US4617729A - Process for manufacturing miniaturized electronic power circuits - Google Patents

Process for manufacturing miniaturized electronic power circuits Download PDF

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Publication number
US4617729A
US4617729A US06/705,987 US70598785A US4617729A US 4617729 A US4617729 A US 4617729A US 70598785 A US70598785 A US 70598785A US 4617729 A US4617729 A US 4617729A
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US
United States
Prior art keywords
substrate
components
hard
power elements
network
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US06/705,987
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English (en)
Inventor
Jean Celnik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Automobiles Peugeot SA
Automobiles Citroen SA
Original Assignee
Automobiles Peugeot SA
Automobiles Citroen SA
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Filing date
Publication date
Application filed by Automobiles Peugeot SA, Automobiles Citroen SA filed Critical Automobiles Peugeot SA
Assigned to AUTOMOBILES PEUGEOT reassignment AUTOMOBILES PEUGEOT ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: CELNIK, JEAN
Application granted granted Critical
Publication of US4617729A publication Critical patent/US4617729A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/088—Using a vapour or mist, e.g. cleaning using water vapor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Definitions

  • the present invention relates to a process for manufacturing miniaturized electronic power circuits formed by so called SMI (insulated metal substrate) technological procedures and the miniaturized circuits obtained by this process.
  • SMI insulated metal substrate
  • the process of the invention in which the mini power elements are hard soldered to a conducting network with interpositioning of an insulating means on a good heat conducting metal plate comprises forming a substrate by bonding to the metal plate a laminated foil formed by a plastic film coated on the outside with a good conducting metal layer, the conducting network being formed by a metal layer, a hard soldering paste being laid at the positions of the to be soldered to the terminals of the components, as well as at the positions on the metal layer where the bodies of the flatly applied components are to be hard soldered to this layer, the components being positioned on the substrate so that their terminals are in contact with the hard soldering paste and are hard soldered in a vapor phase, the circuit obtained then being placed in a sealed case.
  • a substrate is formed whose area is a multiple of that of the circuit to be formed, and a series of identical circuits are formed on the substrate and then the assembly is cut up so as to obtain unit circuits.
  • FIG. 1 shows a part of a substrate after etching of the conducting network
  • FIG. 2 shows on a larger scale a portion of the substrate of FIG. 1;
  • FIG. 3 is a view similar to FIG. 2, after positioning and hard soldering of the components.
  • FIG. 4 is a sectional view of the substrate along line IV--IV of FIG. 3.
  • a substrate is provided formed by a plate 1 made from a highly conductive metal, for example aluminium, on which is bonded a laminate foil formed from a plastic film 2 coated on the outwardly facing surface with another highly conductive metal layer 3.
  • Plate 1 has a thickness on the order of 2 to 3 mm.
  • the plastic film has a small thickness on the order of 25 to 30, preferably 25 to 50 microns and is formed for example from a high temperature resistant polyimide resin, such as the one known commercially under the name of Kapton.
  • the layer 3 it can be formed by a copper layer deposited on the plastic film and having a thickness on the order of 35 to 70 microns.
  • the laminate foil is fixed to the plate 1 by hot bonding.
  • the different conducting networks are formed from layer 3 by only leaving the required parts of this layer.
  • the layer 3 may for example, be coated with a photosensitive film, exposed through a mask representing the conducting networks to be formed, washed so as to remove the unexposed parts, and leaving the bared copper etched; it then only remains to remove the photosensitive film from the exposed parts which covers the networks 4.
  • the hard-soldering paste is deposited by silk screen printing at the positions such as 5 of networks 4 which are to be hard soldered to connections of the components as well as at the positions such as 5' where a power element is to be hard soldered to the substrate so as to ensure that the transfer of the heat therefrom is released from plate 1 serving as a heat-sink.
  • the components are laid flat on the substrate so that their lugs or connecting wires such as 6 and 7 are in contact with the points 5 of hard-soldering paste and the cases of the power elements are in direct contact with the metal layer 3 of the laminate foil (grounded).
  • These components may for example be power transistors such as 8, resistors or diodes such as 9 and 10, or integrated circuits such as 11. They are laid automatically for example using a machine of the "pick and place” type adapted for laying 5000 to 10,000 components per hour or using a machine of the "multiplace” type which allows collective and automatic laying of 30,000 to 50,000 components per hour.
  • the lugs 6 and 7 of the components on networks 4 are hard soldered in the vapor phase and cleaned.
  • the substrate with the components is immersed in a fluid in the vapor state, for example in a fluorinated organic compound, such as is manufactured by the 3M Company.
  • the vaporization temperature of the fluid determines the type of hard solder and must be greater by 20° C. than the melting temperature of the hard solder so that this latter has good fluidity and wetability characteristics.
  • the vapor prevents the hard soldering from being exposed to the air and limits the risks of oxidization during this phase while allowing alloys to be used formed from 60% tin and 40% lead with a melting temperature of 185° C.
  • This operation also allows hard soldering to be performed under the components, i.e. in the case of power components, hard soldering to be performed between the heat sink situated under the component and the substrate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Dc-Dc Converters (AREA)
US06/705,987 1984-02-28 1985-02-27 Process for manufacturing miniaturized electronic power circuits Expired - Lifetime US4617729A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8403485 1984-02-28
FR8403485A FR2560437B1 (fr) 1984-02-28 1984-02-28 Procede de report a plat d'elements de puissance sur un reseau conducteur par brasage de leurs connexions

