ATE138225T1 - Prozess zur gegenseitigen konnektion von elektrodenanschlüssen - Google Patents

Prozess zur gegenseitigen konnektion von elektrodenanschlüssen

Info

Publication number
ATE138225T1
ATE138225T1 AT90115707T AT90115707T ATE138225T1 AT E138225 T1 ATE138225 T1 AT E138225T1 AT 90115707 T AT90115707 T AT 90115707T AT 90115707 T AT90115707 T AT 90115707T AT E138225 T1 ATE138225 T1 AT E138225T1
Authority
AT
Austria
Prior art keywords
electrode terminals
circuit substrate
electroconductive particles
electroconductive
charged
Prior art date
Application number
AT90115707T
Other languages
English (en)
Inventor
Hiroshi Takabayashi
Masanori Takahashi
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1210584A external-priority patent/JPH06103702B2/ja
Priority claimed from JP1216140A external-priority patent/JPH0382048A/ja
Priority claimed from JP1324983A external-priority patent/JPH03185894A/ja
Priority claimed from JP2195332A external-priority patent/JP2704033B2/ja
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of ATE138225T1 publication Critical patent/ATE138225T1/de

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/666—Organic materials or pastes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105—Using an electrical field; Special methods of applying an electric potential
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/224—Bumps having multiple side-by-side cores
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/244—Dispositions, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Photovoltaic Devices (AREA)
  • Liquid Crystal (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
AT90115707T 1989-08-17 1990-08-16 Prozess zur gegenseitigen konnektion von elektrodenanschlüssen ATE138225T1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP1210584A JPH06103702B2 (ja) 1989-08-17 1989-08-17 電極端子の相互接続方法及び電気接続構造体の製造方法
JP1216140A JPH0382048A (ja) 1989-08-24 1989-08-24 半導体素子の接続方法
JP1324983A JPH03185894A (ja) 1989-12-15 1989-12-15 電極端子の相互接続方法
JP2195332A JP2704033B2 (ja) 1990-07-23 1990-07-23 電極端子の相互接続方法

Publications (1)

Publication Number Publication Date
ATE138225T1 true ATE138225T1 (de) 1996-06-15

Family

ID=27475753

Family Applications (1)

Application Number Title Priority Date Filing Date
AT90115707T ATE138225T1 (de) 1989-08-17 1990-08-16 Prozess zur gegenseitigen konnektion von elektrodenanschlüssen

Country Status (5)

Country Link
US (1) US5352318A (de)
EP (1) EP0413335B1 (de)
KR (1) KR940008554B1 (de)
AT (1) ATE138225T1 (de)
DE (1) DE69026992T2 (de)

