JPH0412637U - - Google Patents

Info

Publication number
JPH0412637U
JPH0412637U JP1990054230U JP5423090U JPH0412637U JP H0412637 U JPH0412637 U JP H0412637U JP 1990054230 U JP1990054230 U JP 1990054230U JP 5423090 U JP5423090 U JP 5423090U JP H0412637 U JPH0412637 U JP H0412637U
Authority
JP
Japan
Prior art keywords
semiconductor device
mounting section
powder
metal base
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990054230U
Other languages
English (en)
Other versions
JP2510585Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990054230U priority Critical patent/JP2510585Y2/ja
Publication of JPH0412637U publication Critical patent/JPH0412637U/ja
Application granted granted Critical
Publication of JP2510585Y2 publication Critical patent/JP2510585Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案にかかる半導体素子収納用パツ
ケージの一実施例を示す断面図、第２図は従来の
半導体素子収納用パツケージの断面図である。 １……金属基体、１ａ……半導体素子載置部、
２……絶縁枠体、４……絶縁被覆層。

Claims (1)

    【実用新案登録請求の範囲】
  1. 銅−タングステン合金から成り、上面中央部に
    半導体素子が載置される載置部を有する金属基体
    上に、該載置部を囲繞するようにして絶縁枠体を
    取着して成る半導体素子収納用パツケージにおい
    て、前記金属基体の少なくもと半導体素子載置部
    表面に３０．０乃至７０．０重量％の非晶質ガラ
    スに３０．０乃至７０．０重量％の酸化アルミニ
    ウム粉末、ステアタイト粉末、スピネル粉末の少
    なくとも１種を含有させて成る絶縁被覆層を被着
    させたことを特徴とする半導体素子収納用パツケ
    ージ。
JP1990054230U 1990-05-24 1990-05-24 半導体素子収納用パッケ―ジ Expired - Lifetime JP2510585Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990054230U JP2510585Y2 (ja) 1990-05-24 1990-05-24 半導体素子収納用パッケ―ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990054230U JP2510585Y2 (ja) 1990-05-24 1990-05-24 半導体素子収納用パッケ―ジ

Publications (2)

Publication Number Publication Date
JPH0412637U true JPH0412637U (ja) 1992-01-31
JP2510585Y2 JP2510585Y2 (ja) 1996-09-11

Family

ID=31576111

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990054230U Expired - Lifetime JP2510585Y2 (ja) 1990-05-24 1990-05-24 半導体素子収納用パッケ―ジ

Country Status (1)

Country Link
JP (1) JP2510585Y2 (ja)

Also Published As

Publication number Publication date
JP2510585Y2 (ja) 1996-09-11

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term