ATE534146T1 - Amorpher oxid-halbleiter und diesen verwendender dünnschichttransistor - Google Patents

Amorpher oxid-halbleiter und diesen verwendender dünnschichttransistor

Info

Publication number
ATE534146T1
ATE534146T1 AT09010057T AT09010057T ATE534146T1 AT E534146 T1 ATE534146 T1 AT E534146T1 AT 09010057 T AT09010057 T AT 09010057T AT 09010057 T AT09010057 T AT 09010057T AT E534146 T1 ATE534146 T1 AT E534146T1
Authority
AT
Austria
Prior art keywords
oxide semiconductor
amorphic
thin film
same
film transistor
Prior art date
Application number
AT09010057T
Other languages
English (en)
Inventor
Ryo Hayashi
Hideyuki Omura
Hideya Kumomi
Yuzo Shigesato
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of ATE534146T1 publication Critical patent/ATE534146T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743—Silicon
    • H10D30/6746—Amorphous silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H10D30/6756—Amorphous oxide semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies

Landscapes

  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
AT09010057T 2008-08-28 2009-08-04 Amorpher oxid-halbleiter und diesen verwendender dünnschichttransistor ATE534146T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008219888 2008-08-28

Publications (1)

Publication Number Publication Date
ATE534146T1 true ATE534146T1 (de) 2011-12-15

Family

ID=41426348

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09010057T ATE534146T1 (de) 2008-08-28 2009-08-04 Amorpher oxid-halbleiter und diesen verwendender dünnschichttransistor

Country Status (6)

Country Link
US (3) US8129718B2 (de)
EP (1) EP2159844B1 (de)
JP (1) JP5725698B2 (de)
KR (1) KR101194255B1 (de)
CN (2) CN101661952B (de)
AT (1) ATE534146T1 (de)

