ATE474019T1 - Härtbare silikonzusammensetzung und gehärtetes produkt daraus - Google Patents

Härtbare silikonzusammensetzung und gehärtetes produkt daraus

Info

Publication number: ATE474019T1
Authority: AT; Austria
Prior art keywords: groups; satisfies; univalent organic; average; silicone composition
Prior art date: 2003-11-07

Application number

AT04799609T

Other languages

English (en)

Inventor

Y Morita

M Isshiki

H Ueki

Atsushi Togashi

Original Assignee

Dow Corning Toray Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2003-11-07

Filing date

2004-11-04

Publication date

2010-07-15

2004-11-04 Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd

2010-07-15 Application granted granted Critical

2010-07-15 Publication of ATE474019T1 publication Critical patent/ATE474019T1/de

Links

229920001296 polysiloxane Polymers 0.000 title abstract 4
125000000962 organic group Chemical group 0.000 abstract 4
125000003118 aryl group Chemical group 0.000 abstract 3
125000003700 epoxy group Chemical group 0.000 abstract 2
125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
-1 siloxane unit Chemical group 0.000 abstract 1

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes

Landscapes

Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Organic Chemistry (AREA)
Health & Medical Sciences (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Compositions Of Macromolecular Compounds (AREA)
Epoxy Resins (AREA)
Adhesives Or Adhesive Processes (AREA)

AT04799609T 2003-11-07 2004-11-04 Härtbare silikonzusammensetzung und gehärtetes produkt daraus ATE474019T1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2003378521		2003-11-07
PCT/JP2004/016716 WO2005044920A1 (en)	2003-11-07	2004-11-04	Curable silicone composition and cured product thereof

Publications (1)

Publication Number	Publication Date
ATE474019T1 true ATE474019T1 (de)	2010-07-15

Family

ID=34567180

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT04799609T ATE474019T1 (de)	2003-11-07	2004-11-04	Härtbare silikonzusammensetzung und gehärtetes produkt daraus

Country Status (9)

