JPH02113339U - - Google Patents

Info

Publication number
JPH02113339U
JPH02113339U JP1989019587U JP1958789U JPH02113339U JP H02113339 U JPH02113339 U JP H02113339U JP 1989019587 U JP1989019587 U JP 1989019587U JP 1958789 U JP1958789 U JP 1958789U JP H02113339 U JPH02113339 U JP H02113339U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
comb
base material
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989019587U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989019587U priority Critical patent/JPH02113339U/ja
Publication of JPH02113339U publication Critical patent/JPH02113339U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例を示す樹脂封止型半導
体装置の要部拡大断面図、第２図は第１図のＢ−
Ｂ線断面矢視図、第３図ａ〜ｃは従来の樹脂封止
型半導体装置の製造工程図、第４図は従来の半導
体装置が内蔵されるＩＣカードの断面図、第５図
は第３図ｃのＡ部拡大断面図である。 １……ガラスエポキシ基材、８……櫛歯状銅箔
エツチング配線パターン。

Claims (1)

  1. 【実用新案登録請求の範囲】 樹脂封止される集積回路カード用のモジユール
    において、 基材の周辺部の樹脂の流れ出しを阻止する方向
    に櫛歯状の配線パターンを配設してなる樹脂封止
    型半導体装置。
JP1989019587U 1989-02-23 1989-02-23 Pending JPH02113339U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989019587U JPH02113339U (ja) 1989-02-23 1989-02-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989019587U JPH02113339U (ja) 1989-02-23 1989-02-23

Publications (1)

Publication Number Publication Date
JPH02113339U true JPH02113339U (ja) 1990-09-11

Family

ID=31235231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989019587U Pending JPH02113339U (ja) 1989-02-23 1989-02-23

Country Status (1)

Country Link
JP (1) JPH02113339U (ja)

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