WO2002056652A3 - Verfahren zur herstellung einer elektronischen baugruppe - Google Patents

Verfahren zur herstellung einer elektronischen baugruppe Download PDF

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Publication number
WO2002056652A3
WO2002056652A3 PCT/EP2001/014463 EP0114463W WO02056652A3 WO 2002056652 A3 WO2002056652 A3 WO 2002056652A3 EP 0114463 W EP0114463 W EP 0114463W WO 02056652 A3 WO02056652 A3 WO 02056652A3
Authority
WO
WIPO (PCT)
Prior art keywords
support body
contacts
forming
metallisation
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2001/014463
Other languages
English (en)
French (fr)
Other versions
WO2002056652A2 (de
Inventor
Helmut Heinz
Friedrich Nehmeier
Bernhard Schuch
Hubert Trageser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Priority to US10/466,031 priority Critical patent/US6929975B2/en
Priority to MXPA03005795A priority patent/MXPA03005795A/es
Priority to DE50109017T priority patent/DE50109017D1/de
Priority to EP01984815A priority patent/EP1350417B1/de
Publication of WO2002056652A2 publication Critical patent/WO2002056652A2/de
Publication of WO2002056652A3 publication Critical patent/WO2002056652A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Details Of Resistors (AREA)

Abstract

Für elektronische Baugruppen mit einer auf einen Trägerkörper (5) aufgebrachten Schaltungsanordnung und mit Druchkontaktierungen (7,18) im Trägerkörper (5) soll das Herstellungsverfahren vereinfacht und verbessert werden. Hierzu werden nach dem Aufbringen einer ersten, die Grundmetallisierung bildenden Metallisierungsschicht (6) auf den Trägerkörper und in für die Ausbildung der Durchkontaktierungen (7,18) vorgesehene Durchführungen (14,15) im Trägerkörper die Durchklontaktierungen mit einem hochviskosen Siebdruckmaterial (8) verschlossen. Eine ganzflächig auf die Oberseite (12) und die Unterseite (13) des Trägerkörpers aufgebrachte niederviskose Passivierungsschicht (19) wird auf der Oberseite (12) des Trägerkörpers in bestimmten Bereichen selektiv entfernt und auf die dort freigelegte erste Metallisierungsschicht (6) eine zweite, die Endmetallisierung bildende Metallisierungsschicht (17) aus einem Material mit niedrigem Schmelzpunkt aufgebracht. Durch einen Lötprozeß werden die elektronischen Bauteile (1) der Schaltungsanordnung auf der Oberseite (12) des Trägerkörpers (5) aufgebracht und kontakiert.
PCT/EP2001/014463 2001-01-13 2001-12-10 Verfahren zur herstellung einer elektronischen baugruppe Ceased WO2002056652A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US10/466,031 US6929975B2 (en) 2001-01-13 2001-12-10 Method for the production of an electronic component
MXPA03005795A MXPA03005795A (es) 2001-01-13 2001-12-10 Procedimiento para la fabricacion de un conjunto constructivo electronico.
DE50109017T DE50109017D1 (de) 2001-01-13 2001-12-10 Verfahren zur herstellung einer elektronischen baugruppe
EP01984815A EP1350417B1 (de) 2001-01-13 2001-12-10 Verfahren zur herstellung einer elektronischen baugruppe

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10101359.0 2001-01-13
DE10101359A DE10101359A1 (de) 2001-01-13 2001-01-13 Verfahren zur Herstellung einer elektronischen Baugruppe

Publications (2)

Publication Number Publication Date
WO2002056652A2 WO2002056652A2 (de) 2002-07-18
WO2002056652A3 true WO2002056652A3 (de) 2002-10-24

Family

ID=7670464

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2001/014463 Ceased WO2002056652A2 (de) 2001-01-13 2001-12-10 Verfahren zur herstellung einer elektronischen baugruppe

Country Status (6)

Country Link
US (1) US6929975B2 (de)
EP (1) EP1350417B1 (de)
DE (2) DE10101359A1 (de)
ES (1) ES2256314T3 (de)
MX (1) MXPA03005795A (de)
WO (1) WO2002056652A2 (de)

