IL95739A - Radiation-polymerizable mixture and process for producing a solder resist mask. - Google Patents

Radiation-polymerizable mixture and process for producing a solder resist mask.

Info

Publication number
IL95739A
IL95739A IL9573990A IL9573990A IL95739A IL 95739 A IL95739 A IL 95739A IL 9573990 A IL9573990 A IL 9573990A IL 9573990 A IL9573990 A IL 9573990A IL 95739 A IL95739 A IL 95739A
Authority
IL
Israel
Prior art keywords
radiation
weight
mixture
methacrylic acid
polymerizable mixture
Prior art date
Application number
IL9573990A
Other languages
English (en)
Other versions
IL95739A0 (en
Original Assignee
Morton Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Morton Int Inc filed Critical Morton Int Inc
Publication of IL95739A0 publication Critical patent/IL95739A0/xx
Publication of IL95739A publication Critical patent/IL95739A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • C08F257/02—Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00 on to polymers of styrene or alkyl-substituted styrenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/136—Coating process making radiation sensitive element

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Dental Preparations (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Reinforced Plastic Materials (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
IL9573990A 1989-09-21 1990-09-19 Radiation-polymerizable mixture and process for producing a solder resist mask. IL95739A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3931467A DE3931467A1 (de) 1989-09-21 1989-09-21 Durch strahlung polymerisierbares gemisch und verfahren zur herstellung einer loetstopmaske

Publications (2)

Publication Number Publication Date
IL95739A0 IL95739A0 (en) 1991-06-30
IL95739A true IL95739A (en) 1995-03-15

Family

ID=6389856

Family Applications (1)

Application Number Title Priority Date Filing Date
IL9573990A IL95739A (en) 1989-09-21 1990-09-19 Radiation-polymerizable mixture and process for producing a solder resist mask.

Country Status (15)

Country Link
US (2) US5264324A (fr)
EP (1) EP0418733B1 (fr)
JP (1) JP2662083B2 (fr)
KR (1) KR0161970B1 (fr)
AT (1) ATE162316T1 (fr)
AU (1) AU633363B2 (fr)
CA (1) CA2025831C (fr)
DE (2) DE3931467A1 (fr)
DK (1) DK0418733T3 (fr)
ES (1) ES2110956T3 (fr)
FI (1) FI904605A7 (fr)
IE (1) IE903402A1 (fr)
IL (1) IL95739A (fr)
NO (1) NO904115L (fr)
ZA (1) ZA907479B (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2706858B2 (ja) * 1991-07-30 1998-01-28 富士写真フイルム株式会社 光重合性組成物
DE4142735A1 (de) * 1991-12-21 1993-06-24 Hoechst Ag Durch strahlung polymerisierbares gemisch und verfahren zur herstellung einer loetstoppmaske
EP0573031A3 (fr) * 1992-06-03 1995-06-14 Nippon Paint Co Ltd Procédé de fabrication des masques structurés pour soudage.
DE4234072A1 (de) * 1992-10-09 1994-04-14 Morton Int Inc Durch Strahlung polymerisierbares Gemisch und Verfahren zur Herstellung einer Lötstoppmaske
DE4316087A1 (de) * 1993-05-13 1994-11-17 Morton Int Inc Verfahren zum bildmäßigen Metallisieren von strukturierten Leiterplatten
DE4336901A1 (de) * 1993-10-28 1995-05-04 Du Pont Deutschland Photopolymerisierbares Gemisch und Verfahren zur Herstellung von Lötstopmasken
US5545510A (en) * 1995-03-28 1996-08-13 Mac Dermid, Inc. Photodefinable dielectric composition useful in the manufacture of printed circuits
US5925499A (en) * 1995-08-01 1999-07-20 Morton International, Inc. Epoxy-containing waterborne photoimageable composition
US5844308A (en) * 1997-08-20 1998-12-01 Cts Corporation Integrated circuit anti-bridging leads design
US5874197A (en) * 1997-09-18 1999-02-23 E. I. Du Pont De Nemours And Company Thermal assisted photosensitive composition and method thereof
US6645696B1 (en) * 2001-11-30 2003-11-11 Euv Llc. Photoimageable composition
DE10204114A1 (de) * 2002-02-01 2003-08-14 Basf Coatings Ag Thermisch und mit aktinischer Strahlung härtbares Stoffgemisch, Verfahren zu seiner Herstellung und seine Verwendung
CN1445248A (zh) * 2002-02-15 2003-10-01 希普雷公司 官能化聚合物
JP4500657B2 (ja) * 2004-11-30 2010-07-14 旭化成イーマテリアルズ株式会社 パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2006208730A (ja) * 2005-01-27 2006-08-10 Fuji Photo Film Co Ltd パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP5661293B2 (ja) * 2010-02-08 2015-01-28 太陽ホールディングス株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
JP5829035B2 (ja) * 2011-03-31 2015-12-09 太陽インキ製造株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
JPWO2012141153A1 (ja) * 2011-04-13 2014-07-28 太陽インキ製造株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
DE102011083791A1 (de) * 2011-09-29 2013-04-04 Robert Bosch Gmbh Verfahren zur Herstellung einer Lötverbindung
TWI541594B (zh) * 2011-09-30 2016-07-11 太陽油墨製造股份有限公司 A photosensitive resin composition, a hardened film thereof, and a printed wiring board
JP2017165846A (ja) * 2016-03-15 2017-09-21 アーゼッド・エレクトロニック・マテリアルズ（ルクセンブルグ）ソシエテ・ア・レスポンサビリテ・リミテ 微細パターン形成用組成物およびそれを用いた微細パターン形成方法

