JPH02851B2 - - Google Patents
Info
- Publication number
- JPH02851B2 JPH02851B2 JP55145465A JP14546580A JPH02851B2 JP H02851 B2 JPH02851 B2 JP H02851B2 JP 55145465 A JP55145465 A JP 55145465A JP 14546580 A JP14546580 A JP 14546580A JP H02851 B2 JPH02851 B2 JP H02851B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- semiconductor device
- protrusions
- coating
- semiconductor devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55145465A JPS5769746A (en) | 1980-10-17 | 1980-10-17 | Flattening method for wafer for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55145465A JPS5769746A (en) | 1980-10-17 | 1980-10-17 | Flattening method for wafer for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5769746A JPS5769746A (en) | 1982-04-28 |
| JPH02851B2 true JPH02851B2 (de) | 1990-01-09 |
Family
ID=15385861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55145465A Granted JPS5769746A (en) | 1980-10-17 | 1980-10-17 | Flattening method for wafer for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5769746A (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62128516A (ja) * | 1985-11-29 | 1987-06-10 | Shin Etsu Handotai Co Ltd | 半導体ウエ−ハの突起物除去方法 |
-
1980
- 1980-10-17 JP JP55145465A patent/JPS5769746A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5769746A (en) | 1982-04-28 |
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