Publications (1)

Publication Number Publication Date
US4617729A true US4617729A (en) 1986-10-21

Family

ID=9301765

Family Applications (1)

Application Number Title Priority Date Filing Date
US06/705,987 Expired - Lifetime US4617729A (en) 1984-02-28 1985-02-27 Process for manufacturing miniaturized electronic power circuits

Country Status (6)

Country Link
US (1) US4617729A (de)
EP (1) EP0159208B1 (de)
JP (1) JPS60206087A (de)
AT (1) ATE37120T1 (de)
DE (1) DE3564890D1 (de)
FR (1) FR2560437B1 (de)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4914815A (en) * 1988-02-23 1990-04-10 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing hybrid integrated circuits
US4937934A (en) * 1989-02-10 1990-07-03 Rockwell International Corporation Installation of surface mount components on printed wiring boards
US4954453A (en) * 1989-02-24 1990-09-04 At&T Bell Laboratories Method of producing an article comprising a multichip assembly
US4955132A (en) * 1987-11-16 1990-09-11 Sharp Kabushiki Kaisha Method for mounting a semiconductor chip
FR2671935A1 (fr) * 1991-01-22 1992-07-24 Peugeot Boitier de circuit electronique de puissance.
US5220724A (en) * 1990-09-08 1993-06-22 Robert Bosch Gmbh Method of securing surface-mounted devices to a substrate
US5337474A (en) * 1991-05-31 1994-08-16 Fuji Xerox Co., Ltd. Process for fabricating electronic devices and image sensor
US5492842A (en) * 1994-03-09 1996-02-20 Delco Electronics Corp. Substrate subassembly and method of making transistor switch module
US5596804A (en) * 1993-02-12 1997-01-28 Alcatel Network Systems, Inc. Method of constructing an electromagnetically shielded microstrip circuit
US6143355A (en) * 1997-10-08 2000-11-07 Delphi Technologies, Inc. Print alignment method for multiple print thick film circuits
FR2803716A1 (fr) * 2000-01-11 2001-07-13 Sagem Module electronique a composants de puissance et procede de fabrication
US6286499B1 (en) * 1998-10-14 2001-09-11 Disco Corporation Method of cutting and separating a bent board into individual small divisions
US6401332B1 (en) * 1997-02-17 2002-06-11 Magnetek S.P.A. Processing printed circuits and printed circuits thus obtained
US20030099074A1 (en) * 1999-12-23 2003-05-29 Stmicroelectronics S.R.L. Electronic device with double-wire bonding, manufacturing method thereof, and method for checking intactness of bonding wires of this electronic device
US20050223551A1 (en) * 2004-04-01 2005-10-13 Ju-Liang He Method for manufacturing a high-efficiency thermal conductive base board
US8446120B2 (en) 2011-05-19 2013-05-21 Black & Decker Inc. Electronic switching module for a power tool
DE102017112048A1 (de) * 2017-06-01 2018-12-06 Infineon Technologies Austria Ag Leiterplatte mit aus Stahl gefertigtem isoliertem Metallsubstrat
US10608501B2 (en) 2017-05-24 2020-03-31 Black & Decker Inc. Variable-speed input unit having segmented pads for a power tool