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DE2064080C3 (de) * 1970-12-28 1983-11-03 Hoechst Ag, 6230 Frankfurt Lichtempfindliches Gemisch
US3887450A (en) * 1971-02-04 1975-06-03 Dynachem Corp Photopolymerizable compositions containing polymeric binding agents
US3776729A (en) * 1971-02-22 1973-12-04 Ibm Photosensitive dielectric composition and process of using the same
DE2363806B2 (de) * 1973-12-21 1979-05-17 Hoechst Ag, 6000 Frankfurt Lichtempfindliches Gemisch
ZA757984B (en) * 1974-10-04 1976-12-29 Dynachem Corp Polymers for aqueous processed photoresists
DE2861486D1 (en) * 1977-11-21 1982-02-18 Ciba Geigy Ag Process for the application of soldering masks to printed circuits with through holes for contacting
US4278752A (en) * 1978-09-07 1981-07-14 E. I. Du Pont De Nemours And Company Flame retardant radiation sensitive element
BR8001021A (pt) * 1979-02-26 1980-10-29 Du Pont Material resistente de pelicula seca, rolo ajustado, mascara de solda e processo para a modificacao seletiva de uma superficie
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DE3114931A1 (de) * 1981-04-13 1982-10-28 Hoechst Ag, 6000 Frankfurt Durch strahlung polymerisierbares gemisch und daraus hergestelltes photopolymerisierbares kopiermaterial
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JPH01203424A (ja) * 1988-02-09 1989-08-16 Toagosei Chem Ind Co Ltd 硬化性組成物

Also Published As

Publication number Publication date
JP2662083B2 (ja) 1997-10-08
EP0418733B1 (fr) 1998-01-14
IL95739A0 (en) 1991-06-30
NO904115D0 (no) 1990-09-20
DK0418733T3 (da) 1998-09-07
ATE162316T1 (de) 1998-01-15
KR0161970B1 (ko) 1999-01-15
NO904115L (no) 1991-03-22
JPH03164742A (ja) 1991-07-16
AU6304790A (en) 1991-03-28
US5387486A (en) 1995-02-07
ZA907479B (en) 1991-06-26
FI904605A7 (fi) 1991-03-22
KR910006781A (ko) 1991-04-30
FI904605A0 (fi) 1990-09-19
EP0418733A2 (fr) 1991-03-27
IE903402A1 (en) 1991-04-10
US5264324A (en) 1993-11-23
AU633363B2 (en) 1993-01-28
DE3931467A1 (de) 1991-04-04
DE59010796D1 (de) 1998-02-19
EP0418733A3 (en) 1992-03-04
CA2025831C (fr) 2001-11-20
CA2025831A1 (fr) 1991-03-22
ES2110956T3 (es) 1998-03-01

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