IL175341A - Process for packaging components and packaged components - Google Patents

Process for packaging components and packaged components

Info

Publication number: IL175341A
Authority: IL; Israel
Prior art keywords: connection; contact; base substrate; regions; functional
Prior art date: 2003-12-03

Application number

IL175341A

Other languages

English (en)

Other versions

IL175341A0 (en

Original Assignee

Schott Ag

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2003-12-03

Filing date

2006-05-01

Publication date

2010-06-30

2006-05-01 Application filed by Schott Ag filed Critical Schott Ag

2006-09-05 Publication of IL175341A0 publication Critical patent/IL175341A0/en

2010-06-30 Publication of IL175341A publication Critical patent/IL175341A/en

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P54/00—Cutting or separating of wafers, substrates or parts of devices
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W95/00—Packaging processes not covered by the other groups of this subclass
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/29—Bond pads specially adapted therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/351—Materials of die-attach connectors
- H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/351—Materials of die-attach connectors
- H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
- H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/934—Cross-sectional shape, i.e. in side view

Landscapes

Micromachines (AREA)
Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Dicing (AREA)
Mechanical Treatment Of Semiconductor (AREA)
Packaging Frangible Articles (AREA)
Solid State Image Pick-Up Elements (AREA)
Laminated Bodies (AREA)
Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
Lubricants (AREA)
Fats And Perfumes (AREA)

IL175341A 2003-12-03 2006-05-01 Process for packaging components and packaged components IL175341A (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
DE10356885A DE10356885B4 (de)	2003-12-03	2003-12-03	Verfahren zum Gehäusen von Bauelementen und gehäustes Bauelement
PCT/EP2004/012917 WO2005055310A2 (en)	2003-12-03	2004-11-15	Process for packaging components, and packaged components

Publications (2)

Publication Number	Publication Date
IL175341A0 IL175341A0 (en)	2006-09-05
IL175341A true IL175341A (en)	2010-06-30

Family

ID=34638391

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IL175341A IL175341A (en)	2003-12-03	2006-05-01	Process for packaging components and packaged components

Country Status (10)

Country	Link
US (2)	US7700397B2 (de)
EP (1)	EP1700337B1 (de)
JP (2)	JP5329758B2 (de)
KR (1)	KR20060126636A (de)
CN (1)	CN1890789A (de)
AT (1)	ATE461525T1 (de)
DE (2)	DE10356885B4 (de)
IL (1)	IL175341A (de)
TW (1)	TW200524066A (de)
WO (1)	WO2005055310A2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
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DE10356885B4 (de)	2003-12-03	2005-11-03	Schott Ag	Verfahren zum Gehäusen von Bauelementen und gehäustes Bauelement
US7371676B2 (en) *	2005-04-08	2008-05-13	Micron Technology, Inc.	Method for fabricating semiconductor components with through wire interconnects
US7393770B2 (en)	2005-05-19	2008-07-01	Micron Technology, Inc.	Backside method for fabricating semiconductor components with conductive interconnects
US7307348B2 (en) *	2005-12-07	2007-12-11	Micron Technology, Inc.	Semiconductor components having through wire interconnects (TWI)
US7659612B2 (en)	2006-04-24	2010-02-09	Micron Technology, Inc.	Semiconductor components having encapsulated through wire interconnects (TWI)
US7531443B2 (en) *	2006-12-08	2009-05-12	Micron Technology, Inc.	Method and system for fabricating semiconductor components with through interconnects and back side redistribution conductors
US8178965B2 (en) *	2007-03-14	2012-05-15	Infineon Technologies Ag	Semiconductor module having deflecting conductive layer over a spacer structure
DE102007030284B4 (de) *	2007-06-29	2009-12-31	Schott Ag	Verfahren zum Verpacken von Halbleiter-Bauelementen und verfahrensgemäß hergestelltes Zwischenprodukt
US8580596B2 (en) *	2009-04-10	2013-11-12	Nxp, B.V.	Front end micro cavity
US20100320595A1 (en) *	2009-06-22	2010-12-23	Honeywell International Inc.	Hybrid hermetic interface chip
DE102011018295B4 (de) *	2011-04-20	2021-06-24	Austriamicrosystems Ag	Verfahren zum Schneiden eines Trägers für elektrische Bauelemente
KR101131782B1 (ko)	2011-07-19	2012-03-30	디지털옵틱스 코포레이션 이스트	집적 모듈용 기판
US9768223B2 (en) *	2011-12-21	2017-09-19	Xintec Inc.	Electronics device package and fabrication method thereof
TWI607534B (zh) *	2013-04-19	2017-12-01	精材科技股份有限公司	晶片封裝體及其製造方法
US9070747B2 (en) *	2013-06-27	2015-06-30	Flipchip International Llc	Electroplating using dielectric bridges
MA36343B1 (fr) *	2013-10-14	2016-04-29	Nemotek Technologies	Procédé de métallisation en cuivre destiné à la fabrication d'un circuit intégré en utilisant la technologie wafer level packaging 3d
KR20160090972A (ko) *	2015-01-22	2016-08-02	에스케이하이닉스 주식회사	이미지 센서 패키지 및 제조 방법
DE102015203393A1 (de) *	2015-02-25	2016-08-25	Infineon Technologies Ag	Halbleiterelement und Verfahren zu Herstellen von diesem
US10818625B1 (en) *	2019-06-19	2020-10-27	Nanya Technology Corporation	Electronic device
TWI863679B (zh) *	2023-11-06	2024-11-21	矽品精密工業股份有限公司	基板結構、具有該基板結構之電子封裝件與製法