Families Citing this family (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7998372B2 (en) * 2005-11-18 2011-08-16 Idemitsu Kosan Co., Ltd. Semiconductor thin film, method for manufacturing the same, thin film transistor, and active-matrix-driven display panel
JP5305630B2 (ja) 2006-12-05 2013-10-02 キヤノン株式会社 ボトムゲート型薄膜トランジスタの製造方法及び表示装置の製造方法
JP5213422B2 (ja) * 2007-12-04 2013-06-19 キヤノン株式会社 絶縁層を有する酸化物半導体素子およびそれを用いた表示装置
US8945981B2 (en) 2008-07-31 2015-02-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
TWI469354B (zh) 2008-07-31 2015-01-11 半導體能源研究所股份有限公司 半導體裝置及其製造方法
US8129718B2 (en) * 2008-08-28 2012-03-06 Canon Kabushiki Kaisha Amorphous oxide semiconductor and thin film transistor using the same
JP5616012B2 (ja) * 2008-10-24 2014-10-29 株式会社半導体エネルギー研究所 半導体装置の作製方法
WO2010071034A1 (en) 2008-12-19 2010-06-24 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing transistor
KR101064402B1 (ko) * 2009-01-12 2011-09-14 삼성모바일디스플레이주식회사 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를 구비하는 평판 표시 장치
KR102391280B1 (ko) 2009-03-12 2022-04-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
EP2256814B1 (de) 2009-05-29 2019-01-16 Semiconductor Energy Laboratory Co, Ltd. Oxid-Halbleiterbauelement und Verfahren zu seiner Herstellung
KR101944656B1 (ko) * 2009-06-30 2019-04-17 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 제조 방법
KR102458127B1 (ko) 2009-06-30 2022-10-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 제조 방법
KR101810699B1 (ko) * 2009-06-30 2018-01-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 제작 방법
EP2449595B1 (de) 2009-06-30 2017-07-26 Semiconductor Energy Laboratory Co, Ltd. Herstellungsverfahren für halbleiterbauelement
JP5663214B2 (ja) * 2009-07-03 2015-02-04 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR102416978B1 (ko) 2009-07-10 2022-07-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제조 방법
KR101460868B1 (ko) 2009-07-10 2014-11-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
SG10201403913PA (en) 2009-07-10 2014-10-30 Semiconductor Energy Lab Method for manufacturing semiconductor device
WO2011013523A1 (en) 2009-07-31 2011-02-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR101291434B1 (ko) 2009-07-31 2013-08-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 디바이스 및 그 형성 방법
WO2011013502A1 (en) 2009-07-31 2011-02-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
CN105070761B (zh) 2009-07-31 2019-08-20 株式会社半导体能源研究所 显示装置
KR101967480B1 (ko) 2009-07-31 2019-04-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제조 방법
WO2011027701A1 (en) 2009-09-04 2011-03-10 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and method for manufacturing the same
KR101914026B1 (ko) 2009-09-24 2018-11-01 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체막 및 반도체 장치
KR101342343B1 (ko) * 2009-09-24 2013-12-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 소자의 제작 방법
CN113903796B (zh) * 2009-10-16 2026-04-07 株式会社半导体能源研究所 逻辑电路和半导体器件
TWI415794B (zh) * 2009-10-23 2013-11-21 國立清華大學 合成銦鎵鋅氧化物之方法及使用其形成銦鎵鋅氧化物薄膜之方法
EP2494692B1 (de) * 2009-10-30 2016-11-23 Semiconductor Energy Laboratory Co. Ltd. Logikschaltkreis und halbleitervorrichtung
CN103151266B (zh) 2009-11-20 2016-08-03 株式会社半导体能源研究所 用于制造半导体器件的方法
WO2011062057A1 (en) * 2009-11-20 2011-05-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2011068025A1 (en) * 2009-12-04 2011-06-09 Semiconductor Energy Laboratory Co., Ltd. Dc converter circuit and power supply circuit
WO2011070892A1 (en) * 2009-12-08 2011-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR101945171B1 (ko) 2009-12-08 2019-02-07 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101768433B1 (ko) * 2009-12-18 2017-08-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 제작 방법
US8759917B2 (en) * 2010-01-04 2014-06-24 Samsung Electronics Co., Ltd. Thin-film transistor having etch stop multi-layer and method of manufacturing the same
KR101850926B1 (ko) * 2010-04-09 2018-04-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR20130079348A (ko) * 2010-04-22 2013-07-10 이데미쓰 고산 가부시키가이샤 성막 방법
CN106057907B (zh) * 2010-04-23 2019-10-22 株式会社半导体能源研究所 半导体装置的制造方法
KR101877377B1 (ko) 2010-04-23 2018-07-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
WO2011135987A1 (en) * 2010-04-28 2011-11-03 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9202895B2 (en) * 2010-05-07 2015-12-01 Japan Science And Technology Agency Process for production of functional device, process for production of ferroelectric material layer, process for production of field effect transistor, thin film transistor, field effect transistor, and piezoelectric inkjet head
