JPH0226786B2 - - Google Patents

Info

Publication number
JPH0226786B2
JPH0226786B2 JP57068207A JP6820782A JPH0226786B2 JP H0226786 B2 JPH0226786 B2 JP H0226786B2 JP 57068207 A JP57068207 A JP 57068207A JP 6820782 A JP6820782 A JP 6820782A JP H0226786 B2 JPH0226786 B2 JP H0226786B2
Authority
JP
Japan
Prior art keywords
brazing
plated
lead
ceramic substrate
brazed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57068207A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58184747A (ja
Inventor
Hitoshi Tsuji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP57068207A priority Critical patent/JPS58184747A/ja
Publication of JPS58184747A publication Critical patent/JPS58184747A/ja
Publication of JPH0226786B2 publication Critical patent/JPH0226786B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57068207A 1982-04-23 1982-04-23 半導体用リ−ドピンのろう付方法 Granted JPS58184747A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57068207A JPS58184747A (ja) 1982-04-23 1982-04-23 半導体用リ−ドピンのろう付方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57068207A JPS58184747A (ja) 1982-04-23 1982-04-23 半導体用リ−ドピンのろう付方法

Publications (2)

Publication Number Publication Date
JPS58184747A JPS58184747A (ja) 1983-10-28
JPH0226786B2 true JPH0226786B2 (2) 1990-06-12

Family

ID=13367113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57068207A Granted JPS58184747A (ja) 1982-04-23 1982-04-23 半導体用リ−ドピンのろう付方法

Country Status (1)

Country Link
JP (1) JPS58184747A (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2608287B2 (ja) * 1987-06-12 1997-05-07 イビデン 株式会社 黒鉛製治具

Also Published As

Publication number Publication date
JPS58184747A (ja) 1983-10-28

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