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JPH06244437A (ja) *	1993-02-17	1994-09-02	Oki Electric Ind Co Ltd	半導体ウエハ
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JP4319251B2 (ja)	1994-11-22	2009-08-26	エヌエックスピービーヴィ	半導体素子を有し導体トラックが形成されている基板が接着層により結合されている支持本体を有する半導体装置
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JP2004349593A (ja)	2003-05-26	2004-12-09	Sanyo Electric Co Ltd	半導体装置及びその製造方法
US6777263B1 (en) *	2003-08-21	2004-08-17	Agilent Technologies, Inc.	Film deposition to enhance sealing yield of microcap wafer-level package with vias
DE10356885B4 (de)	2003-12-03	2005-11-03	Schott Ag	Verfahren zum Gehäusen von Bauelementen und gehäustes Bauelement

2003
- 2003-12-03 DE DE10356885A patent/DE10356885B4/de not_active Expired - Fee Related
2004
- 2004-11-15 KR KR1020067011088A patent/KR20060126636A/ko not_active Ceased
- 2004-11-15 DE DE602004026112T patent/DE602004026112D1/de not_active Expired - Lifetime
- 2004-11-15 CN CNA2004800358730A patent/CN1890789A/zh active Pending
- 2004-11-15 WO PCT/EP2004/012917 patent/WO2005055310A2/en not_active Ceased
- 2004-11-15 JP JP2006541821A patent/JP5329758B2/ja not_active Expired - Fee Related
- 2004-11-15 AT AT04797893T patent/ATE461525T1/de not_active IP Right Cessation
- 2004-11-15 US US10/580,284 patent/US7700397B2/en not_active Expired - Fee Related
- 2004-11-15 EP EP04797893A patent/EP1700337B1/de not_active Expired - Lifetime
- 2004-11-19 TW TW093135653A patent/TW200524066A/zh unknown
2006
- 2006-05-01 IL IL175341A patent/IL175341A/en not_active IP Right Cessation
2010
- 2010-04-02 US US12/753,514 patent/US8309384B2/en not_active Expired - Fee Related
2012
- 2012-04-23 JP JP2012098089A patent/JP2012156551A/ja active Pending

Also Published As

Publication number	Publication date
JP2007513507A (ja)	2007-05-24
DE10356885A1 (de)	2005-07-07
US20100187669A1 (en)	2010-07-29
US8309384B2 (en)	2012-11-13
CN1890789A (zh)	2007-01-03
JP5329758B2 (ja)	2013-10-30
IL175341A0 (en)	2006-09-05
US20080038868A1 (en)	2008-02-14
ATE461525T1 (de)	2010-04-15
KR20060126636A (ko)	2006-12-08
EP1700337A2 (de)	2006-09-13
JP2012156551A (ja)	2012-08-16
WO2005055310A2 (en)	2005-06-16
DE10356885B4 (de)	2005-11-03
EP1700337B1 (de)	2010-03-17
US7700397B2 (en)	2010-04-20
WO2005055310A3 (en)	2005-11-03
TW200524066A (en)	2005-07-16
DE602004026112D1 (de)	2010-04-29

Legal Events

Date	Code	Title	Description
2010-12-30	FF	Patent granted
2011-09-27	MM9K	Patent not in force due to non-payment of renewal fees

Publication	Publication Date	Title
US8309384B2 (en)	2012-11-13	Process for packaging components, and packaged components
US6040235A (en)	2000-03-21	Methods and apparatus for producing integrated circuit devices
JP3516592B2 (ja)	2004-04-05	半導体装置およびその製造方法
US6853067B1 (en)	2005-02-08	Microelectromechanical systems using thermocompression bonding
US5455455A (en)	1995-10-03	Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
KR100851931B1 (ko)	2008-08-12	반도체 패키지용의 개선된 상호접속 구조
WO1998052225A1 (en)	1998-11-19	An electronic component package with posts on the active surface
JPH1050887A (ja)	1998-02-20	半導体パッケージング装置及び方法
KR20000057792A (ko)	2000-09-25	반도체 집적 회로의 제조 방법
US8237256B2 (en)	2012-08-07	Integrated package
US5403729A (en)	1995-04-04	Fabricating a semiconductor with an insulative coating
US6946734B2 (en)	2005-09-20	Integrated passive components and package with posts
CN112864224A (zh)	2021-05-28	具有薄半导体管芯的半导体器件
US6774479B2 (en)	2004-08-10	Electronic device having a semiconductor chip on a semiconductor chip connection plate and a method for producing the electronic device
US6107179A (en)	2000-08-22	Integrated flexible interconnection
WO2006061792A2 (en)	2006-06-15	Hermetically sealed integrated circuit package
US8330260B2 (en)	2012-12-11	Electronic component of VQFN design and method for producing the same
JP2004158739A (ja)	2004-06-03	樹脂封止型半導体装置およびその製造方法
KR100587031B1 (ko)	2006-06-07	웨이퍼 레벨 패키지
US20230096678A1 (en)	2023-03-30	Method of manufacturing semiconductor package
EP0961319A2 (de)	1999-12-01	Integrierte, flexible Verbindung
TWI270152B (en)	2007-01-01	A wafer-level packaging method and a chip packaging structure
JP2001094043A (ja)	2001-04-06	半導体チップ
JPH08222685A (ja)	1996-08-30	マイクロパッケージ構造及びその製造方法
KR101123798B1 (ko)	2012-03-12	웨이퍼 레벨 칩 스케일 패키지의 제조방법