JPH01133734U - - Google Patents
Info
- Publication number
- JPH01133734U JPH01133734U JP1988029385U JP2938588U JPH01133734U JP H01133734 U JPH01133734 U JP H01133734U JP 1988029385 U JP1988029385 U JP 1988029385U JP 2938588 U JP2938588 U JP 2938588U JP H01133734 U JPH01133734 U JP H01133734U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- wire bonding
- substrate
- bonding pads
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の実施例に係る半導体チツプ実
装用基板の平面図、第２図は第１図のＸ―Ｘ線矢
視断面図、第３図は従来の半導体チツプ実装用基
板の平面図、第４図及び第５図は第３図のワイヤ
ボンデイングパツド部の拡大図である。 １，１１；基板、２；半導体チツプ、３，１２
；ワイヤボンデイングパツド、４；半導体チツプ
パツド、５；第１ボンド点、６；第２ボンド点、
７；ワイヤ、８；短辺、９；ステツチ、１０；長
辺、Ｌ；第１ボンド点と第２ボンド点を結ぶ線、
Ｖ，Ｗ；ワイヤが片寄る方向。
装用基板の平面図、第２図は第１図のＸ―Ｘ線矢
視断面図、第３図は従来の半導体チツプ実装用基
板の平面図、第４図及び第５図は第３図のワイヤ
ボンデイングパツド部の拡大図である。 １，１１；基板、２；半導体チツプ、３，１２
；ワイヤボンデイングパツド、４；半導体チツプ
パツド、５；第１ボンド点、６；第２ボンド点、
７；ワイヤ、８；短辺、９；ステツチ、１０；長
辺、Ｌ；第１ボンド点と第２ボンド点を結ぶ線、
Ｖ，Ｗ；ワイヤが片寄る方向。
Claims (1)
- 半導体チツプの実装位置の周囲に矩形のワイヤ
ボンデイングパツドを配設してなる半導体チツプ
実装用基板において、前記各ワイヤボンデイング
パツドは、その長辺が当該パツドとこれに対応す
る半導体チツプのパツドとを結ぶ線と平行となる
ように配置されたことを特徴とする半導体チツプ
実装用基板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988029385U JPH01133734U (ja) | 1988-03-04 | 1988-03-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988029385U JPH01133734U (ja) | 1988-03-04 | 1988-03-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01133734U true JPH01133734U (ja) | 1989-09-12 |
Family
ID=31253552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988029385U Pending JPH01133734U (ja) | 1988-03-04 | 1988-03-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01133734U (ja) |
-
1988
- 1988-03-04 JP JP1988029385U patent/JPH01133734U/ja active Pending