US8906756B2 (en) 2010-05-21 2014-12-09 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2011249674A (ja) * 2010-05-28 2011-12-08 Fujifilm Corp 薄膜トランジスタおよびその製造方法
WO2011162177A1 (ja) * 2010-06-21 2011-12-29 株式会社アルバック 半導体装置、半導体装置を有する液晶表示装置、半導体装置の製造方法
KR101995851B1 (ko) * 2010-07-02 2019-07-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US8785241B2 (en) * 2010-07-16 2014-07-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP2012033836A (ja) 2010-08-03 2012-02-16 Canon Inc トップゲート型薄膜トランジスタ及びこれを備えた表示装置
JP2012064201A (ja) * 2010-08-19 2012-03-29 Semiconductor Energy Lab Co Ltd 入出力装置及び入出力装置の駆動方法
JP5679417B2 (ja) * 2010-08-25 2015-03-04 富士フイルム株式会社 酸化物半導体薄膜の製造方法および該製造方法により作製された酸化物半導体薄膜、薄膜トランジスタ、並びに薄膜トランジスタを備えた装置
JP2012049208A (ja) * 2010-08-25 2012-03-08 Fujifilm Corp 酸化物半導体薄膜、薄膜トランジスタおよび薄膜トランジスタを備えた装置
JP5780902B2 (ja) * 2010-10-12 2015-09-16 出光興産株式会社 半導体薄膜、薄膜トランジスタ及びその製造方法
EP2447999A1 (de) * 2010-10-29 2012-05-02 Applied Materials, Inc. Verfahren zum Ablagern einer Dünnfilmelektrode und Dünnfilmstapel
US8569754B2 (en) 2010-11-05 2013-10-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP5189674B2 (ja) 2010-12-28 2013-04-24 出光興産株式会社 酸化物半導体薄膜層を有する積層構造、積層構造の製造方法、薄膜トランジスタ及び表示装置
JP5186611B2 (ja) * 2010-12-28 2013-04-17 出光興産株式会社 酸化物半導体薄膜層を有する積層構造、積層構造の製造方法、薄膜トランジスタ及び表示装置
TWI624878B (zh) 2011-03-11 2018-05-21 半導體能源研究所股份有限公司 半導體裝置的製造方法
TWI521612B (zh) 2011-03-11 2016-02-11 半導體能源研究所股份有限公司 半導體裝置的製造方法
TWI545652B (zh) 2011-03-25 2016-08-11 半導體能源研究所股份有限公司 半導體裝置及其製造方法
US9219159B2 (en) 2011-03-25 2015-12-22 Semiconductor Energy Laboratory Co., Ltd. Method for forming oxide semiconductor film and method for manufacturing semiconductor device
US9012904B2 (en) * 2011-03-25 2015-04-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8541266B2 (en) 2011-04-01 2013-09-24 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US9478668B2 (en) 2011-04-13 2016-10-25 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device
US8709922B2 (en) * 2011-05-06 2014-04-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9117920B2 (en) * 2011-05-19 2015-08-25 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device using oxide semiconductor
JP5965107B2 (ja) * 2011-06-13 2016-08-03 出光興産株式会社 薄膜トランジスタ
US8901554B2 (en) 2011-06-17 2014-12-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including channel formation region including oxide semiconductor
KR101259000B1 (ko) * 2011-07-08 2013-04-29 단국대학교 산학협력단 박막의 물성을 변화시키는 방법
US9660092B2 (en) 2011-08-31 2017-05-23 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor thin film transistor including oxygen release layer
JP6122275B2 (ja) 2011-11-11 2017-04-26 株式会社半導体エネルギー研究所 表示装置
JP6076038B2 (ja) 2011-11-11 2017-02-08 株式会社半導体エネルギー研究所 表示装置の作製方法
US9082861B2 (en) * 2011-11-11 2015-07-14 Semiconductor Energy Laboratory Co., Ltd. Transistor with oxide semiconductor channel having protective layer
KR102932705B1 (ko) 2012-04-13 2026-02-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR20140071491A (ko) * 2012-06-14 2014-06-11 도쿠리츠교세이호징 붓시쯔 자이료 겐큐키코 박막 트랜지스터, 박막 트랜지스터의 제조방법 및 반도체 장치
US8653516B1 (en) * 2012-08-31 2014-02-18 Eastman Kodak Company High performance thin film transistor
KR101991338B1 (ko) * 2012-09-24 2019-06-20 엘지디스플레이 주식회사 박막트랜지스터 어레이 기판 및 그 제조방법
TWI613813B (zh) 2012-11-16 2018-02-01 半導體能源研究所股份有限公司 半導體裝置
JPWO2014103323A1 (ja) * 2012-12-28 2017-01-12 出光興産株式会社 薄膜電界効果型トランジスタ
US9105658B2 (en) 2013-01-30 2015-08-11 Semiconductor Energy Laboratory Co., Ltd. Method for processing oxide semiconductor layer
US9373711B2 (en) 2013-02-27 2016-06-21 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN104022044B (zh) * 2013-03-01 2017-05-10 北京京东方光电科技有限公司 氧化物薄膜晶体管及其制备方法、阵列基板和显示装置
KR102290247B1 (ko) * 2013-03-14 2021-08-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치와 그 제작 방법
US9153650B2 (en) 2013-03-19 2015-10-06 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor
US9882058B2 (en) * 2013-05-03 2018-01-30 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9356156B2 (en) * 2013-05-24 2016-05-31 Cbrite Inc. Stable high mobility MOTFT and fabrication at low temperature
TWI652822B (zh) 2013-06-19 2019-03-01 日商半導體能源研究所股份有限公司 氧化物半導體膜及其形成方法
TWI608523B (zh) * 2013-07-19 2017-12-11 半導體能源研究所股份有限公司 Oxide semiconductor film, method of manufacturing oxide semiconductor film, and semiconductor device
