびそれを用いた半導体装置ならびにその製造方法
JP3622462B2 (ja) * 1997-12-16 2005-02-23 株式会社日立製作所 半導体装置
JP3481448B2 (ja) * 1998-01-30 2003-12-22 古河電気工業株式会社 リードフレーム
US6292083B1 (en) * 1998-03-27 2001-09-18 Taiyo Yuden Co., Ltd. Surface-mount coil
US6087714A (en) * 1998-04-27 2000-07-11 Matsushita Electric Industrial Co., Ltd. Semiconductor devices having tin-based solder film containing no lead and process for producing the devices
JPH11307710A (ja) * 1998-04-27 1999-11-05 Matsushita Electric Ind Co Ltd メッキリードフレーム及びその製造方法及びそれを用いた半導体装置
JPH11330134A (ja) * 1998-05-12 1999-11-30 Hitachi Ltd ワイヤボンディング方法およびその装置並びに半導体装置
US6139977A (en) * 1998-06-10 2000-10-31 Lucent Technologies Inc. Palladium surface coating suitable for wirebonding and process for forming palladium surface coatings
US6194777B1 (en) * 1998-06-27 2001-02-27 Texas Instruments Incorporated Leadframes with selective palladium plating
CN1190840C (zh) * 1999-04-08 2005-02-23 新光电气工业株式会社 半导体装置用引线框架
JP3314754B2 (ja) 1999-04-22 2002-08-12 松下電器産業株式会社 鉛を含まない錫ベース半田皮膜を有する半導体装置およびその製造方法
US6376901B1 (en) * 1999-06-08 2002-04-23 Texas Instruments Incorporated Palladium-spot leadframes for solder plated semiconductor devices and method of fabrication
JP2001230360A (ja) * 2000-02-18 2001-08-24 Hitachi Ltd 半導体集積回路装置およびその製造方法
JP3664045B2 (ja) * 2000-06-01 2005-06-22 セイコーエプソン株式会社 半導体装置の製造方法
JP3417395B2 (ja) * 2000-09-21 2003-06-16 松下電器産業株式会社 半導体装置用リードフレーム及びその製造方法及びそれを用いた半導体装置
US6818968B1 (en) * 2000-10-12 2004-11-16 Altera Corporation Integrated circuit package and process for forming the same
US6452258B1 (en) * 2000-11-06 2002-09-17 Lucent Technologies Inc. Ultra-thin composite surface finish for electronic packaging

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05144821A (ja) * 1991-04-30 1993-06-11 Toshiba Corp 半導体装置
US5929511A (en) * 1996-07-15 1999-07-27 Matsushita Electronics Corporation Lead frame for resin sealed semiconductor device

Also Published As

Publication number Publication date
TW504827B (en) 2002-10-01
EP1126520A2 (fr) 2001-08-22
CN1309425A (zh) 2001-08-22
US7397114B2 (en) 2008-07-08
US20060138617A1 (en) 2006-06-29
MY124877A (en) 2006-07-31
KR100750012B1 (ko) 2007-08-16
EP2028684A3 (fr) 2009-06-03
KR20010082736A (ko) 2001-08-30
EP2028684A2 (fr) 2009-02-25
CN101013683A (zh) 2007-08-08
US20010015481A1 (en) 2001-08-23
KR20070070146A (ko) 2007-07-03
CN101013682A (zh) 2007-08-08
CN100380650C (zh) 2008-04-09
US20030067067A1 (en) 2003-04-10
US20090014855A1 (en) 2009-01-15
US7038306B2 (en) 2006-05-02
US7176056B2 (en) 2007-02-13
CN1312748C (zh) 2007-04-25
CN1516252A (zh) 2004-07-28
CN100440493C (zh) 2008-12-03
EP1126520A3 (fr) 2002-11-20
US20040245607A1 (en) 2004-12-09
CN101026139A (zh) 2007-08-29
US6891253B2 (en) 2005-05-10
US20010018264A1 (en) 2001-08-30
JP2001230360A (ja) 2001-08-24
KR100780207B1 (ko) 2007-11-27

Similar Documents

Publication Publication Date Title
SG96200A1 (en) Semiconductor integrated circuit device and method of manufacturing the same
TWI230105B (en) Solder
US6257215B1 (en) Resin-sealed electronic apparatus for use in internal combustion engines
US20020033530A1 (en) Semiconductor device and semiconductor module
JP2002280396A (ja) 電子機器および半導体装置および半導体モジュール
EP1017098A3 (fr) Circuit integré avec une plage de contact et procédé de son fabrication
KR950000903A (ko) 무연의 주석-비스무트 납땜 합금
KR20030070075A (ko) 땜납 박 및 반도체 장치 및 전자 장치
EP0725437A3 (fr) Dispositif semi-conducteur, méthode de fabrication associé et conducteurs de cuivre
EP0875935A3 (fr) Dispositif semi-conducteur comprenant une électrode saillante
WO2003028088A3 (fr) Procedes de formation de structures metallurgiques pour microcablage et soudure par fusion et structures connexes
KR950000904A (ko) 무연의 주석, 안티몬, 비스무트 및 구리 납땜 합금
EP1193750A3 (fr) Procédé et appareillage de micro-soudure
US20110285033A1 (en) Chip Carrier
KR950024315A (ko) 반도체용 리드 프레임 및 그 제조방법
US6616483B2 (en) Functional connector
US20070034993A1 (en) Semiconductor assembly and packaging for high current and low inductance
US20010010323A1 (en) System and method for forming stable solder bonds
EP1126752A3 (fr) Empaquetage à l'échelle de la puce sur des panneaux à circuit imprimé à dilatation thermique adaptée
JP2001237279A (ja) 半導体装置及びそれを用いた電子装置
US6864579B2 (en) Carrier with a metal area and at least one chip configured on the metal area
JPH11168276A (ja) 部品実装方法
KR19980071554A (ko) 전극용 금속 합금을 구비한 반도체 장치
EP0997938A3 (fr) Module à multi-puce
WO2001086715A3 (fr) Procede pour braser une premiere couche metallique d'une epaisseur inferieure a 5 $g(m)m, avec une seconde couche metallique, dispositif de brasage et dispositif de montage pour puce a semi-conducteur