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DE4242408C2 (de) * 1991-12-11 1998-02-26 Mitsubishi Electric Corp Verfahren zum Verbinden eines Schaltkreissubstrates mit einem Halbleiterteil
DE69321349T2 (de) * 1992-07-03 1999-02-25 Citizen Watch Co., Ltd., Tokio/Tokyo Tintenstrahldruckkopf
JPH07221105A (ja) * 1994-01-31 1995-08-18 Fujitsu Ltd 半導体装置の製造方法及び半導体装置
TW277152B (de) * 1994-05-10 1996-06-01 Hitachi Chemical Co Ltd
EP0710058A3 (de) * 1994-10-14 1997-07-09 Samsung Display Devices Co Ltd Kurzschlussverhinderung zwischen elektrisch leitenden Teilen
WO1996037913A1 (en) * 1995-05-22 1996-11-28 Hitachi Chemical Company, Ltd. Semiconductor device having a semiconductor chip electrically connected to a wiring substrate
DE19529490A1 (de) * 1995-08-10 1997-02-13 Fraunhofer Ges Forschung Chipkontaktierungsverfahren, damit hergestellte elektronische Schaltung und Trägersubstrat zur Kontaktierung von Chips
SG47183A1 (en) * 1995-10-16 1998-03-20 Texas Instruments Inc Method and apparatus for forming bumps on substrates
KR970064335A (ko) * 1996-02-01 1997-09-12 빈센트 비. 인그라시아 프린트된 와이어링 보드 단자상에 전도층을 형성하는 방법 및 장치
JPH1084014A (ja) * 1996-07-19 1998-03-31 Shinko Electric Ind Co Ltd 半導体装置の製造方法
US6635514B1 (en) * 1996-12-12 2003-10-21 Tessera, Inc. Compliant package with conductive elastomeric posts
US6867948B1 (en) * 1999-01-22 2005-03-15 Seagate Technology Llc Disc drives having flexible circuits with liquid crystal polymer dielectric
US7662468B2 (en) * 2000-10-06 2010-02-16 Brock Usa, Llc Composite materials made from pretreated, adhesive coated beads
KR100737896B1 (ko) * 2001-02-07 2007-07-10 삼성전자주식회사 어레이 기판과, 액정표시장치 및 그 제조방법
JP3711873B2 (ja) * 2001-02-19 2005-11-02 ソニーケミカル株式会社 バンプレスｉｃチップの製造方法
WO2003003798A1 (fr) * 2001-06-29 2003-01-09 Toray Engineering Co., Ltd. Methode d'assemblage utilisant un adhesif conducteur anisotrope
DE10141753A1 (de) * 2001-08-29 2003-03-20 Orga Kartensysteme Gmbh Verfahren zur Montage eines elektronischen Bauelementes auf einer Trägerstuktur in Face-Down-Technik
US6768209B1 (en) * 2003-02-03 2004-07-27 Micron Technology, Inc. Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devices
JP5248772B2 (ja) * 2003-07-09 2013-07-31 フライズ メタルズ インコーポレイテッド 沈積とパターン化方法
US7244477B2 (en) 2003-08-20 2007-07-17 Brock Usa, Llc Multi-layered sports playing field with a water draining, padding layer
TWI239574B (en) * 2004-03-18 2005-09-11 Ind Tech Res Inst The method of conductive particles dispersing
DE102005038956B3 (de) * 2005-08-16 2007-03-22 Infineon Technologies Ag Verfahren zum Beschichten einer Struktur mit Halbleiterchips
DE102007027473A1 (de) 2007-06-14 2008-12-18 Manroland Ag Drucktechnisch hergestellte funktionale Komponenten
KR101525649B1 (ko) * 2009-02-20 2015-06-03 헨켈 아이피 앤드 홀딩 게엠베하 전극의 접속 방법 및 그것에 사용되는 접속 조성물
GB2523983A (en) * 2013-12-17 2015-09-16 Conpart As Bonded assemblies with pre-deposited polymer balls on demarcated areas and methods of forming such bonded assemblies
CN108807841A (zh) * 2018-06-01 2018-11-13 深圳市诚捷智能装备股份有限公司 一种贴胶装置
CN112968116A (zh) * 2020-10-15 2021-06-15 重庆康佳光电技术研究院有限公司 芯片的键合方法和系统、存储介质、电子装置

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JPS5852864A (ja) * 1981-09-24 1983-03-29 Seiko Epson Corp 半導体集積回路装置
JPS59195837A (ja) * 1983-04-21 1984-11-07 Sharp Corp Ｌｓｉチツプボンデイング方法
US4668533A (en) * 1985-05-10 1987-05-26 E. I. Du Pont De Nemours And Company Ink jet printing of printed circuit boards
JPS61289650A (ja) * 1985-06-18 1986-12-19 Nippon Denso Co Ltd 半導体装置の半田バンプ形成方法
JPS62174932A (ja) * 1986-01-28 1987-07-31 Mitsubishi Electric Corp 半導体装置の製造方法
US4971829A (en) * 1987-06-08 1990-11-20 Canon Kabushiki Kaisha Spraying process for corona charges spacer material and attracting the same to plate having an electrical potential
US4857482A (en) * 1987-06-30 1989-08-15 Kabushiki Kaisha Toshiba Method of forming bump electrode and electronic circuit device
FR2620569A1 (fr) * 1987-09-11 1989-03-17 Radiotechnique Compelec Procede pour calibrer l'epaisseur d'une soudure d'un composant electronique sur un substrat
JPH0740496B2 (ja) * 1989-03-01 1995-05-01 シャープ株式会社 電極上への導電性粒子の配置方法

Also Published As

Publication number Publication date
EP0413335A3 (en) 1991-10-30
DE69026992D1 (de) 1996-06-20
EP0413335A2 (de) 1991-02-20
KR940008554B1 (ko) 1994-09-24
US5352318A (en) 1994-10-04
KR910005466A (ko) 1991-03-30
DE69026992T2 (de) 1996-10-24
EP0413335B1 (de) 1996-05-15

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