Country	Link
US (1)	US7781522B2 (de)
EP (1)	EP1689816B1 (de)
JP (1)	JP4799848B2 (de)
KR (1)	KR101147639B1 (de)
CN (1)	CN100413925C (de)
AT (1)	ATE474019T1 (de)
DE (1)	DE602004028151D1 (de)
TW (1)	TWI345576B (de)
WO (1)	WO2005044920A1 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI345576B (en)	2003-11-07	2011-07-21	Dow Corning Toray Silicone	Curable silicone composition and cured product thereof
ATE409201T1 (de) *	2003-12-26	2008-10-15	Dow Corning Toray Co Ltd	Härtbare silikonzusammensetzung und ihre verwendung als klebstoff
JP4664032B2 (ja)	2004-10-13	2011-04-06	東レ・ダウコーニング株式会社	シリルアルコキシメチルハライドの製造方法
JP4931366B2 (ja)	2005-04-27	2012-05-16	東レ・ダウコーニング株式会社	硬化性シリコーン組成物および電子部品
JP5004433B2 (ja) *	2005-04-27	2012-08-22	東レ・ダウコーニング株式会社	硬化性シリコーン組成物およびその硬化物
JP5285846B2 (ja)	2006-09-11	2013-09-11	東レ・ダウコーニング株式会社	硬化性シリコーン組成物および電子部品
JP5248012B2 (ja)	2006-12-25	2013-07-31	東レ・ダウコーニング株式会社	硬化性シリコーン組成物
JP5238157B2 (ja) *	2006-12-25	2013-07-17	東レ・ダウコーニング株式会社	硬化性シリコーン組成物および電子部品
JP5422109B2 (ja)	2007-10-16	2014-02-19	東レ・ダウコーニング株式会社	硬化性シリコーン組成物およびその硬化物
JP2009114295A (ja) *	2007-11-05	2009-05-28	Shin Etsu Chem Co Ltd	接着剤組成物
JP5234910B2 (ja) *	2007-12-28	2013-07-10	信越化学工業株式会社	接着剤組成物
JP5972512B2 (ja) *	2008-06-18	2016-08-17	東レ・ダウコーニング株式会社	硬化性オルガノポリシロキサン組成物及び半導体装置
JP2010031149A (ja) *	2008-07-29	2010-02-12	Shin-Etsu Chemical Co Ltd	光半導体素子封止用樹脂組成物
JP4985588B2 (ja) *	2008-08-28	2012-07-25	日立電線株式会社	耐放射線性樹脂組成物、及び耐放射線ケーブル
JP2010241948A (ja) *	2009-04-06	2010-10-28	Shin-Etsu Chemical Co Ltd	放射線硬化性シリコーン組成物
KR101030019B1 (ko)	2009-12-31	2011-04-20	제일모직주식회사	봉지재용 투광성 수지 및 이를 포함하는 전자 소자
CN101851478B (zh) *	2010-04-29	2012-11-21	黄文迎	一种快速固化导电胶粘剂组合物及其制备方法
US8742009B2 (en) *	2010-06-04	2014-06-03	Shin-Etsu Chemical Co., Ltd.	Temporary adhesive composition, and method of producing thin wafer
CN102971383B (zh) *	2010-06-11	2014-11-12	株式会社艾迪科	含硅固化性组合物、该含硅固化性组合物的固化物及由该含硅固化性组合物形成的引线框基板
TWI483995B (zh)	2010-08-18	2015-05-11	第一毛織股份有限公司	聚有機矽氧烷與由該聚有機矽氧烷獲得之封裝材料以及包含該封裝材料之電子元件
JP2015151457A (ja) *	2014-02-14	2015-08-24	住友ベークライト株式会社	液状エポキシ樹脂組成物及び液状エポキシ樹脂成形材料
JP6146376B2 (ja) *	2014-06-18	2017-06-14	信越化学工業株式会社	熱硬化性樹脂組成物及び光半導体封止剤
KR102465006B1 (ko)	2014-12-18	2022-11-10	듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤	경화성 유기폴리실록산 조성물, 이의 경화물, 및 경화 필름의 형성 방법
CN109880561A (zh) *	2017-12-06	2019-06-14	上海本诺电子材料有限公司	一种环氧树脂灌封胶组合物及其制备方法
TWI794401B (zh) *	2018-03-21	2023-03-01	美商陶氏有機矽公司	可室溫固化有機聚矽氧烷組成物及電氣/電子設備
CN113736383B (zh) *	2021-08-26	2022-08-12	深圳市明粤科技有限公司	一种有机硅导热粘接胶膜及其制备方法与应用