WO2015125042A1 (en) 2014-02-19 2015-08-27 Semiconductor Energy Laboratory Co., Ltd. Oxide, semiconductor device, module, and electronic device
JP2015158572A (ja) * 2014-02-24 2015-09-03 株式会社Joled 表示装置、電子機器
KR20150136726A (ko) * 2014-05-27 2015-12-08 한양대학교 산학협력단 산화물 반도체 박막 트랜지스터의 제조방법
US20160163869A1 (en) * 2014-12-08 2016-06-09 Semiconductor Energy Laboratory Co., Ltd. Transistor
JP2016134489A (ja) * 2015-01-19 2016-07-25 三菱電機株式会社 酸化物半導体薄膜およびそれを用いた薄膜トランジスタ素子、表示素子
CN105514286B (zh) * 2016-01-08 2019-01-04 中国计量学院 一种基于氟化锂缓冲层的光敏有机场效应管薄膜封装技术
JPWO2017150115A1 (ja) * 2016-02-29 2018-12-27 住友金属鉱山株式会社 酸化物半導体薄膜、酸化物半導体薄膜の製造方法及びそれを用いた薄膜トランジスタ
CN106206745B (zh) * 2016-08-31 2019-12-31 深圳市华星光电技术有限公司 一种高迁移率金属氧化物tft的制作方法
WO2018087787A1 (en) * 2016-11-14 2018-05-17 Alma Mater Studiorum - Universita' Di Bologna Sensitive field effect device and manufacturing method thereof
US11211461B2 (en) * 2018-12-28 2021-12-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and memory device
US12690233B2 (en) 2020-05-29 2026-07-21 Taiwan Semiconductor Manufacturing Company Limited Raised source/drain oxide semiconducting thin film transistor and methods of making the same
CN111628017A (zh) * 2020-06-16 2020-09-04 深圳先进技术研究院 掺杂氢的铟镓锌氧化物膜层、其制备方法及其应用、晶体管及其制备方法
US11984508B2 (en) * 2021-02-24 2024-05-14 Taiwan Semiconductor Manufacturing Company Limited Thin film transistor including a compositionally-modulated active region and methods for forming the same
CN114141708B (zh) * 2021-11-19 2026-03-13 惠州华星光电显示有限公司 晶体管及其制作方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3352118B2 (ja) * 1992-08-25 2002-12-03 キヤノン株式会社 半導体装置及びその製造方法
US6058945A (en) * 1996-05-28 2000-05-09 Canon Kabushiki Kaisha Cleaning methods of porous surface and semiconductor surface
JP3276930B2 (ja) * 1998-11-17 2002-04-22 科学技術振興事業団 トランジスタ及び半導体装置
JP3445187B2 (ja) * 1999-08-03 2003-09-08 キヤノン株式会社 半導体素子の欠陥補償方法
JP2002206168A (ja) * 2000-10-24 2002-07-26 Canon Inc シリコン系薄膜の形成方法、シリコン系半導体層の形成方法及び光起電力素子
US6858308B2 (en) * 2001-03-12 2005-02-22 Canon Kabushiki Kaisha Semiconductor element, and method of forming silicon-based film
JP2003007629A (ja) * 2001-04-03 2003-01-10 Canon Inc シリコン系膜の形成方法、シリコン系膜および半導体素子
JP2004289034A (ja) * 2003-03-25 2004-10-14 Canon Inc 酸化亜鉛膜の処理方法、それを用いた光起電力素子の製造方法
CN1806322A (zh) * 2003-06-20 2006-07-19 夏普株式会社 半导体装置及其制造方法以及电子设备
EP2413366B1 (de) * 2004-03-12 2017-01-11 Japan Science And Technology Agency Schaltelement für LCDs oder organische EL-Anzeigen
US7829444B2 (en) * 2004-11-10 2010-11-09 Canon Kabushiki Kaisha Field effect transistor manufacturing method
JP5126730B2 (ja) * 2004-11-10 2013-01-23 キヤノン株式会社 電界効果型トランジスタの製造方法
JP4767616B2 (ja) * 2005-07-29 2011-09-07 富士フイルム株式会社 半導体デバイスの製造方法及び半導体デバイス
JP4981282B2 (ja) 2005-09-06 2012-07-18 キヤノン株式会社 薄膜トランジスタの製造方法
JP4560502B2 (ja) 2005-09-06 2010-10-13 キヤノン株式会社 電界効果型トランジスタ
JP5037808B2 (ja) * 2005-10-20 2012-10-03 キヤノン株式会社 アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置
JP5099740B2 (ja) 2005-12-19 2012-12-19 財団法人高知県産業振興センター 薄膜トランジスタ
JP5110803B2 (ja) * 2006-03-17 2012-12-26 キヤノン株式会社 酸化物膜をチャネルに用いた電界効果型トランジスタ及びその製造方法
US20070215945A1 (en) * 2006-03-20 2007-09-20 Canon Kabushiki Kaisha Light control device and display
US20080023703A1 (en) * 2006-07-31 2008-01-31 Randy Hoffman System and method for manufacturing a thin-film device
JP5127183B2 (ja) 2006-08-23 2013-01-23 キヤノン株式会社 アモルファス酸化物半導体膜を用いた薄膜トランジスタの製造方法
JP4332545B2 (ja) * 2006-09-15 2009-09-16 キヤノン株式会社 電界効果型トランジスタ及びその製造方法
JP5105842B2 (ja) 2006-12-05 2012-12-26 キヤノン株式会社 酸化物半導体を用いた表示装置及びその製造方法
US8143115B2 (en) 2006-12-05 2012-03-27 Canon Kabushiki Kaisha Method for manufacturing thin film transistor using oxide semiconductor and display apparatus
JP5305630B2 (ja) 2006-12-05 2013-10-02 キヤノン株式会社 ボトムゲート型薄膜トランジスタの製造方法及び表示装置の製造方法
TWI478347B (zh) * 2007-02-09 2015-03-21 出光興產股份有限公司 A thin film transistor, a thin film transistor substrate, and an image display device, and an image display device, and a semiconductor device
JP5354862B2 (ja) 2007-02-19 2013-11-27 キヤノン株式会社 アモルファス絶縁体膜及び薄膜トランジスタ
US8129718B2 (en) * 2008-08-28 2012-03-06 Canon Kabushiki Kaisha Amorphous oxide semiconductor and thin film transistor using the same
US9082857B2 (en) * 2008-09-01 2015-07-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising an oxide semiconductor layer
WO2010071034A1 (en) * 2008-12-19 2010-06-24 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing transistor

