JPH0514427B2 - - Google Patents

Info

Publication number
JPH0514427B2
JPH0514427B2 JP2013875A JP1387590A JPH0514427B2 JP H0514427 B2 JPH0514427 B2 JP H0514427B2 JP 2013875 A JP2013875 A JP 2013875A JP 1387590 A JP1387590 A JP 1387590A JP H0514427 B2 JPH0514427 B2 JP H0514427B2
Authority
JP
Japan
Prior art keywords
leads
chip
stacked
hole
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013875A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02290048A (ja
Inventor
Kenzo Hatada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2013875A priority Critical patent/JPH02290048A/ja
Publication of JPH02290048A publication Critical patent/JPH02290048A/ja
Publication of JPH0514427B2 publication Critical patent/JPH0514427B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components

Landscapes

  • Wire Bonding (AREA)
JP2013875A 1989-02-15 1990-01-24 積層型半導体の実装方法 Granted JPH02290048A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013875A JPH02290048A (ja) 1989-02-15 1990-01-24 積層型半導体の実装方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP3682289 1989-02-15
JP1-36822 1989-02-15
JP2013875A JPH02290048A (ja) 1989-02-15 1990-01-24 積層型半導体の実装方法

Publications (2)

Publication Number Publication Date
JPH02290048A JPH02290048A (ja) 1990-11-29
JPH0514427B2 true JPH0514427B2 (de) 1993-02-25

Family

ID=26349731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013875A Granted JPH02290048A (ja) 1989-02-15 1990-01-24 積層型半導体の実装方法

Country Status (1)

Country Link
JP (1) JPH02290048A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2855719B2 (ja) * 1989-03-20 1999-02-10 セイコーエプソン株式会社 半導体装置
JP2504969Y2 (ja) * 1991-09-30 1996-07-24 船井電機株式会社 半導体の実装構造
JP3980807B2 (ja) 2000-03-27 2007-09-26 株式会社東芝 半導体装置及び半導体モジュール
JP4309368B2 (ja) 2005-03-30 2009-08-05 エルピーダメモリ株式会社 半導体記憶装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2631665B2 (ja) * 1987-09-24 1997-07-16 日立マクセル株式会社 積層半導体装置の製造方法
JPH01184860A (ja) * 1988-01-13 1989-07-24 Hitachi Maxell Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JPH02290048A (ja) 1990-11-29

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees