USH1373H - Wafer handling apparatus and method - Google Patents

Wafer handling apparatus and method Download PDF

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Publication number
USH1373H
USH1373H US07/862,920 US86292092A USH1373H US H1373 H USH1373 H US H1373H US 86292092 A US86292092 A US 86292092A US H1373 H USH1373 H US H1373H
Authority
US
United States
Prior art keywords
transfer arm
wafer
apertures
vacuum
attachment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US07/862,920
Other languages
English (en)
Inventor
Christopher E. Durham
William J. Malriat
Allen R. Melcher
Randy J. Penn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Inc
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Priority to US07/862,920 priority Critical patent/USH1373H/en
Assigned to AMERICAN TELEPHONE AND TELEGRAPH COMPANY A CORP. OF NEW YORK reassignment AMERICAN TELEPHONE AND TELEGRAPH COMPANY A CORP. OF NEW YORK ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: DURHAM, CHRISTOPHER E., MALRIAT, WILLIAM J., MELCHER, ALLEN R.
Priority to EP93302284A priority patent/EP0565278A1/en
Priority to KR1019930005573A priority patent/KR930022516A/ko
Priority to JP10007193A priority patent/JPH0629370A/ja
Application granted granted Critical
Publication of USH1373H publication Critical patent/USH1373H/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Definitions

  • the present invention relates to wafer handling apparatus and method and, more particularly, to such apparatus and method for handling semiconductor wafers exhibiting significant bow.
  • some wafers may begin to exhibit warpage in the form of wafer bow, either simple (uniformly convex), compound (skewed convex), or complex (a composite of concave and convex).
  • dielectrically isolated (DI) wafers may exhibit bow as a result of various processes utilized in forming the relatively thick polysilicon support layer (often referred to as a "handle").
  • the wafers must often be transferred individually between a carrier and a vacuum chuck.
  • a transfer member often referred to as a "transfer arm” or “transfer finger”, may be utilized to perform this task.
  • a transfer arm is attached to a selected wafer by a vacuum through a relatively large opening in the surface of the arm.
  • An O-ring may surround the opening to cushion the attachment and attempt to provide a vacuum seal.
  • an operator may be required to assist in the attachment, by forcing the wafer to lie flat against the transfer arm. This process obviously has the potential to damage the wafer surface or, in the extreme, result in breaking the wafer.
  • the present invention relates to apparatus and method for handling wafers and, more particularly improved transfer arm apparatus and method for handling bowed wafers.
  • a transfer member comprises a vacuum-assisted transfer arm for contacting a selected wafer.
  • the surface of the arm is formed to include a plurality of apertures which are connected to the vacuum source.
  • the wafer is drawn against the plurality of apertures so as to contact the transfer member.
  • the utilization of a plurality of such apertures allows for wafers with significant bow (e.g., exceeding eight mils) to contact the transfer member without operator assistance.
  • each aperture may be fitted with a flexible surround piece which extends outward to contact the non-flat wafer surface.
  • the surround piece in particular, may comprise a flexible suction cup design such that once a vacuum is attained, the flexible surround piece is depressed so as to allow the wafer to be pulled against the flat reference of the transfer arm.
  • a transfer arm may be designed to include any suitable number of such vacuum-assisted apertures, as a function of the overall wafer dimension and/or expected wafer bow, for example.
  • FIG. 1 is a cut-away view in perspective of an exemplary transfer arm formed in accordance with the present invention
  • FIG. 2 is a simplified top view of the transfer arm of FIG. 1;
  • FIG. 3 contains a cut-away view in perspective of an alternative embodiment of the present invention.
  • FIGS. 4-6 illustrate the operation of an exemplary transfer arm of the present invention for providing attachment of a bowed semiconductor wafer.
  • FIG. 1 contains a cut-away view in perspective, but not to scale, of an exemplary wafer transfer member 10 formed in accordance with the teachings of the present invention.
  • End region 12 of member 10 also referred to as transfer arm, is illustrated as including a plurality of apertures 14.
  • apertures 14 are formed in top surface 16 of transfer arm 12 and coupled to a vacuum source (not shown).
  • arm 12 is moved in proximity to a selected wafer 18.
  • the vacuum source is activated and wafer 18 is drawn toward top surface 16, as indicated by the arrows and shown in phantom in FIG. 1.
  • the utilization of a plurality of apertures 14 in accordance with the teachings of the present invention allows for semiconductor wafers with relatively large bow (e.g., in the range of approximately 4 to 30 mils) to be attached to top surface 16 of transfer arm 12 without operator assistance.
  • the spacing, number, and size of the apertures may be determined by the user so as to most effectively provide the attachment. For example, when being used with wafers exhibiting only simple bow of relatively small dimension ⁇ , as shown in FIG. 1, a transfer arm of the present invention may require only a pair of apertures.
  • FIG. 2 contains a top view of an exemplary transfer arm 120 including four apertures 140 as may be required for utilization with wafers exhibiting complex bow.
  • FIG. 3 shows a partial cut-away side view of an exemplary transfer arm 30 including a plurality of vacuum-assisted apertures 32.
  • arm 30 comprises a plurality of threaded screw members 34, with a separate screw member disposed at each aperture.
  • apertures 32 are formed as threaded apertures and screw members 34 include a flat-head screw surface 40 which functions as a flat reference surface for the wafer during attachment.
  • Screw 34 further comprises a central bore 42 to form a path for the vacuum.
  • screw members 34 include a flexible member 44 disposed to surround the perimeter of bore 42 to provide a suction vacuum seal of a selected wafer (now shown) upon attachment. It is obvious that other suitable arrangements may be utilized, for example, where the flexible member is directly attached to the surface of arm 30 in the vicinity of each aperture 32.
  • FIGS. 4-6 illustrate in detail the action of an exemplary transfer arm during the process of attaching a bowed wafer to transfer member.
  • a wafer 36 exhibiting bow is first placed over a transfer arm, such as transfer arm 30 discused above in association with FIG. 3.
  • wafer 36 may rest upon the plurality of flexible members 44, as shown in FIG. 4.
  • flexible members 44 in particular, the outer members
  • flexible members 44 begin to deform and allow a suction to form between central flexible member 44 c and wafer 36, as shown in FIG. 5.
  • flexible members 44 are all deformed as shown in FIG. 6 and wafer 36 is positioned along the flat reference formed by surface 40 of member 34.

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Feeding Of Workpieces (AREA)
  • Manipulator (AREA)
US07/862,920 1992-04-06 1992-04-06 Wafer handling apparatus and method Abandoned USH1373H (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US07/862,920 USH1373H (en) 1992-04-06 1992-04-06 Wafer handling apparatus and method
EP93302284A EP0565278A1 (en) 1992-04-06 1993-03-25 Wafer handling apparatus and method
KR1019930005573A KR930022516A (ko) 1992-04-06 1993-04-02 웨이퍼 조작 장치 및 방법
JP10007193A JPH0629370A (ja) 1992-04-06 1993-04-05 半導体ウェーハ転送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/862,920 USH1373H (en) 1992-04-06 1992-04-06 Wafer handling apparatus and method

Publications (1)

Publication Number Publication Date
USH1373H true USH1373H (en) 1994-11-01

Family

ID=25339739

Family Applications (1)

Application Number Title Priority Date Filing Date
US07/862,920 Abandoned USH1373H (en) 1992-04-06 1992-04-06 Wafer handling apparatus and method

Country Status (4)

Country Link
US (1) USH1373H (ja)
EP (1) EP0565278A1 (ja)
JP (1) JPH0629370A (ja)
KR (1) KR930022516A (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5642298A (en) * 1994-02-16 1997-06-24 Ade Corporation Wafer testing and self-calibration system
US6279976B1 (en) 1999-05-13 2001-08-28 Micron Technology, Inc. Wafer handling device having conforming perimeter seal
US20040077130A1 (en) * 2002-10-18 2004-04-22 Asm Technology Singapore Pte Ltd Apparatus and method for reducing substrate warpage
DE202009002523U1 (de) 2009-02-24 2010-07-15 Kuka Systems Gmbh Handhabungseinrichtung
US8500182B2 (en) * 2010-06-17 2013-08-06 Taiwan Semiconductor Manufacturing Company, Ltd. Vacuum wafer carriers for strengthening thin wafers
US20140169929A1 (en) * 2012-12-14 2014-06-19 Tokyo Ohka Kogyo Co., Ltd. Transport arm, transport apparatus and transport method
US20160126116A1 (en) * 2013-06-13 2016-05-05 Taiwan Semiconductor Manufacturing Company Ltd. Singulation apparatus and method
WO2019020838A1 (fr) * 2017-07-28 2019-01-31 Coval Caisson a vide a montage facilite pour prehenseur

