ATE300098T1 - Heisse platte - Google Patents

Heisse platte

Info

Publication number
ATE300098T1
ATE300098T1 AT01938705T AT01938705T ATE300098T1 AT E300098 T1 ATE300098 T1 AT E300098T1 AT 01938705 T AT01938705 T AT 01938705T AT 01938705 T AT01938705 T AT 01938705T AT E300098 T1 ATE300098 T1 AT E300098T1
Authority
AT
Austria
Prior art keywords
hot plate
ceramic substrate
superior
temperature
present
Prior art date
Application number
AT01938705T
Other languages
English (en)
Inventor
Yasuji Hiramatsu
Yasutaka Ito
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Application granted granted Critical
Publication of ATE300098T1 publication Critical patent/ATE300098T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Optical Integrated Circuits (AREA)
  • Chemical Vapour Deposition (AREA)
  • Ceramic Products (AREA)
  • Physical Vapour Deposition (AREA)
AT01938705T 2000-06-16 2001-06-15 Heisse platte ATE300098T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000181941A JP3516392B2 (ja) 2000-06-16 2000-06-16 半導体製造・検査装置用ホットプレート
PCT/JP2001/005147 WO2001097264A1 (fr) 2000-06-16 2001-06-15 Plaque chauffante

Publications (1)

Publication Number Publication Date
ATE300098T1 true ATE300098T1 (de) 2005-08-15

Family

ID=18682795

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01938705T ATE300098T1 (de) 2000-06-16 2001-06-15 Heisse platte

Country Status (6)

Country Link
US (2) US6825555B2 (de)
EP (1) EP1229571B1 (de)
JP (1) JP3516392B2 (de)
AT (1) ATE300098T1 (de)
DE (1) DE60112033T2 (de)
WO (1) WO2001097264A1 (de)

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* Cited by examiner, † Cited by third party
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EP1249433A4 (de) * 1999-09-06 2005-01-05 Ibiden Co Ltd Brikett und keramisches substrat aus gesintertem kohlenstoffhaltigem aluminiumnitrid zur verwendung in vorrichtungen zur herstellung und untersuchung von halbleitern
US6861165B2 (en) * 2000-02-24 2005-03-01 Ibiden Co., Ltd. Aluminum nitride sintered compact, ceramic substrate, ceramic heater and electrostatic chuck
JP2001247382A (ja) * 2000-03-06 2001-09-11 Ibiden Co Ltd セラミック基板
EP1233651A1 (de) * 2000-04-07 2002-08-21 Ibiden Co., Ltd. Keramisches heizelement
JP3516392B2 (ja) * 2000-06-16 2004-04-05 イビデン株式会社 半導体製造・検査装置用ホットプレート
US6815646B2 (en) * 2000-07-25 2004-11-09 Ibiden Co., Ltd. Ceramic substrate for semiconductor manufacture/inspection apparatus, ceramic heater, electrostatic clampless holder, and substrate for wafer prober
TWI266378B (en) * 2003-03-06 2006-11-11 Toshiba Corp Baking apparatus, heat treatment method, manufacturing method of semiconductor device and pattern forming method
DE10356790A1 (de) * 2003-12-04 2005-07-07 BSH Bosch und Siemens Hausgeräte GmbH Heizvorrichtung für Fluide, Durchlauferhitzer und Verfahren zu deren Herstellung
US20060011139A1 (en) * 2004-07-16 2006-01-19 Applied Materials, Inc. Heated substrate support for chemical vapor deposition
US20060088692A1 (en) * 2004-10-22 2006-04-27 Ibiden Co., Ltd. Ceramic plate for a semiconductor producing/examining device
US7730737B2 (en) * 2004-12-21 2010-06-08 Taiwan Semiconductor Manufacturing Co., Ltd. Cooling station lifter pins
US8137465B1 (en) 2005-04-26 2012-03-20 Novellus Systems, Inc. Single-chamber sequential curing of semiconductor wafers
US8282768B1 (en) 2005-04-26 2012-10-09 Novellus Systems, Inc. Purging of porogen from UV cure chamber
US20100270004A1 (en) * 2005-05-12 2010-10-28 Landess James D Tailored profile pedestal for thermo-elastically stable cooling or heating of substrates
KR100771628B1 (ko) * 2006-05-11 2007-10-31 엘지전자 주식회사 전기레인지
JP4394667B2 (ja) * 2006-08-22 2010-01-06 日本碍子株式会社 ヒータ付き静電チャックの製造方法
JP2010506679A (ja) * 2006-10-16 2010-03-04 アルコン リサーチ， リミテッド 眼科用医療デバイスのために一体化された温度制御デバイスを備えるセラミック・チャンバ
US7960297B1 (en) 2006-12-07 2011-06-14 Novellus Systems, Inc. Load lock design for rapid wafer heating
US8052419B1 (en) * 2007-11-08 2011-11-08 Novellus Systems, Inc. Closed loop temperature heat up and control utilizing wafer-to-heater pedestal gap modulation
US8033769B2 (en) 2007-11-30 2011-10-11 Novellus Systems, Inc. Loadlock designs and methods for using same
US20090277388A1 (en) * 2008-05-09 2009-11-12 Applied Materials, Inc. Heater with detachable shaft
US8288288B1 (en) 2008-06-16 2012-10-16 Novellus Systems, Inc. Transferring heat in loadlocks
US8033771B1 (en) 2008-12-11 2011-10-11 Novellus Systems, Inc. Minimum contact area wafer clamping with gas flow for rapid wafer cooling
US8371567B2 (en) 2011-04-13 2013-02-12 Novellus Systems, Inc. Pedestal covers
WO2013103594A1 (en) 2012-01-06 2013-07-11 Novellus Systems, Inc. Adaptive heat transfer methods and systems for uniform heat transfer
US9984866B2 (en) * 2012-06-12 2018-05-29 Component Re-Engineering Company, Inc. Multiple zone heater
JP6219229B2 (ja) * 2014-05-19 2017-10-25 東京エレクトロン株式会社 ヒータ給電機構
US10347547B2 (en) 2016-08-09 2019-07-09 Lam Research Corporation Suppressing interfacial reactions by varying the wafer temperature throughout deposition
JP7202322B2 (ja) * 2020-02-03 2023-01-11 日本碍子株式会社 セラミックヒータ

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EP1120829A4 (de) * 1999-08-10 2009-05-27 Ibiden Co Ltd Keramische platte für halbleiterproduktionsanordnung
EP1249433A4 (de) * 1999-09-06 2005-01-05 Ibiden Co Ltd Brikett und keramisches substrat aus gesintertem kohlenstoffhaltigem aluminiumnitrid zur verwendung in vorrichtungen zur herstellung und untersuchung von halbleitern
EP1199908A4 (de) * 1999-10-22 2003-01-22 Ibiden Co Ltd Keramisches heizelement
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EP1124404B1 (de) 1999-11-19 2005-08-10 Ibiden Co., Ltd. Keramisches heizgerät
WO2001041508A1 (en) 1999-11-30 2001-06-07 Ibiden Co., Ltd. Ceramic heater
US6884972B2 (en) * 1999-12-09 2005-04-26 Ibiden Co., Ltd. Ceramic plate for a semiconductor producing/inspecting apparatus
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JP3228924B2 (ja) * 2000-01-21 2001-11-12 イビデン株式会社 半導体製造・検査装置用セラミックヒータ
US6891263B2 (en) * 2000-02-07 2005-05-10 Ibiden Co., Ltd. Ceramic substrate for a semiconductor production/inspection device
WO2001059833A1 (en) * 2000-02-08 2001-08-16 Ibiden Co., Ltd. Ceramic board for semiconductor production and inspection devices
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US20030098299A1 (en) * 2000-03-06 2003-05-29 Ibiden Co., Ltd. Ceramic heater
WO2001066488A1 (en) * 2000-03-07 2001-09-13 Ibiden Co., Ltd. Ceramic substrate for manufacture/inspection of semiconductor
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WO2001078454A1 (fr) * 2000-04-07 2001-10-18 Ibiden Co., Ltd. Dispositif chauffant ceramique
EP1233651A1 (de) * 2000-04-07 2002-08-21 Ibiden Co., Ltd. Keramisches heizelement
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WO2002007195A1 (fr) * 2000-07-19 2002-01-24 Ibiden Co., Ltd. Dispositif chauffant ceramique pour la fabrication/verification de semi-conducteurs, son procede de fabrication, et son systeme de fabrication
US6815646B2 (en) * 2000-07-25 2004-11-09 Ibiden Co., Ltd. Ceramic substrate for semiconductor manufacture/inspection apparatus, ceramic heater, electrostatic clampless holder, and substrate for wafer prober
EP1251551A1 (de) * 2000-08-30 2002-10-23 Ibiden Co., Ltd. Keramischer heizkörper für halbleiter und inspektionsausrüstungen
JP2002076102A (ja) * 2000-08-31 2002-03-15 Ibiden Co Ltd セラミック基板
US20040035846A1 (en) * 2000-09-13 2004-02-26 Yasuji Hiramatsu Ceramic heater for semiconductor manufacturing and inspecting equipment
JP2002160974A (ja) * 2000-11-22 2002-06-04 Ibiden Co Ltd 窒化アルミニウム焼結体、窒化アルミニウム焼結体の製造方法、セラミック基板およびセラミック基板の製造方法
JPWO2002043441A1 (ja) * 2000-11-24 2004-04-02 イビデン株式会社 セラミックヒータ、および、セラミックヒータの製造方法
JP2002170651A (ja) * 2000-11-29 2002-06-14 Ibiden Co Ltd セラミックヒータ
US20030000938A1 (en) * 2000-12-01 2003-01-02 Yanling Zhou Ceramic heater, and ceramic heater resistor paste
US6960743B2 (en) * 2000-12-05 2005-11-01 Ibiden Co., Ltd. Ceramic substrate for semiconductor manufacturing, and method of manufacturing the ceramic substrate
WO2002101816A1 (fr) * 2001-06-06 2002-12-19 Ibiden Co., Ltd. Dispositif d'etalonnage de tranche
WO2003015157A1 (en) * 2001-08-10 2003-02-20 Ibiden Co., Ltd. Ceramic joint body

Also Published As

Publication number Publication date
US20050258164A1 (en) 2005-11-24
DE60112033T2 (de) 2006-06-08
EP1229571A4 (de) 2003-01-29
EP1229571A1 (de) 2002-08-07
JP3516392B2 (ja) 2004-04-05
JP2002008828A (ja) 2002-01-11
DE60112033D1 (de) 2005-08-25
WO2001097264A1 (fr) 2001-12-20
US6825555B2 (en) 2004-11-30
EP1229571B1 (de) 2005-07-20
US20030010765A1 (en) 2003-01-16

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties