JPH0260076B2 - - Google Patents

Info

Publication number
JPH0260076B2
JPH0260076B2 JP59137678A JP13767884A JPH0260076B2 JP H0260076 B2 JPH0260076 B2 JP H0260076B2 JP 59137678 A JP59137678 A JP 59137678A JP 13767884 A JP13767884 A JP 13767884A JP H0260076 B2 JPH0260076 B2 JP H0260076B2
Authority
JP
Japan
Prior art keywords
chip
wafer
adhesive sheet
protective film
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59137678A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6116592A (ja
Inventor
Haruo Tanaka
Hayamizu Fukada
Masahito Mushigami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP59137678A priority Critical patent/JPS6116592A/ja
Publication of JPS6116592A publication Critical patent/JPS6116592A/ja
Publication of JPH0260076B2 publication Critical patent/JPH0260076B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H01S5/0202—Cleaving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S2301/00—Functional characteristics
    • H01S2301/17—Semiconductor lasers comprising special layers
    • H01S2301/176—Specific passivation layers on surfaces other than the emission facet

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Dicing (AREA)
  • Semiconductor Lasers (AREA)
JP59137678A 1984-07-02 1984-07-02 半導体レ−ザのチツプ製造方法 Granted JPS6116592A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59137678A JPS6116592A (ja) 1984-07-02 1984-07-02 半導体レ−ザのチツプ製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59137678A JPS6116592A (ja) 1984-07-02 1984-07-02 半導体レ−ザのチツプ製造方法

Publications (2)

Publication Number Publication Date
JPS6116592A JPS6116592A (ja) 1986-01-24
JPH0260076B2 true JPH0260076B2 (th) 1990-12-14

Family

ID=15204255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59137678A Granted JPS6116592A (ja) 1984-07-02 1984-07-02 半導体レ−ザのチツプ製造方法

Country Status (1)

Country Link
JP (1) JPS6116592A (th)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02272079A (ja) * 1989-08-11 1990-11-06 Toyoda Gosei Co Ltd 接着性組成物
FR2808920B1 (fr) * 2000-05-10 2003-10-03 Gemplus Card Int Procede de protection de puces de circuit integre
JP2007201305A (ja) * 2006-01-30 2007-08-09 Sony Corp 半導体レーザ装置、半導体レーザチップ、および半導体レーザ装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52134387A (en) * 1976-05-06 1977-11-10 Oki Electric Ind Co Ltd Semiconductor laser device
JPS5942996B2 (ja) * 1979-02-16 1984-10-18 三菱電機株式会社 半導体レ−ザの特性測定法
JPS5671952A (en) * 1979-11-16 1981-06-15 Nec Home Electronics Ltd Breaking semiconductor wafer
JPS58125886A (ja) * 1982-01-22 1983-07-27 Hitachi Ltd 半導体装置の製造方法
JPS58138050A (ja) * 1982-02-10 1983-08-16 Sumitomo Electric Ind Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS6116592A (ja) 1986-01-24

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