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3410820A (en) *	1966-08-01	1968-11-12	Gen Electric	Room temperature vulcanizing compositions
JPS636084A (ja)	1986-06-26	1988-01-12	Nippon Kokan Kk <Nkk>	スラリ−反応器
JPH0297559A (ja)	1988-10-03	1990-04-10	Toshiba Silicone Co Ltd	熱伝導性シリコーン組成物
US5206312A (en) *	1989-11-20	1993-04-27	The Dow Chemical Company	Aromatic hydroxyl-containing compounds containing organosiloxane moieties, epoxy compounds and cured products thereof
MY107113A (en) *	1989-11-22	1995-09-30	Sumitomo Bakelite Co	Epoxy resin composition for semiconductor sealing.
JP2723348B2 (ja) *	1990-03-23	1998-03-09	三菱電機株式会社	半導体封止用エポキシ樹脂組成物
US5319005A (en) *	1992-01-27	1994-06-07	Hitachi Chemical Co., Ltd.	Epoxy resin molding material for sealing of electronic component
JP3221718B2 (ja) *	1992-04-14	2001-10-22	ジーイー東芝シリコーン株式会社	エポキシ変性シリコーン樹脂組成物
JP3367964B2 (ja)	1992-04-21	2003-01-20	東レ・ダウコーニング・シリコーン株式会社	硬化性樹脂組成物
JP3786139B2 (ja)	1992-05-26	2006-06-14	東レ・ダウコーニング株式会社	硬化性シリコーン組成物
JP3251655B2 (ja)	1992-08-05	2002-01-28	東レ・ダウコーニング・シリコーン株式会社	ジオルガノポリシロキサンおよびその製造方法
EP0620242B1 (de) *	1993-04-15	1998-08-19	Dow Corning Toray Silicone Company, Limited	Epoxygruppen enthaltendes Siliconharz und Massen auf seiner Basis
US5952439A (en) *	1993-04-15	1999-09-14	Dow Corning Toray Silicone Co., Ltd.	Epoxy group-containing silicone resin and compositions based thereon
JP3339910B2 (ja) *	1993-04-15	2002-10-28	東レ・ダウコーニング・シリコーン株式会社	硬化性樹脂組成物
JP2812139B2 (ja) *	1993-04-27	1998-10-22	信越化学工業株式会社	エポキシ樹脂組成物
JP2695598B2 (ja)	1993-06-30	1997-12-24	住友ベークライト株式会社	ダイボンディング材
JP3466239B2 (ja)	1993-08-18	2003-11-10	東レ・ダウコーニング・シリコーン株式会社	硬化性樹脂組成物
DE69407137T2 (de)	1993-10-06	1998-04-09	Dow Corning Toray Silicone	Mit Silber gefüllte, elektrisch leitfähige Organosiloxan-Zusammensetzungen
JP3035135B2 (ja)	1993-10-25	2000-04-17	住友ベークライト株式会社	ダイボンディング材
JP3149306B2 (ja) *	1994-03-07	2001-03-26	信越化学工業株式会社	紫外線硬化性組成物
DE4424105A1 (de) *	1994-07-08	1996-01-11	Bayer Ag	Epoxigruppen enthaltende Siloxane und ihre Mischungen mit Polycarbonaten
JPH08113696A (ja) *	1994-10-14	1996-05-07	Toray Dow Corning Silicone Co Ltd	粉体塗料用樹脂組成物
FR2727119B1 (fr) *	1994-11-18	1997-01-03	Rhone Poulenc Chimie	Polyorganosiloxanes fonctionnalises et l'un de leurs procedes de preparation
JP3411164B2 (ja)	1996-10-31	2003-05-26	住友ベークライト株式会社	ダイアタッチペースト
JPH10147764A (ja)	1996-11-20	1998-06-02	Sumitomo Bakelite Co Ltd	ダイアタッチペースト及び半導体装置
US5998509A (en) *	1996-11-29	1999-12-07	Kabushiki Kaisha Toshiba	Resin composition and semiconductor device employing the same
JP3313292B2 (ja)	1996-12-04	2002-08-12	住友ベークライト株式会社	ダイアタッチペースト
US6861482B2 (en) *	1999-05-18	2005-03-01	General Electric Company	Weatherable, thermostable polymers having improved flow composition
US7169859B2 (en) *	1999-05-18	2007-01-30	General Electric Company	Weatherable, thermostable polymers having improved flow composition
JP4646357B2 (ja)	2000-06-08	2011-03-09	東レ・ダウコーニング株式会社	熱伝導性シリコーンゴム組成物
US6709756B2 (en) *	2001-05-21	2004-03-23	Shin-Etsu Chemical Co., Ltd.	Optical device-related adhesive and optical device
JP4948716B2 (ja) *	2001-06-29	2012-06-06	東レ・ダウコーニング株式会社	硬化性エポキシ樹脂組成物
JP3803058B2 (ja)	2001-12-11	2006-08-02	信越化学工業株式会社	熱伝導性シリコーン組成物、その硬化物及び敷設方法並びにそれを用いた半導体装置の放熱構造体
JP4050070B2 (ja) *	2002-02-28	2008-02-20	東レ・ダウコーニング株式会社	シリコーンレジン組成物、硬化性樹脂組成物、および硬化物
TWI345576B (en)	2003-11-07	2011-07-21	Dow Corning Toray Silicone	Curable silicone composition and cured product thereof
JP5004433B2 (ja)	2005-04-27	2012-08-22	東レ・ダウコーニング株式会社	硬化性シリコーン組成物およびその硬化物
JP5285846B2 (ja)	2006-09-11	2013-09-11	東レ・ダウコーニング株式会社	硬化性シリコーン組成物および電子部品

