JPH0247057U - - Google Patents
Info
- Publication number
- JPH0247057U JPH0247057U JP1988126418U JP12641888U JPH0247057U JP H0247057 U JPH0247057 U JP H0247057U JP 1988126418 U JP1988126418 U JP 1988126418U JP 12641888 U JP12641888 U JP 12641888U JP H0247057 U JPH0247057 U JP H0247057U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- resin
- semiconductor device
- chip
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の斜視図、第２図ａ
〜ｃは第１図の側面図、平面図及び正面図、第３
図ａ〜ｃは従来の樹脂封止型半導体装置の一例の
側面図、平面図及び正面図である。 ２……樹脂封止部、３……放熱フイン兼用リー
ド端子、４……リード端子、５……Ｔｒチツプ、
６……実装基板、７……凹部。
〜ｃは第１図の側面図、平面図及び正面図、第３
図ａ〜ｃは従来の樹脂封止型半導体装置の一例の
側面図、平面図及び正面図である。 ２……樹脂封止部、３……放熱フイン兼用リー
ド端子、４……リード端子、５……Ｔｒチツプ、
６……実装基板、７……凹部。
Claims (1)
- 半導体チツプを搭載するチツプ搭載部とシング
ルインラインのリード端子を有する樹脂封止型半
導体装置において、前記チツプ搭載部が両側に一
体で延在して凹部の先で直角に折曲られる側部を
有し、かつ該側部が前記リード端子の実装基板捜
入方向に対応する先端部で前記リード端子と反対
方向にＬ字型の形状を有することを特徴とする樹
脂封止型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126418U JPH0247057U (ja) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988126418U JPH0247057U (ja) | 1988-09-27 | 1988-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247057U true JPH0247057U (ja) | 1990-03-30 |
Family
ID=31377924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988126418U Pending JPH0247057U (ja) | 1988-09-27 | 1988-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247057U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04117250U (ja) * | 1991-03-29 | 1992-10-20 | スズキ株式会社 | 終減速装置のブリーザ |
-
1988
- 1988-09-27 JP JP1988126418U patent/JPH0247057U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04117250U (ja) * | 1991-03-29 | 1992-10-20 | スズキ株式会社 | 終減速装置のブリーザ |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0247057U (ja) | ||
| JPS60139750U (ja) | ブリスタ−包装 | |
| JPH01176950U (ja) | ||
| JPS6289150U (ja) | ||
| JPS6426848U (ja) | ||
| JPS6439649U (ja) | ||
| JPS59112954U (ja) | 絶縁物封止半導体装置 | |
| JPS59107157U (ja) | ＧａＡｓ半導体装置 | |
| JPS60151143U (ja) | 半導体用リ−ドフレ−ム | |
| JPS59182939U (ja) | ラジエ−タ付き半導体パツケ−ジ | |
| JPS6371546U (ja) | ||
| JPS61171257U (ja) | ||
| JPH01112053U (ja) | ||
| JPH0276844U (ja) | ||
| JPS5834741U (ja) | 樹脂封止型半導体装置 | |
| JPS6232534U (ja) | ||
| JPS58116238U (ja) | トランジスタの放熱板装置 | |
| JPS6371542U (ja) | ||
| JPS6068058U (ja) | 角当て包装具 | |
| JPS61207026U (ja) | ||
| JPH0179847U (ja) | ||
| JPS6176971U (ja) | ||
| JPS5937749U (ja) | 半導体装置用リ−ドフレ−ム | |
| JPH0267657U (ja) | ||
| JPS6236554U (ja) |