JPH02290048A - 積層型半導体の実装方法 - Google Patents

積層型半導体の実装方法

Info

Publication number
JPH02290048A
JPH02290048A JP2013875A JP1387590A JPH02290048A JP H02290048 A JPH02290048 A JP H02290048A JP 2013875 A JP2013875 A JP 2013875A JP 1387590 A JP1387590 A JP 1387590A JP H02290048 A JPH02290048 A JP H02290048A
Authority
JP
Japan
Prior art keywords
leads
stacked
chip
package
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013875A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0514427B2 (de
Inventor
Kenzo Hatada
畑田　賢造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2013875A priority Critical patent/JPH02290048A/ja
Publication of JPH02290048A publication Critical patent/JPH02290048A/ja
Publication of JPH0514427B2 publication Critical patent/JPH0514427B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components

Landscapes

  • Wire Bonding (AREA)
JP2013875A 1989-02-15 1990-01-24 積層型半導体の実装方法 Granted JPH02290048A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013875A JPH02290048A (ja) 1989-02-15 1990-01-24 積層型半導体の実装方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP3682289 1989-02-15
JP1-36822 1989-02-15
JP2013875A JPH02290048A (ja) 1989-02-15 1990-01-24 積層型半導体の実装方法

Publications (2)

Publication Number Publication Date
JPH02290048A true JPH02290048A (ja) 1990-11-29
JPH0514427B2 JPH0514427B2 (de) 1993-02-25

Family

ID=26349731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013875A Granted JPH02290048A (ja) 1989-02-15 1990-01-24 積層型半導体の実装方法

Country Status (1)

Country Link
JP (1) JPH02290048A (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0320051A (ja) * 1989-03-20 1991-01-29 Seiko Epson Corp 半導体装置
JPH0531257U (ja) * 1991-09-30 1993-04-23 船井電機株式会社 半導体の実装構造
US6740981B2 (en) 2000-03-27 2004-05-25 Kabushiki Kaisha, Toshiba Semiconductor device including memory unit and semiconductor module including memory units
US7466577B2 (en) 2005-03-30 2008-12-16 Hitachi, Ltd., Intellectual Property Group Semiconductor storage device having a plurality of stacked memory chips

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6481348A (en) * 1987-09-24 1989-03-27 Hitachi Maxell Manufacture of semiconductor device
JPH01184860A (ja) * 1988-01-13 1989-07-24 Hitachi Maxell Ltd 半導体装置の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6481348A (en) * 1987-09-24 1989-03-27 Hitachi Maxell Manufacture of semiconductor device
JPH01184860A (ja) * 1988-01-13 1989-07-24 Hitachi Maxell Ltd 半導体装置の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0320051A (ja) * 1989-03-20 1991-01-29 Seiko Epson Corp 半導体装置
JPH0531257U (ja) * 1991-09-30 1993-04-23 船井電機株式会社 半導体の実装構造
US6740981B2 (en) 2000-03-27 2004-05-25 Kabushiki Kaisha, Toshiba Semiconductor device including memory unit and semiconductor module including memory units
US7466577B2 (en) 2005-03-30 2008-12-16 Hitachi, Ltd., Intellectual Property Group Semiconductor storage device having a plurality of stacked memory chips

Also Published As

Publication number Publication date
JPH0514427B2 (de) 1993-02-25

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