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US7049170B2 (en) * 2003-12-17 2006-05-23 Tru-Si Technologies, Inc. Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities
DE102006004320A1 (de) * 2006-01-31 2007-08-09 Häusermann GmbH Leiterplatte mit funktionalen Elementen und selektiv gefüllten und thermisch leitfähigen Durchsteigelöchern sowie Herstellverfahren und Anwendung
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TWI449137B (zh) * 2006-03-23 2014-08-11 製陶技術創新製陶工程股份公司 構件或電路用的攜帶體
DE102006016964A1 (de) * 2006-04-11 2007-10-18 Conti Temic Microelectronic Gmbh Verfahren zur Herstellung einer elektronischen Baugruppe, elektronische Baugruppe sowie Trägerkörper hierfür
DE102006022443A1 (de) * 2006-05-13 2007-11-15 Conti Temic Microelectronic Gmbh Verfahren zur Herstellung einer Trägerplatte für eine Schaltungsanordnung, Trägerplatte, hergestellt nach einem derartigen Verfahren sowie Schaltungsanordnung mit einer derartigen Trägerplatte
DE102008019797B4 (de) * 2008-04-18 2023-09-21 Sew-Eurodrive Gmbh & Co Kg Kühlanordnung und Umrichter
US8166650B2 (en) * 2008-05-30 2012-05-01 Steering Solutions IP Holding Company Method of manufacturing a printed circuit board
US8227295B2 (en) * 2008-10-16 2012-07-24 Texas Instruments Incorporated IC die having TSV and wafer level underfill and stacked IC devices comprising a workpiece solder connected to the TSV
WO2010094154A1 (en) * 2009-02-20 2010-08-26 Telefonaktiebolaget L M Ericsson (Publ) Thermal pad and method of forming the same
US8101962B2 (en) * 2009-10-06 2012-01-24 Kuang Hong Precision Co., Ltd. Carrying structure of semiconductor
DE112010002548A5 (de) * 2009-12-17 2012-08-23 Conti Temic Microelectronic Gmbh Leiterplatte mit mehreren übereinander angeordneten leiterplattenlagen mit einer bare-die-montage für den einsatz als getriebesteuerung
US8248803B2 (en) * 2010-03-31 2012-08-21 Hong Kong Applied Science and Technology Research Institute Company Limited Semiconductor package and method of manufacturing the same
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JP4825919B1 (ja) * 2010-05-31 2011-11-30 株式会社東芝 電子機器
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AT516724B1 (de) * 2014-12-22 2016-08-15 Zizala Lichtsysteme Gmbh Herstellen einer schaltungsanordnung mit thermischen durchkontaktierungen
FR3036917B1 (fr) * 2015-05-28 2018-11-02 IFP Energies Nouvelles Dispositif electronique comprenant une carte de circuit imprime avec un refroidissement ameliore.
JP6618549B2 (ja) 2015-12-03 2019-12-11 三菱電機株式会社 半導体装置
DE102016201797A1 (de) * 2016-02-05 2017-08-10 Robert Bosch Gmbh Kontaktsystem mit einem Schaltungsträger und Bauelement
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JP6852649B2 (ja) * 2017-10-24 2021-03-31 株式会社オートネットワーク技術研究所 回路構成体及び回路構成体の製造方法
KR102802515B1 (ko) * 2019-12-10 2025-05-02 엘지디스플레이 주식회사 인쇄회로기판 및 이를 포함하는 표시장치
DE102020202598A1 (de) * 2020-02-28 2021-09-02 Siemens Mobility GmbH Verfahren zum Herstellen einer elektrischen Anordnung
DE102020120473B4 (de) 2020-08-04 2025-11-06 Eberspächer catem Hermsdorf GmbH & Co. KG Verfahren zur Herstellung eines PTC-Heizelements
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CN114390803A (zh) * 2022-01-20 2022-04-22 苏州光余年生物科技有限公司 通过过孔塞金属膏法提高电路板热电分离效率的生产工艺
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JPH11145592A (ja) * 1997-11-11 1999-05-28 Sumitomo Metal Smi Electron Devices Inc 回路基板のスルーホール充填方法
WO1999067978A1 (de) * 1998-06-24 1999-12-29 Vantico Ag Verfahren zum beschichten von leiterplatten oder dergleichen substraten
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Also Published As

Publication number Publication date
EP1350417A2 (de) 2003-10-08
MXPA03005795A (es) 2005-02-14
WO2002056652A2 (de) 2002-07-18
EP1350417B1 (de) 2006-02-22
US20040048414A1 (en) 2004-03-11
US6929975B2 (en) 2005-08-16
DE50109017D1 (de) 2006-04-27
ES2256314T3 (es) 2006-07-16
DE10101359A1 (de) 2002-07-25

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