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH695405A5 (de) 1999-12-14 2006-04-28 Esec Trading Sa Die Bonder und Wire Bonder mit einer Ansaugvorrichtung zum Flachziehen und Niederhalten eines gewölbten Substrats.
EP1109205A1 (en) * 1999-12-14 2001-06-20 Esec Trading S.A. Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate
EP1109207A1 (de) * 1999-12-14 2001-06-20 Esec SA Ansaugvorrichtung zum Niederhalten eines Substrates
JP4201564B2 (ja) * 2001-12-03 2008-12-24 日東電工株式会社 半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置
KR101035926B1 (ko) * 2004-06-23 2011-05-23 엘지디스플레이 주식회사 Ｌｃｄ 제조를 위한 플렉서블 기판을 반송하기 위한 반송기판, 반송 시스템 그리고 반송 방법
JP4555008B2 (ja) * 2004-07-08 2010-09-29 パナソニック株式会社 部品実装装置
TW200602713A (en) * 2004-07-08 2006-01-16 Matsushita Electric Industrial Co Ltd Substrate processing apparatus and mounter
EP2851941B1 (de) 2013-09-23 2016-09-07 Mechatronic Systemtechnik GmbH Verfahren zur Übergabe eines gedünnten, insbesondere geschliffenen, Halbleiterwafers
JP2015216255A (ja) * 2014-05-12 2015-12-03 キヤノン株式会社 エッチングチャンバー、および基板の製造方法
JP6305272B2 (ja) * 2014-08-14 2018-04-04 株式会社ディスコ 搬送装置
JP6349343B2 (ja) * 2016-05-02 2018-06-27 Ｔｏｗａ株式会社 吸着ユニット、板状部材搬送ユニット、樹脂封止装置、板状部材搬送方法および樹脂封止方法
CN108214532A (zh) * 2017-12-29 2018-06-29 广东欧珀移动通信有限公司 吸取装置
PT3772089T (pt) * 2019-07-30 2021-06-28 Semsysco Gmbh Dispositivo de manuseamento de substrato para uma pastilha

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2798757A (en) * 1951-02-23 1957-07-09 American Mach & Foundry Article lifting device
DE1506502A1 (de) * 1967-04-06 1969-07-24 Detag Hebe- und Transportvorrichtung fuer tafelartige,ebene Werkstuecke
US4050729A (en) * 1976-04-20 1977-09-27 Hutson Clifford L Apparatus for handling delicate articles such as silicon wafers
US4282924A (en) * 1979-03-16 1981-08-11 Varian Associates, Inc. Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface
US4389064A (en) * 1980-12-05 1983-06-21 S.A. Joulin Sema Gripping device operating by suction
GB2156582A (en) * 1984-03-29 1985-10-09 Perkin Elmer Corp Small part transport system
US4564188A (en) * 1984-11-13 1986-01-14 Westvaco Corporation Single sheet feeding mechanism
JPS61140432A (ja) * 1984-12-11 1986-06-27 Shinko Denki Kk ウエハ−等の保持装置
US4687542A (en) * 1985-10-24 1987-08-18 Texas Instruments Incorporated Vacuum processing system
US4773687A (en) * 1987-05-22 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Wafer handler
US4983093A (en) * 1982-05-24 1991-01-08 Proconics International, Inc. Wafer transfer apparatus
US4987856A (en) * 1989-05-22 1991-01-29 Advanced Semiconductor Materials America, Inc. High throughput multi station processor for multiple single wafers
US5013075A (en) * 1988-01-11 1991-05-07 Littell Edmund R Vacuum cup construction
US5079903A (en) * 1990-10-26 1992-01-14 Tatra Pak Holdings, S.A. Gripping head for loading packages into crates
US5118153A (en) * 1991-03-06 1992-06-02 H-Square Corporation Hand-operated reciprocating bellows for electronic component pickup

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2631502A1 (de) * 1976-07-13 1978-01-19 Siemens Ag Greifwerkzeug fuer eine saugpinzette
DE69133413D1 (de) * 1990-05-07 2004-10-21 Canon Kk Substratträger des Vakuumtyps

