JPH0260241U - - Google Patents

Info

Publication number
JPH0260241U
JPH0260241U JP1988139435U JP13943588U JPH0260241U JP H0260241 U JPH0260241 U JP H0260241U JP 1988139435 U JP1988139435 U JP 1988139435U JP 13943588 U JP13943588 U JP 13943588U JP H0260241 U JPH0260241 U JP H0260241U
Authority
JP
Japan
Prior art keywords
wire
wire bonding
pattern recognition
terminals
ball forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988139435U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988139435U priority Critical patent/JPH0260241U/ja
Publication of JPH0260241U publication Critical patent/JPH0260241U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図ａ〜ｅは本発明によるワイヤーボンデイ
ング装置の作動順序を示す断面図。第２図は従来
及び本発明のワイヤーボンデイングに共通な、電
気ヒーターを内蔵した支持治具の断面図。第３図
は本発明及び従来技術に共通な、スパークにより
形成された金球の温度の、スパーク終了後の経時
変化を、横軸１８を時間軸、たて軸１９を温度軸
として示す図。第４図は従来方式と本発明による
ワイヤーボンデイング装置を使用して圧着したチ
ツプ上の電極と金球の接着強度を、たて軸２４を
接着強度にとつて比較した図。 １……第１のチツプ、２……電極、３，１０，
１１……端子、４……キヤピラリ、５……テイル
、６……第２のチツプ、７……パターン認識装置
、８，９……第２のチツプ上の電極、１２……ト
ーチ電極、１３……金線、１４……スパーク。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体集積装置の組立加工中に使用されるワイ
    ヤーボンデイング装置において、該装置は少なく
    ともワイヤー先端を溶融させて球状とする為のボ
    ール形成機構と、光学的手段によりボンデイング
    されるべき端子の座標を検出する為のパターン認
    識機構と、半導体素子上の端子と容器内の端子と
    をワイヤーで接続する為の接続機構とを有し、前
    記ボール形成機構は、前記パターン認識機構の作
    動完了後にして、前記接続機構の作動開始前に作
    動するよう構成された事を特徴とするワイヤーボ
    ンデイング装置。
JP1988139435U 1988-10-26 1988-10-26 Pending JPH0260241U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988139435U JPH0260241U (ja) 1988-10-26 1988-10-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988139435U JPH0260241U (ja) 1988-10-26 1988-10-26

Publications (1)

Publication Number Publication Date
JPH0260241U true JPH0260241U (ja) 1990-05-02

Family

ID=31402691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988139435U Pending JPH0260241U (ja) 1988-10-26 1988-10-26

Country Status (1)

Country Link
JP (1) JPH0260241U (ja)

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