JPH0267641U - - Google Patents

Info

Publication number
JPH0267641U
JPH0267641U JP1988146077U JP14607788U JPH0267641U JP H0267641 U JPH0267641 U JP H0267641U JP 1988146077 U JP1988146077 U JP 1988146077U JP 14607788 U JP14607788 U JP 14607788U JP H0267641 U JPH0267641 U JP H0267641U
Authority
JP
Japan
Prior art keywords
pad
dummy pad
insulating film
integrated circuit
dummy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988146077U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988146077U priority Critical patent/JPH0267641U/ja
Publication of JPH0267641U publication Critical patent/JPH0267641U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H10W46/603—Formed on wafers or substrates before dicing and remaining on chips after dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の平面図、第２図ａ
及びｂは第１図のＢ部に対応する拡大平面図及び
Ａ−Ａ′線断面図、第３図は従来の集積回路の一
例の平面図、第４図ａ及びｂは第３図のＣ部に対
応する拡大平面図及びＡ−Ａ′線断面図である。 １……ダミーパツド、２……ボンデイングパツ
ド、３……ボンデイングワイヤ、４……凸状Ａｌ
層、５……カバー絶縁膜、７……下層絶縁膜。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体基板の一主面を覆う絶縁膜上に形成され
    ているボンデイングパツドと、該ボンデイングパ
    ツドの位置認識用のダミーパツドとを有する集積
    回路において、前記ダミーパツドの周辺の前記絶
    縁膜上に所定の間隔を置いて取囲む前記ダミーパ
    ツドと同一材質の凸部を設けたことを特徴とする
    集積回路。
JP1988146077U 1988-11-08 1988-11-08 Pending JPH0267641U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988146077U JPH0267641U (ja) 1988-11-08 1988-11-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988146077U JPH0267641U (ja) 1988-11-08 1988-11-08

Publications (1)

Publication Number Publication Date
JPH0267641U true JPH0267641U (ja) 1990-05-22

Family

ID=31415236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988146077U Pending JPH0267641U (ja) 1988-11-08 1988-11-08

Country Status (1)

Country Link
JP (1) JPH0267641U (ja)

Similar Documents

Publication Publication Date Title
JPS6364035U (ja)
JPH01154633U (ja)
JPH022835U (ja)
JPH0178032U (ja)
JPH0173935U (ja)
JPH0436238U (ja)
JPS6320444U (ja)
JPS63185507U (ja)
JPH0183340U (ja)
JPH0180940U (ja)
JPH01135739U (ja)
JPH02106845U (ja)
JPH0310532U (ja)
JPS63128738U (ja)
JPH0273740U (ja)
JPS6232541U (ja)
JPH01162236U (ja)
JPS6260032U (ja)
JPH0165148U (ja)
JPH0270444U (ja)
JPH0477240U (ja)
JPH0420231U (ja)
JPH044767U (ja)
JPH0317657U (ja)
JPS648763U (ja)