JPS5769746A - Flattening method for wafer for semiconductor device - Google Patents

Flattening method for wafer for semiconductor device

Info

Publication number
JPS5769746A
JPS5769746A JP55145465A JP14546580A JPS5769746A JP S5769746 A JPS5769746 A JP S5769746A JP 55145465 A JP55145465 A JP 55145465A JP 14546580 A JP14546580 A JP 14546580A JP S5769746 A JPS5769746 A JP S5769746A
Authority
JP
Japan
Prior art keywords
wafer
semiconductor device
reliability
projection
reducing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55145465A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02851B2 (de
Inventor
Kazumasa Shigematsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55145465A priority Critical patent/JPS5769746A/ja
Publication of JPS5769746A publication Critical patent/JPS5769746A/ja
Publication of JPH02851B2 publication Critical patent/JPH02851B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
JP55145465A 1980-10-17 1980-10-17 Flattening method for wafer for semiconductor device Granted JPS5769746A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55145465A JPS5769746A (en) 1980-10-17 1980-10-17 Flattening method for wafer for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55145465A JPS5769746A (en) 1980-10-17 1980-10-17 Flattening method for wafer for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5769746A true JPS5769746A (en) 1982-04-28
JPH02851B2 JPH02851B2 (de) 1990-01-09

Family

ID=15385861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55145465A Granted JPS5769746A (en) 1980-10-17 1980-10-17 Flattening method for wafer for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5769746A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62128516A (ja) * 1985-11-29 1987-06-10 Shin Etsu Handotai Co Ltd 半導体ウエ−ハの突起物除去方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62128516A (ja) * 1985-11-29 1987-06-10 Shin Etsu Handotai Co Ltd 半導体ウエ−ハの突起物除去方法

Also Published As

Publication number Publication date
JPH02851B2 (de) 1990-01-09

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