2004
- 2004-10-28 TW TW093132837A patent/TWI345576B/zh not_active IP Right Cessation
- 2004-11-04 WO PCT/JP2004/016716 patent/WO2005044920A1/en not_active Ceased
- 2004-11-04 AT AT04799609T patent/ATE474019T1/de not_active IP Right Cessation
- 2004-11-04 EP EP04799609A patent/EP1689816B1/de not_active Expired - Lifetime
- 2004-11-04 CN CNB2004800322828A patent/CN100413925C/zh not_active Expired - Fee Related
- 2004-11-04 US US10/578,798 patent/US7781522B2/en not_active Expired - Lifetime
- 2004-11-04 DE DE602004028151T patent/DE602004028151D1/de not_active Expired - Lifetime
- 2004-11-04 KR KR1020067011172A patent/KR101147639B1/ko not_active Expired - Fee Related
- 2004-11-05 JP JP2004322805A patent/JP4799848B2/ja not_active Expired - Fee Related

Also Published As

Publication number	Publication date
JP4799848B2 (ja)	2011-10-26
KR101147639B1 (ko)	2012-05-23
JP2005154766A (ja)	2005-06-16
EP1689816A1 (de)	2006-08-16
EP1689816B1 (de)	2010-07-14
TW200530336A (en)	2005-09-16
US7781522B2 (en)	2010-08-24
TWI345576B (en)	2011-07-21
CN100413925C (zh)	2008-08-27
CN1875071A (zh)	2006-12-06
KR20070007255A (ko)	2007-01-15
DE602004028151D1 (de)	2010-08-26
US20070225437A1 (en)	2007-09-27
WO2005044920A1 (en)	2005-05-19

Legal Events

Date	Code	Title	Description
2011-01-15	RER	Ceased as to paragraph 5 lit. 3 law introducing patent treaties

Publication	Publication Date	Title
ATE474019T1 (de)	2010-07-15	Härtbare silikonzusammensetzung und gehärtetes produkt daraus
TW200704713A (en)	2007-02-01	Curable silicone composition and cured product therefrom
ATE441687T1 (de)	2009-09-15	Durch hydrosilylierung gehärtetes silikonharz mit hoher bruchzähigkeit
DE602007002402D1 (de)	2009-10-22	Haftvermittler, härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung
ATE360660T1 (de)	2007-05-15	Feuchtigkeitshärtende organosiloxanzusammensetzung
WO2007100445A3 (en)	2008-04-10	Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
DK1519993T3 (da)	2007-08-06	Stuetemperatur hærdelige organopolysiloxansammensætninger
CO5420206A1 (es)	2004-07-30	Composiciones de epoxi siloxano elastomero modificado
MY148272A (en)	2013-03-29	Curable silicone composition
ATE408649T1 (de)	2008-10-15	Härtbare silikonzusammensetzung und daraus hergestellte elektronische vorrichtung
DE60330469D1 (de)	2010-01-21	Mittel als haftvermittler für gefüllte und peroxidisch zu vernetzende gummicompounds
ATE548431T1 (de)	2012-03-15	Hard-coat-zusammensetzung
TW200734403A (en)	2007-09-16	Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element
TW200636010A (en)	2006-10-16	Silicon-containing curable composition and its cured product
DE602004027251D1 (de)	2010-07-01	Herstellung von 1,3-diphenylprop-2-en-1-onderivaten
BR0116332A (pt)	2004-03-02	Processo para o aumento da estabilidade
BRPI0412188A (pt)	2006-08-22	hidrogéis de silicone tendo concentrações consistentes de polissiloxanos multifuncionais
CO4940376A1 (es)	2000-07-24	Composiciones para el cuidado personal que contienen polime- ros lineales injertados de silicona endurecidos
DE602006003085D1 (de)	2008-11-20	Härtbare silikonzusammensetzung und elektronische komponenten
DE502005003908D1 (de)	2008-06-12	Härtbare zusammensetzungen auf basis von epoxidharzen und 3(4)-(aminomethyl)-cyclohexan-propanamin und 1,4(5)-cyclooctandimethanamin
EP2119425A4 (de)	2013-11-20	Dentale zusammensetzung
DE602004021501D1 (de)	2009-07-23	Gegenüber ionisierender strahlung stabile polyarylestercarbonatzusammensetzungen
BRPI0516363A (pt)	2008-09-02	composição para cuidado dos cabelos e processo para preparação de uma composição
ATE387472T1 (de)	2008-03-15	Metallaminkomplex enthaltende fluorpolymer- zusammensetzungen
ATE409201T1 (de)	2008-10-15	Härtbare silikonzusammensetzung und ihre verwendung als klebstoff