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2651923B1 (fr) * 1989-09-14 1994-06-17 Peugeot Circuit integre de puissance.
JPH07105461B2 (ja) * 1990-08-03 1995-11-13 三菱電機株式会社 半導体装置用絶縁基板の製造方法およびそのための金属パターン板
FR2719183B1 (fr) * 1994-04-25 1996-07-12 Peugeot Procédé de fabrication d'un circuit électronique de puissance et circuit électronique obtenu par ce procédé.
CN111511122B (zh) * 2020-05-19 2022-11-29 中国电子科技集团公司第二十九研究所 一种底部无引脚封装器件的装夹焊膏涂覆装置及方法

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US3439255A (en) * 1965-12-02 1969-04-15 Motorola Inc Encapsulated semiconductor device including a ceramic substrate
US3492586A (en) * 1966-09-22 1970-01-27 Honeywell Inc Control apparatus
US3899379A (en) * 1967-10-09 1975-08-12 Western Electric Co Releasable mounting and method of placing an oriented array of devices on the mounting
GB1536471A (en) * 1976-01-02 1978-12-20 Standard Telephones Cables Ltd Printed circuits
US4352120A (en) * 1979-04-25 1982-09-28 Hitachi, Ltd. Semiconductor device using SiC as supporter of a semiconductor element
US4412377A (en) * 1981-01-23 1983-11-01 Tokyo Shibaura Denki Kabushiki Kaisha Method for manufacturing a hybrid integrated circuit device
US4459607A (en) * 1981-06-18 1984-07-10 Burroughs Corporation Tape automated wire bonded integrated circuit chip assembly
US4474639A (en) * 1982-09-20 1984-10-02 Siemens Aktiengesellschaft Method and device for processing individual integrated circuits into film-mounted, integrated circuits (micropacks)
US4480779A (en) * 1975-10-10 1984-11-06 Luc Technologies Limited Conductive connections

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JPS49131863U (de) * 1973-03-10 1974-11-13
EP0015053A1 (de) * 1979-01-27 1980-09-03 LUCAS INDUSTRIES public limited company Verfahren zur Herstellung einer Baugruppe mit Leistungshalbleiter und nach diesem Verfahren hergestellte Baugruppe
JPS55156390A (en) * 1979-05-25 1980-12-05 Hitachi Ltd Method of connecting magneit material substrate
JPS56101793A (en) * 1980-01-18 1981-08-14 Sanyo Electric Co Circuit board
JPS577994A (en) * 1980-06-19 1982-01-16 Tokyo Shibaura Electric Co Method of producing hybrid integrated circuit device
GB2111312A (en) * 1981-11-04 1983-06-29 Philips Electronic Associated Substrates for electrical circuits
JPS5933894A (ja) * 1982-08-19 1984-02-23 電気化学工業株式会社 混成集積用回路基板の製造法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3439255A (en) * 1965-12-02 1969-04-15 Motorola Inc Encapsulated semiconductor device including a ceramic substrate
US3492586A (en) * 1966-09-22 1970-01-27 Honeywell Inc Control apparatus
US3899379A (en) * 1967-10-09 1975-08-12 Western Electric Co Releasable mounting and method of placing an oriented array of devices on the mounting
US4480779A (en) * 1975-10-10 1984-11-06 Luc Technologies Limited Conductive connections
GB1536471A (en) * 1976-01-02 1978-12-20 Standard Telephones Cables Ltd Printed circuits
US4352120A (en) * 1979-04-25 1982-09-28 Hitachi, Ltd. Semiconductor device using SiC as supporter of a semiconductor element
US4412377A (en) * 1981-01-23 1983-11-01 Tokyo Shibaura Denki Kabushiki Kaisha Method for manufacturing a hybrid integrated circuit device
US4459607A (en) * 1981-06-18 1984-07-10 Burroughs Corporation Tape automated wire bonded integrated circuit chip assembly
US4474639A (en) * 1982-09-20 1984-10-02 Siemens Aktiengesellschaft Method and device for processing individual integrated circuits into film-mounted, integrated circuits (micropacks)

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4955132A (en) * 1987-11-16 1990-09-11 Sharp Kabushiki Kaisha Method for mounting a semiconductor chip
US4914815A (en) * 1988-02-23 1990-04-10 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing hybrid integrated circuits
US4937934A (en) * 1989-02-10 1990-07-03 Rockwell International Corporation Installation of surface mount components on printed wiring boards
US4954453A (en) * 1989-02-24 1990-09-04 At&T Bell Laboratories Method of producing an article comprising a multichip assembly
US5220724A (en) * 1990-09-08 1993-06-22 Robert Bosch Gmbh Method of securing surface-mounted devices to a substrate
FR2671935A1 (fr) * 1991-01-22 1992-07-24 Peugeot Boitier de circuit electronique de puissance.
US5337474A (en) * 1991-05-31 1994-08-16 Fuji Xerox Co., Ltd. Process for fabricating electronic devices and image sensor
US5596804A (en) * 1993-02-12 1997-01-28 Alcatel Network Systems, Inc. Method of constructing an electromagnetically shielded microstrip circuit
US5492842A (en) * 1994-03-09 1996-02-20 Delco Electronics Corp. Substrate subassembly and method of making transistor switch module
US6401332B1 (en) * 1997-02-17 2002-06-11 Magnetek S.P.A. Processing printed circuits and printed circuits thus obtained
US6858806B2 (en) 1997-02-17 2005-02-22 Magnetik S.P.A. Process for producing printed circuits and printed circuits thus obtained
US6143355A (en) * 1997-10-08 2000-11-07 Delphi Technologies, Inc. Print alignment method for multiple print thick film circuits
US6286499B1 (en) * 1998-10-14 2001-09-11 Disco Corporation Method of cutting and separating a bent board into individual small divisions
SG85152A1 (en) * 1998-10-14 2001-12-19 Disco Corp Method of cutting and separating a bent board into individual small divisions
US20030099074A1 (en) * 1999-12-23 2003-05-29 Stmicroelectronics S.R.L. Electronic device with double-wire bonding, manufacturing method thereof, and method for checking intactness of bonding wires of this electronic device
US7263759B2 (en) * 1999-12-23 2007-09-04 Stmicroelectronics S.R.L. Methods of manufacturing and testing bonding wires
US6452808B2 (en) 2000-01-11 2002-09-17 Sagem Sa Electronics module having power components, and a method of manufacture
FR2803716A1 (fr) * 2000-01-11 2001-07-13 Sagem Module electronique a composants de puissance et procede de fabrication
EP1117282A1 (de) * 2000-01-11 2001-07-18 Sagem Sa Elektronisches Modul mit Leistungsbauteilen und Verfahren zur Herstellung
US20050223551A1 (en) * 2004-04-01 2005-10-13 Ju-Liang He Method for manufacturing a high-efficiency thermal conductive base board
US7036219B2 (en) * 2004-04-01 2006-05-02 Feng Chia University Method for manufacturing a high-efficiency thermal conductive base board
US9401250B2 (en) 2011-05-19 2016-07-26 Black & Decker, Inc. Electronic switching module for a power tool
US9000882B2 (en) 2011-05-19 2015-04-07 Black & Decker Inc. Electronic switching module for a power tool
US8446120B2 (en) 2011-05-19 2013-05-21 Black & Decker Inc. Electronic switching module for a power tool
US9406457B2 (en) 2011-05-19 2016-08-02 Black & Decker Inc. Electronic switching module for a power tool
US9508498B2 (en) 2011-05-19 2016-11-29 Black & Decker, Inc. Electronic switching module for a power tool
US10256697B2 (en) 2011-05-19 2019-04-09 Black & Decker Inc. Electronic switching module for a power tool
US10651706B2 (en) 2011-05-19 2020-05-12 Black & Decker Inc. Control unit for a power tool
US10608501B2 (en) 2017-05-24 2020-03-31 Black & Decker Inc. Variable-speed input unit having segmented pads for a power tool
DE102017112048A1 (de) * 2017-06-01 2018-12-06 Infineon Technologies Austria Ag Leiterplatte mit aus Stahl gefertigtem isoliertem Metallsubstrat
US10426028B2 (en) 2017-06-01 2019-09-24 Infineon Technologies Austria Ag Printed circuit board with insulated metal substrate made of steel

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EP0159208A1 (de) 1985-10-23
ATE37120T1 (de) 1988-09-15
FR2560437A1 (fr) 1985-08-30
JPS60206087A (ja) 1985-10-17
DE3564890D1 (en) 1988-10-13
FR2560437B1 (fr) 1987-05-29
EP0159208B1 (de) 1988-09-07

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