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2798757A (en) * 1951-02-23 1957-07-09 American Mach & Foundry Article lifting device
DE1506502A1 (de) * 1967-04-06 1969-07-24 Detag Hebe- und Transportvorrichtung fuer tafelartige,ebene Werkstuecke
US4050729A (en) * 1976-04-20 1977-09-27 Hutson Clifford L Apparatus for handling delicate articles such as silicon wafers
US4282924A (en) * 1979-03-16 1981-08-11 Varian Associates, Inc. Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface
US4389064A (en) * 1980-12-05 1983-06-21 S.A. Joulin Sema Gripping device operating by suction
US4983093A (en) * 1982-05-24 1991-01-08 Proconics International, Inc. Wafer transfer apparatus
GB2156582A (en) * 1984-03-29 1985-10-09 Perkin Elmer Corp Small part transport system
US4564188A (en) * 1984-11-13 1986-01-14 Westvaco Corporation Single sheet feeding mechanism
JPS61140432A (ja) * 1984-12-11 1986-06-27 Shinko Denki Kk ウエハ−等の保持装置
US4687542A (en) * 1985-10-24 1987-08-18 Texas Instruments Incorporated Vacuum processing system
US4773687A (en) * 1987-05-22 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Wafer handler
US5013075A (en) * 1988-01-11 1991-05-07 Littell Edmund R Vacuum cup construction
US4987856A (en) * 1989-05-22 1991-01-29 Advanced Semiconductor Materials America, Inc. High throughput multi station processor for multiple single wafers
US5079903A (en) * 1990-10-26 1992-01-14 Tatra Pak Holdings, S.A. Gripping head for loading packages into crates
US5118153A (en) * 1991-03-06 1992-06-02 H-Square Corporation Hand-operated reciprocating bellows for electronic component pickup

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5642298A (en) * 1994-02-16 1997-06-24 Ade Corporation Wafer testing and self-calibration system
US6279976B1 (en) 1999-05-13 2001-08-28 Micron Technology, Inc. Wafer handling device having conforming perimeter seal
US20040077130A1 (en) * 2002-10-18 2004-04-22 Asm Technology Singapore Pte Ltd Apparatus and method for reducing substrate warpage
US6988879B2 (en) * 2002-10-18 2006-01-24 Asm Technology Singapore Pte Ltd Apparatus and method for reducing substrate warpage
DE202009002523U1 (de) 2009-02-24 2010-07-15 Kuka Systems Gmbh Handhabungseinrichtung
US8500182B2 (en) * 2010-06-17 2013-08-06 Taiwan Semiconductor Manufacturing Company, Ltd. Vacuum wafer carriers for strengthening thin wafers
US20140169929A1 (en) * 2012-12-14 2014-06-19 Tokyo Ohka Kogyo Co., Ltd. Transport arm, transport apparatus and transport method
US9653337B2 (en) * 2012-12-14 2017-05-16 Tokyo Ohka Kogyo Co., Ltd. Transport arm, transport apparatus and transport method
US20160126116A1 (en) * 2013-06-13 2016-05-05 Taiwan Semiconductor Manufacturing Company Ltd. Singulation apparatus and method
US9679790B2 (en) * 2013-06-13 2017-06-13 Taiwan Semiconductor Manufacturing Company Ltd. Singulation apparatus and method
WO2019020838A1 (fr) * 2017-07-28 2019-01-31 Coval Caisson a vide a montage facilite pour prehenseur
FR3069531A1 (fr) * 2017-07-28 2019-02-01 Coval Caisson a vide a montage facilite pour prehenseur
US11331813B2 (en) 2017-07-28 2022-05-17 Coval Vacuum chamber with easier assembly for gripper

Also Published As

Publication number Publication date
EP0565278A1 (en) 1993-10-13
KR930022516A (ko) 1993-11-24
JPH0629370A (ja) 1994-02-04

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Owner name: AMERICAN TELEPHONE AND TELEGRAPH COMPANY A CORP.

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNORS:DURHAM, CHRISTOPHER E.;MALRIAT, WILLIAM J.;MELCHER, ALLEN R.;REEL/FRAME:006077/0172

Effective date: 19920402

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