JPH03116033U - - Google Patents
Info
- Publication number
- JPH03116033U JPH03116033U JP1990025560U JP2556090U JPH03116033U JP H03116033 U JPH03116033 U JP H03116033U JP 1990025560 U JP1990025560 U JP 1990025560U JP 2556090 U JP2556090 U JP 2556090U JP H03116033 U JPH03116033 U JP H03116033U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit board
- cap
- confirming
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
- H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/321—Structures or relative sizes of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/877—Bump connectors and die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Description
第１図ａは、この考案の一実施例に係る半導体
装置の実装構造を側方より見た図、第１図ｂは、
同半導体装置の実装構造を上方から見た図、第２
図ａ、第２図ｂ及び第２図ｃは、それぞれ順に同
半導体装置の実装構造の実装工程を説明する図、
第３図ａ及び第３図ｂは、それぞれ従来の半導体
装置の実装構造を説明する図である。 １……チツプ、１ａ……パツド、２……バンプ
、３……キヤツプ、３ａ……脚部、４……シリコ
ンゴム、５……接着剤、６……樹脂、Ａ……配線
パターン、Ｂ……回路基板。
装置の実装構造を側方より見た図、第１図ｂは、
同半導体装置の実装構造を上方から見た図、第２
図ａ、第２図ｂ及び第２図ｃは、それぞれ順に同
半導体装置の実装構造の実装工程を説明する図、
第３図ａ及び第３図ｂは、それぞれ従来の半導体
装置の実装構造を説明する図である。 １……チツプ、１ａ……パツド、２……バンプ
、３……キヤツプ、３ａ……脚部、４……シリコ
ンゴム、５……接着剤、６……樹脂、Ａ……配線
パターン、Ｂ……回路基板。
Claims (1)
- 回路基板上に搭載されるチツプと、このチツプ
のパツド上に形成され、前記回路基板上の配線パ
ターンに圧接されるバンプと、前記チツプを覆い
、その脚部が前記回路基板に接着されるキヤツプ
と、このキヤツプに設けられ、前記チツプの背面
を押圧して、前記バンプと配線パターンとの圧接
状態を保持する弾性体と、前記チツプの動作確認
後、このチツプと前記回路基板との間に充填され
る樹脂とよりなる半導体装置の実装構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990025560U JPH03116033U (ja) | 1990-03-13 | 1990-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990025560U JPH03116033U (ja) | 1990-03-13 | 1990-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03116033U true JPH03116033U (ja) | 1991-12-02 |
Family
ID=31528492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990025560U Pending JPH03116033U (ja) | 1990-03-13 | 1990-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03116033U (ja) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01160028A (ja) * | 1987-12-17 | 1989-06-22 | Matsushita Electric Ind Co Ltd | 電極の接続方法 |
| JPH01192125A (ja) * | 1988-01-27 | 1989-08-02 | Sharp Corp | 半導体装置の実装構造 |
-
1990
- 1990-03-13 JP JP1990025560U patent/JPH03116033U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01160028A (ja) * | 1987-12-17 | 1989-06-22 | Matsushita Electric Ind Co Ltd | 電極の接続方法 |
| JPH01192125A (ja) * | 1988-01-27 | 1989-08-02 | Sharp Corp | 半導体装置の実装構造 |