Also Published As

Publication number Publication date
US20100051938A1 (en) 2010-03-04
US8129718B2 (en) 2012-03-06
EP2159844B1 (de) 2011-11-16
US20130207106A1 (en) 2013-08-15
CN103077961A (zh) 2013-05-01
US8426243B2 (en) 2013-04-23
CN103077961B (zh) 2016-04-13
US20120115276A1 (en) 2012-05-10
JP5725698B2 (ja) 2015-05-27
CN101661952B (zh) 2013-02-06
CN101661952A (zh) 2010-03-03
KR101194255B1 (ko) 2012-10-29
KR20100026990A (ko) 2010-03-10
JP2010080936A (ja) 2010-04-08
EP2159844A2 (de) 2010-03-03
EP2159844A3 (de) 2010-05-19

Similar Documents

Publication Publication Date Title
EP2159844A3 (de) Amorpher Oxid-Halbleiter und diesen verwendender Dünnschichttransistor
TW200725907A (en) Semiconductor thin film, method for producing same, thin film transistor and active-matrix-driven display panel
TW200731543A (en) Semiconductor film, method for manufacturing the same, and thin film transistor
TW200720253A (en) Electron transport material and organic electroluminescent device using the same
EP2061086A3 (de) Dünnschicht-Feldeffekttransistor und Anzeige unter Benutzung desselben
JP2011258941A5 (de)
ATE503273T1 (de) Oxidhalbleitervorrichtung mit isolierungsschicht und anzeigevorrichtung unter benutzung derselben
SG10201406989QA (en) Semiconductor device
WO2009145581A3 (ko) 산화물 반도체 및 이를 포함하는 박막 트랜지스터
EP2061087A3 (de) Dünnschicht-Feldeffekttransistor und Anzeige unter Benutzung desselben
DE60235679D1 (de) Konjugierte Copolymere aus Dithienothiophen und Vinylen oder Acetylen
MY159871A (en) Semiconductor device
JP2013042143A5 (de)
ATE482467T1 (de) Ätzen von amorphen halbleiteroxiden mit einer alkaliätzlösung
SG130145A1 (en) Source/drain electrodes, transistor substrates and manufacture methods thereof, and display devices
ATE517435T1 (de) Feldeffekttransistor
TW200729509A (en) Semiconductor thin film, the making method and the thin film transistor
TW200617998A (en) Transparentconductive film, process for producing the same, transparent conductive substrate and light-emitting device
GB2461209A (en) A technique for enhancing transistor performance by transistor specific contact design
RU2008122971A (ru) Полевой транзистор
BR112013012728A2 (pt) "fotodetectores de infravermelho com alta detectividade em dispositivo de baixa voltagem."
TW200640013A (en) Thin film transistor panel
BRPI0517560B8 (pt) transistor de efeito de campo
MY157221A (en) Photovoltaic devices including an interfacial layer
MX2010004731A (es) Dispositivos fotovoltaicos que incluyen peliculas semiconductoras impurificadas.